JPS6018554U - 半導体冷却装置 - Google Patents

半導体冷却装置

Info

Publication number
JPS6018554U
JPS6018554U JP1983108920U JP10892083U JPS6018554U JP S6018554 U JPS6018554 U JP S6018554U JP 1983108920 U JP1983108920 U JP 1983108920U JP 10892083 U JP10892083 U JP 10892083U JP S6018554 U JPS6018554 U JP S6018554U
Authority
JP
Japan
Prior art keywords
semiconductor cooling
chip
semiconductor
cooling equipment
rear surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983108920U
Other languages
English (en)
Inventor
圭三 川村
崇弘 大黒
芦分　範行
山田　俊宏
佐藤　元宏
西村　朝雄
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP1983108920U priority Critical patent/JPS6018554U/ja
Publication of JPS6018554U publication Critical patent/JPS6018554U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は、従来の冷却装置の主要部の断面図、第２図は
、本考案の一実施例による冷却装置の主要部の断面図、
第３図は、本考案の実施例におけるパリレン膜厚と接触
部熱抵抗Ｒ６−２との関係を示すグラフである。 １・・・ハウジング、２・・・シリンダ、３・・・ピス
トン、４・・・半導体チップ、５・・・ばね、６・・・
セラミック基板、７・・・冷媒、８・・・冷却水流路、
９・・・ヒートシンク、１０・・・液体金属、１１・・
・膜。 第　１　目 、　　￥Ｊ　２　図　　　　−

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板に半導体チップをフェイスダウン接合し、この半導
    体チップ背面に熱伝導性のスタッドを押□　　し付け、
    チップ背面より冷却する半導体冷却装置において、上記
    スタッドとチップ背面とが接触する上記スタッド面先端
    に高分子膜でコーティングされた熱伝導性の良い流動体
    を付はチップ背面に押し付けることを特徴とする半導体
    冷却装置。
JP1983108920U 1983-07-15 1983-07-15 半導体冷却装置 Pending JPS6018554U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983108920U JPS6018554U (ja) 1983-07-15 1983-07-15 半導体冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983108920U JPS6018554U (ja) 1983-07-15 1983-07-15 半導体冷却装置

Publications (1)

Publication Number Publication Date
JPS6018554U true JPS6018554U (ja) 1985-02-07

Family

ID=30253930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983108920U Pending JPS6018554U (ja) 1983-07-15 1983-07-15 半導体冷却装置

Country Status (1)

Country Link
JP (1) JPS6018554U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6444644U (ja) * 1987-09-10 1989-03-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6444644U (ja) * 1987-09-10 1989-03-16

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