JPS60104241A - Fluorescent x-ray analysis - Google Patents
Fluorescent x-ray analysisInfo
- Publication number
- JPS60104241A JPS60104241A JP21293683A JP21293683A JPS60104241A JP S60104241 A JPS60104241 A JP S60104241A JP 21293683 A JP21293683 A JP 21293683A JP 21293683 A JP21293683 A JP 21293683A JP S60104241 A JPS60104241 A JP S60104241A
- Authority
- JP
- Japan
- Prior art keywords
- fluorescent
- ray
- angle
- detector
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/223—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material by irradiating the sample with X-rays or gamma-rays and by measuring X-ray fluorescence
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/07—Investigating materials by wave or particle radiation secondary emission
- G01N2223/076—X-ray fluorescence
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発ＢＡぽ螢光ＸＩＪＡ強度に基づいてメンキ被膜の膜
厚及び／又は組成を定量する螢光Ｘ線分析方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a fluorescent X-ray analysis method for quantifying the thickness and/or composition of a coating based on the intensity of the BA fluorescent XIJA produced by the present invention.
耐蝕性、溶接性、塗装性、経済性に優れた各種のメッキ
鋼板が製造されているが、耐蝕性、溶接性、塗装性はメ
ッキ被膜の膜厚９組成と密接な関係にあり、品質管理上
、膜厚１組成の正確な測定を欠かすことは出来ない。と
ころでこのようなメッキ被膜の膜厚又は付着量（ｇ／ｒ
ｒｆ）の測定にはメッキ前、後の鋼板重量及び鋼板表面
積とに基づいてめる重量法が、また組成には化学分析法
が採られていた。これらの方法は正確な分析を行えるが
結果を得る迄に時間を要するためメッキ鋼板の製造ライ
ンにおいてメッキ被膜の付着量１組成の制御には適用出
来ない難点がある。このため近年にあっては螢光Ｘ線分
析法が利用されつフある。Various types of plated steel sheets with excellent corrosion resistance, weldability, paintability, and economic efficiency are manufactured, but corrosion resistance, weldability, and paintability are closely related to the coating thickness9 composition of the plating film, and quality control is essential. Moreover, accurate measurement of film thickness and composition is essential. By the way, the film thickness or adhesion amount (g/r
rf) was measured using a gravimetric method based on the weight of the steel sheet before and after plating and the surface area of the steel sheet, and a chemical analysis method was used for measuring the composition. Although these methods allow accurate analysis, they require time to obtain the results, and therefore have the disadvantage that they cannot be applied to control the coating amount and composition of the plating film in the production line of plated steel sheets. For this reason, in recent years, fluorescent X-ray analysis has come into use.
螢光Ｘ線分析法は測定対象物に励起Ｘ線を照射し、これ
によって測定対象物から発生する固有Ｘ線強度、即ち螢
光Ｘ線強度を測定し、予めめておいた検量線から目標元
素の定量を行い、また螢光Ｘ線強度と膜厚との関係に基
づき膜厚をめる方法である。In the fluorescent X-ray analysis method, an object to be measured is irradiated with excited X-rays, thereby measuring the characteristic X-ray intensity generated from the object, that is, the fluorescence This method involves quantifying elements and determining the film thickness based on the relationship between fluorescent X-ray intensity and film thickness.
ところで従来におけ条壁光Ｘ線分析法はいずれも単層メ
ッキ鋼板についての膜厚１組成を定量する方法であって
、例えば経済性及び溶接性等に優れ、自動車車体用の新
素材として注目されているＦｅ −Ｚｎ合金メッキ鋼板
の場合はメッキ被膜がＦｅ、Ｚｎの２成分よりなるので
、ｌ成分のメッキ鋼板における如き螢光Ｘ線強度とメッ
キ被膜厚さとの関係が容品には得られず、またメッキ被
膜成分中に下地金属と同一のＦｅが含まれるために従来
の螢光Ｘ線分析法にてメッキ被膜厚さを測定することは
不可能であり、また組成についての定量も不可能であっ
た。By the way, conventional strip wall optical X-ray analysis methods are all methods for quantifying the film thickness per composition of single-layer plated steel sheets, and are attracting attention as new materials for automobile bodies due to their excellent economic efficiency and weldability. In the case of Fe-Zn alloy plated steel sheets, the plating film consists of two components, Fe and Zn, so the relationship between the fluorescent X-ray intensity and the plating film thickness as in the case of the L-component plated steel sheet is not suitable for the product. Furthermore, since the plating film contains the same Fe as the underlying metal, it is impossible to measure the thickness of the plating film using conventional fluorescent X-ray analysis, and it is also impossible to quantify the composition. It was impossible.
これを解決するために本願出願人は鋼板にＦｅ −Ｚｎ
合金をメッキした単層メッキ鋼板、即ち下地金属とメッ
キ被膜とに共通の元素が含まれているものについてもメ
ッキ被膜の付着量及び組成の分析が可能な螢光Ｘ線分析
法につき既に出願を行っている（特願昭５７−１０５７
０９号）。これは被測定物表面に対して入射角及び取出
角を夫々高角度として測定すると共に、下地金属がらの
螢光Ｘ線強度が検出されないように入射角及び取出角を
夫々低角度として測定することにより分析する方法であ
る。In order to solve this problem, the applicant has added Fe-Zn to the steel plate.
An application has already been filed for a fluorescent X-ray analysis method that can analyze the amount and composition of the plating film on single-layer plated steel sheets plated with an alloy, that is, those in which the base metal and the plating film contain common elements. (Patent application 1987-1057)
No. 09). This is done by setting the incident angle and the take-out angle at a high angle relative to the surface of the object to be measured, and at the same time keeping the incident angle and the take-out angle at a low angle so that the fluorescent X-ray intensity of the underlying metal is not detected. This is a method of analysis.
本発明は更にこの先願の方法を発展させたものである。 The present invention further develops the method of this prior application.
即ち、入射角及び取出角を低角度φ１゜ψ１とする場合
には第１図に示すように励起源４０及び検出器５０が相
当大きいので夫々のＸ線投射口及び螢光Ｘ線検出口はメ
ッキ鋼板１の表面から相当寸法離れた処に位置すること
となり、励起源〜分析点間距離及び分析点〜検出器間距
離を長くする必要があり、このためにレイアウト上の制
約がある。またその距離延長に伴うＸ線強度低下を補足
すべく励起Ｘ線強度を強くして測定する必要がある。本
発明の目的とするところは装置が小型となってレイアウ
ト上の制約が少なく、また励起Ｘ線強度を強くせずとも
測定が可能な螢光Ｘ線分析方法を提供するにある。That is, when the incident angle and extraction angle are set to a low angle φ1°ψ1, the excitation source 40 and detector 50 are quite large as shown in FIG. Since it is located at a considerable distance from the surface of the plated steel plate 1, it is necessary to increase the distance between the excitation source and the analysis point and the distance between the analysis point and the detector, which imposes layout constraints. Furthermore, in order to compensate for the decrease in X-ray intensity that accompanies the distance extension, it is necessary to increase the excitation X-ray intensity during measurement. An object of the present invention is to provide a fluorescent X-ray analysis method that has a compact apparatus, has fewer restrictions on layout, and can perform measurements without increasing the excitation X-ray intensity.
本発明に係る螢光Ｘ線分析方法はメッキした金属板に形
成した下地金属成分を含むメッキ被膜の厚さ及び／又は
組成を螢光Ｘ線分析にて定量する方法において、前記金
属板を曲面を有する案内部材に掛は回し、該案内部材に
掛は回されている金属板部分に対してＸ線を入射し、ま
たそれからの螢光Ｘ線を検出することを特徴とする。The fluorescent X-ray analysis method according to the present invention is a method for quantifying the thickness and/or composition of a plating film containing a base metal component formed on a plated metal plate by fluorescent X-ray analysis. The apparatus is characterized in that the guide member is rotated, the X-rays are incident on the metal plate portion being rotated, and the fluorescent X-rays from the X-rays are detected.
まず本発明方法の分析原理についてメッキ鋼板が平坦な
場合を例にして説明する。第２図は本発明方法の分析原
理説明図であって、下地金属となるＦｅ ＩａＯ上にＦ
ｅ−Ｚｎ１ｂがメッキされているＦｅ−Ｚｎ合金メッキ
鋼板１が平坦な場合に、該Ｆｅ −Ｚｎ合金メッキ鋼板
１に入射角φで励起Ｘ線を入射させ、取出角ψで螢光Ｘ
線を取出してＦｅの螢光Ｘ線強度を測定する。この場合
のＦｅの螢光Ｘ線強度とメッキ被膜中のＦｅの重量濃度
との間には下記（１）式の関係がある。First, the analysis principle of the method of the present invention will be explained using an example in which a plated steel plate is flat. FIG. 2 is an explanatory diagram of the analytical principle of the method of the present invention, in which F
When the Fe-Zn alloy plated steel plate 1 plated with e-Zn1b is flat, excitation X-rays are made incident on the Fe-Zn alloy plated steel plate 1 at an incident angle φ, and the fluorescence
The X-ray intensity of Fe fluorescence is measured. In this case, there is a relationship expressed by the following equation (1) between the fluorescent X-ray intensity of Fe and the weight concentration of Fe in the plating film.
（以下余白）
（以下余白）
但し、
ＩＦｅＫｔｘ：Ｆｅの螢光Ｘ線強度
ｋ ：単位質量の分析元素Ｆｅが励起線を螢光Ｘ線に変
換する割合
Ｉｏ ：励起線の強度
ＷＦｅ ：メッキ被膜中のＦｅ重量濃度ρＦｅ−Ｚｎ
：メッキ被膜厚の密度
ｄ ：メッキ被膜厚さ
φ ：励起線入射角
ψ ：螢光Ｘ線取出角
さて、励起線の入射角φ及び螢光Ｘ線の取出角ψを小さ
くすると上記（１）式は、
Ｉ ＦｅＫα
ｓｉｎ φ
となり、この関係式よりＦｅの螢光Ｘ線強度Ｉ ＦｅＫ
αとメッキ被膜中のＦｅ重量濃度ＷＦｅとは一義対応の
関係にあることが分かる。即ち、下地金属からの螢光Ｘ
線強度が検出されない低角度の入射角φ及び取出角ψに
て螢光Ｘ線強度を測定することにより、Ｆｅの螢光Ｘ線
強度Ｉ ＦｅＫαからメッキ被膜中のＦｅの重量濃度Ｗ
Ｆｅがまる。(Margins below) (Margins below) However, IFeKtx: Fluorescent X-ray intensity of Fe k: Rate at which unit mass of analytical element Fe converts excitation rays into fluorescent X-rays Io: Excitation ray intensity WFe: In plating film Fe weight concentration ρFe-Zn
: Density of plating film thickness d : Plating film thickness φ : Excitation line incident angle ψ : Fluorescent X-ray extraction angle Now, if the excitation line incidence angle φ and the fluorescent X-ray extraction angle ψ are made smaller, the above (1) is obtained. The formula is I FeKα sin φ, and from this relation, the fluorescent X-ray intensity of Fe is I FeK
It can be seen that there is a unique correspondence between α and the Fe weight concentration WFe in the plating film. That is, fluorescent light from the base metal
By measuring the fluorescent X-ray intensity at a low incident angle φ and extraction angle ψ where no line intensity is detected, the weight concentration W of Fe in the plating film can be determined from the fluorescent X-ray intensity I FeKα of Fe.
Fe is round.
次に実験結果に基づき上記関係を明らかにする。Next, the above relationship will be clarified based on experimental results.
実験の供試料としてはｐ ｅ ２＋ 、 ｚ ｎ ２Ｊ
″から構成されているメッキ液中で電気メッキを行った
ものを使用する。測定条件は励起源のＸ線管球としては
Ｗ（タングステン）を用い、励起条件としての管電圧−
管電流は３０ｋＶ −３０ｍＡとし測定時間は１０秒と
した。第３図は目付量が１９〜５３ｇ／ｒｄの範囲で、
低角度の入射角φ＝取出角ψ＝５°の条件にて測定した
Ｆｅ螢光Ｘ線強度Ｉ ＦｅＫα（ｃｐｓ ）を縦軸に、
また化学分析で得られたメッキ被膜中のＦｅの重量濃度
ＷＦｅ（％〕を横軸にとって示したものであってその場
合の検量線も図示している。この図に示されるようにＩ
ＦｅＫαとＷＦｅとは一義対応の関係にあることが実
証された。Samples for the experiment were p e 2+ and z n 2J.
The measurement conditions are as follows: W (tungsten) is used as the excitation source X-ray tube, and the tube voltage is set as the excitation condition.
The tube current was 30 kV - 30 mA, and the measurement time was 10 seconds. Figure 3 shows the basis weight in the range of 19 to 53 g/rd.
Fe fluorescence X-ray intensity I FeKα (cps) measured under the condition of low incident angle φ = extraction angle ψ = 5° is plotted on the vertical axis,
It also shows the weight concentration WFe (%) of Fe in the plating film obtained by chemical analysis on the horizontal axis, and the calibration curve in that case is also shown.
It was demonstrated that FeKα and WFe have a unique correspondence relationship.
これに対して、下地金属からの螢光Ｘ線強度が検出され
る高角度の入射角φで励起線を入射させ取出角ψで螢光
Ｘ線を取出す場合には、上記＋１１式に見られるように
メッキ被膜厚さｄの影響を受けることになる。しかしな
がら、前述のように入射角φを小とする条件でめたＷＦ
ｅを一定とするとＦｅ螢光Ｘ線強度Ｉ ＦｅＫαとメッ
キ被膜厚さｄとの間には一義対応の関係が見られる。第
４図は高角度の入射角φ＝取出角ψ＝６０°の条件にて
測定したＦｅ螢光Ｘ線強度Ｉ ＦｅＫα（ｃｐｓ ）と
化学分析で得られた目付量（ｇ／ｎｆ）との関係をＷＦ
ｅを変数として示したものであって、縦軸にＩ ＦｅＫ
αを、また横軸に目付量をとって示している。この図に
よりＩ ＦｅＫα、ＷＦｅ及びメッキ被膜厚さく目付量
）ｄの間に対応関係があることが解かる。なお第４図に
おいて、０点（実線連結）はＷＦｅが０％（即ちＺｎの
み）、Ｘ点（破線連結）は同じ（５，７〜６．３％、６
点（実線連結）は同じ＜１２．１〜１５．８％、０点（
破線連結）は同じ＜ ３３．５〜３６．７％、Ｘ点（実
線連結）は同じ＜ ４４．０〜４７．５％の試料片につ
いての結果を示している。以上詳述したように、低角度
の螢光Ｘ線測定で得られるＷＰｅを変数として高角度で
螢光Ｘ線強度を測定することにより、該測定値に対応す
る目付量が得られることが分かる。On the other hand, when the excitation line is incident at a high incidence angle φ at which the fluorescent X-ray intensity from the underlying metal is detected, and the fluorescent X-ray is extracted at an extraction angle ψ, the above equation +11 is obtained. As such, it is affected by the plating film thickness d. However, as mentioned above, the WF obtained under the condition that the incident angle φ is small
Assuming that e is constant, there is a unique relationship between the Fe fluorescence X-ray intensity IFeKα and the plating film thickness d. Figure 4 shows the relationship between the Fe fluorescence X-ray intensity I FeKα (cps) measured under the condition of high incidence angle φ = extraction angle ψ = 60° and the basis weight (g/nf) obtained by chemical analysis. WF the relationship
e is shown as a variable, and the vertical axis is I FeK
α is shown, and the basis weight is plotted on the horizontal axis. From this figure, it can be seen that there is a correspondence between I FeKα, WFe, and the plating film thickness and area weight) d. In Fig. 4, the 0 point (solid line connection) indicates that WFe is 0% (i.e. Zn only), and the X point (broken line connection) indicates the same (5, 7 to 6.3%, 6
Points (solid line connection) are the same <12.1-15.8%, 0 points (
The dashed line connection) shows the results for the same < 33.5-36.7%, and the X point (solid line connection) shows the results for the same < 44.0-47.5%. As detailed above, it can be seen that by measuring the fluorescent X-ray intensity at a high angle using WPe obtained by low-angle fluorescent X-ray measurement as a variable, the basis weight corresponding to the measured value can be obtained. .
次に本発明を図面に基づき具体的に説明する。 Next, the present invention will be specifically explained based on the drawings.
第５図は本発明方法の実施状態を示す模式図、第６図は
本発明に用いる螢光Ｘ線分析装置のブロック図である。FIG. 5 is a schematic diagram showing the implementation state of the method of the present invention, and FIG. 6 is a block diagram of a fluorescent X-ray analyzer used in the present invention.
図中１はメッキ鋼板を示しており、メッキ鋼板１は、例
えばルーパ等の前、後に設置されている２本１組のブラ
イドロール２ａ、２ｂに掛け回されて白抜矢符方向に移
送されている。該フ゛ライドロール２ａ、２ｂの軸心は
共に水平であって上下方向及び横方向に適長離隔されて
配されてし）る。In the figure, numeral 1 indicates a plated steel plate, and the plated steel plate 1 is passed around a pair of bride rolls 2a and 2b installed in front and behind a looper, etc., in the direction of the white arrow. ing. The axes of the ferride rolls 2a and 2b are both horizontal and are spaced apart from each other by appropriate lengths in the vertical and lateral directions.
上側ロール２ａが偏位している側の側方には、ロール２
ａの３弱とその凹部内に位置させるようＧこ横向き凹形
状の測定ヘソドノーウジング３が設置されており、凹部
内に臨む上、下部の突出部に番ま夫々低角度用の検出器
５０．励起源４０が内設されており、これら検出器５０
．励起源４０の間で少しロール２ａより遠ざかった位置
には高角度用の検出器５４．励起源４１が内設されてい
る。On the side where the upper roll 2a is deviated, there is a roll 2
A sideways concave shaped measuring head nozzle 3 is installed to be positioned within the concave part of A, and a detector for low angles is placed on the protrusion at the top and bottom facing into the concave part, respectively. 50. An excitation source 40 is installed inside, and these detectors 50
．． A high angle detector 54 is located between the excitation sources 40 and a little further away from the roll 2a. An excitation source 41 is provided inside.
励起源４０．４１夫々はＸ線の照射方向がロール２ａに
掛は回されている箇所のメッキ鋼板１を向くように、ま
た照射方向とメ・ツキ鋼板１の外側表面の入射点での法
線との角度が９０°−φ１，９０°−φ２（φ１〈φ２
）となるように取付けられても）る。The excitation sources 40 and 41 are arranged so that the direction of irradiation of the X-rays faces the plated steel plate 1 at the location where it is being rotated by the roll 2a, and the angle between the irradiation direction and the incident point on the outer surface of the plated steel plate 1 is adjusted. The angle with the line is 90°-φ1, 90°-φ2 (φ1〈φ2
).
即ち励起源４０の入射角はφ１．励起源４１０入射角は
φ２となっている。また検出器５０．５４夫々番よ螢光
Ｘ線を取出す方向と上記外側表面の取出し点での法線と
のなす角度が９０゛−ψ１，９０°−ψ２（ψ１〈ψ２
）となるように取付けられている。That is, the incident angle of the excitation source 40 is φ1. The angle of incidence of the excitation source 410 is φ2. In addition, the angles formed between the direction in which fluorescent X-rays are extracted from the detectors 50 and 54 and the normal line at the extraction point of the outer surface are 90゛-ψ1, 90°-ψ2 (ψ1〈ψ2
).
即ち検出器５０の取出角はψ１．検出器５４の取出角は
ψ２となっている。That is, the extraction angle of the detector 50 is ψ1. The extraction angle of the detector 54 is ψ2.
励起源４０のＸ線は入射角が低角度φ１でメッキ鋼板１
に照射され、メッキ被膜１ｂから取出角ψ１で取出され
た螢光Ｘ線は検出器５０に導かれて電気信号に変換され
る。検出器５０の出力電気信号は測定ヘッドハウジング
外の増幅器５１へ送られて増幅された後に、波高分析器
５２及び計数器５３によってメッキ被膜中の金属の螢光
Ｘ線強度に変換される。The X-rays from the excitation source 40 have a low incident angle φ1 and are applied to the plated steel plate 1.
Fluorescent X-rays are emitted from the plating film 1b at an extraction angle ψ1 and are guided to the detector 50 and converted into electrical signals. The output electrical signal of the detector 50 is sent to an amplifier 51 outside the measurement head housing, where it is amplified and then converted by a pulse height analyzer 52 and a counter 53 into the fluorescent X-ray intensity of the metal in the plating film.
一方、励起源４１のＸ線は入射角が高角度φ２で下地金
属１ａに照射され、下地金属１ａから取出角ψ２で取出
された螢光Ｘ線は、上述の低角度測定の場合と同様に構
成されている検出器５４．増幅器５５゜波高分析器５６
及び計数器５７によって下地金属１ａの螢光Ｘ線強度に
変換される。計数器５３．５７の螢光Ｘ線強度に対応す
る出力は演算器５８に導かれる。On the other hand, the X-rays from the excitation source 41 are irradiated onto the base metal 1a at a high incident angle φ2, and the fluorescent X-rays extracted from the base metal 1a at an extraction angle ψ2 are similar to the case of the low-angle measurement described above. Detector 54 . Amplifier 55° Wave height analyzer 56
The counter 57 converts the intensity into the fluorescent X-ray intensity of the base metal 1a. The outputs of the counters 53 and 57 corresponding to the fluorescence X-ray intensity are led to the calculator 58.
この演算器５８には、第３図に示される如きＩ ＦｅＫ
αとＷＦｅの関係式ＷＦｅ−ｆ （Ｉ ＦｅＫα）及び
第４図で示される如きＩ ＦｅＫα、ＷＦｅ及び目付Ｎ
（厚さ）ｄの関係式ｄ ＝ ｆ （Ｉ ＦｅＫｃｘ、
ＷＦｅ）が予め設定されており、上述の如くして得られ
る螢光Ｘ線強度に対応する重量濃度及び目付量が演算さ
れ表示器５９に表示される。なお、検出器５０．５４と
してはＦｅ及びＺｎの螢光強度が容易に分離測定できる
半導体検出器を用いるのがよい。This arithmetic unit 58 has I FeK as shown in FIG.
The relational expression WFe-f (I FeKα) between α and WFe and I FeKα, WFe, and basis weight N as shown in FIG.
(Thickness) Relational expression d = f (I FeKcx,
WFe) is set in advance, and the weight density and basis weight corresponding to the fluorescent X-ray intensity obtained as described above are calculated and displayed on the display 59. As the detectors 50 and 54, it is preferable to use semiconductor detectors that can easily separate and measure the fluorescence intensities of Fe and Zn.
そして前述の実施例では低角度及び高角度の測定を２組
の励起源及び検出器で測定することとしたが、１組の励
起源、検出器を用い、夫々が或いは一方が測定ヘッドハ
ウジング内を変位できるようにして２回に分けて測定し
てもよい。また、本実施例では下地金属をＦｅとしメッ
キ被膜組成をＦｅ−Ｚｎとしたが、下地金属をＦｅ以外
の金属、例えばＣｕとしメッキ被膜をＣｕを含む組成と
してもよい。In the above embodiment, low angle and high angle measurements were performed using two sets of excitation sources and detectors, but one set of excitation sources and detectors was used, and one or both of them were installed inside the measurement head housing. The measurement may be carried out in two separate steps by making it possible to displace the sensor. Further, in this embodiment, the base metal is Fe and the plating film composition is Fe-Zn, but the base metal may be a metal other than Fe, for example, Cu, and the plating film may have a composition containing Cu.
更に、本発明はメッキ鋼板製造ラインのプライドルロー
ルに限らず、他のロール或いは回転せず、円弧以外のも
の等によりメッキ鋼板が曲げられた部分であれば分析可
能であり、またメッキ鋼板の加工ライン等であっても実
施できることは勿論である。Furthermore, the present invention is not limited to pre-dol rolls on a plated steel plate production line, but can also be used to analyze any part of a plated steel plate that is bent by other rolls or non-rotating objects other than circular arcs, and can also be applied to the processing of plated steel plates. Of course, it can also be carried out on a line or the like.
以上詳述した如く本発明にあってはロール等の曲面にメ
ッキ鋼板を掛は回した部分において測定をするので、励
起源、検出器は分析点における接線に接近した位置に配
することができ、分析点と励起源、検出器との各距離の
短縮が可能となり、このため装置全体を小型にできレイ
アウト上の制約から解放される。また励起Ｘ線強度を強
くする必要もない等本発明は優れた効果を奏する。As detailed above, in the present invention, since the measurement is carried out at the part where the plated steel plate is hung on the curved surface of the roll etc., the excitation source and the detector can be placed close to the tangent line at the analysis point. , it is possible to shorten the distances between the analysis point, the excitation source, and the detector, which allows the entire device to be made smaller and free from layout constraints. Further, the present invention has excellent effects such as no need to increase the excitation X-ray intensity.
第１図は先願の螢光Ｘ線分析装置のレイアウトを示す模
式図、第２図は本発明の詳細な説明図であり、第３図は
Ｉ ＦｅＫ ａ −ＷＦｅ、第４図はＷＦｅを変数とし
たＩ ＦｅＫα−目付量の相関関係を夫々示すグラフで
あり、第５図は本発明方法の実施状態を示す模式図、第
６図は本発明に用いる螢光Ｘ線分析装置のブロック図で
ある。
１・・・メッキ鋼板 １ａ・・・下地金属 １ｂ・・・
メッキ被１＊ ４０，４１・・・励起源 ５０．５４・
・・検出器代理人 弁理士 河 野 登 夫
ｋ。
準 １１￥１
′）−７
ｔｌ イ寸 ＩＣ’Ｊ７庁。２．〕
第 ４ 口
第 υ 図FIG. 1 is a schematic diagram showing the layout of the fluorescent X-ray analyzer of the prior application, FIG. 2 is a detailed explanatory diagram of the present invention, FIG. 3 is a diagram showing I FeK a -WFe, and FIG. These are graphs showing the correlation between I FeKα and the basis weight as variables, FIG. 5 is a schematic diagram showing the implementation state of the method of the present invention, and FIG. 6 is a block diagram of the fluorescent X-ray analyzer used in the present invention. It is. 1... Plated steel plate 1a... Base metal 1b...
Plated 1* 40, 41... Excitation source 50.54.
...detector agent and patent attorney Noboru Konok. Quasi 11 yen 1')-7 tl i size IC'J7 office. 2. 〕 4th part υ figure
Claims (1)
メッキ被膜の厚さ及び／又は組成を螢光Ｘ線分析にて定
量する方法において、前記金属板を曲面を有する案内部
材に掛は回し、該案内部材に９１け回されている金属板
部分に対してＸ線を入射し、またそれからの螢光Ｘ線を
検出することを特徴とする螢光ｘ＃Ｉ！分析方法。 ２、Ｘ線の入射方向及び螢光Ｘ線の検出方向が前記金属
板部分の法線よりも接線に近い方向である特許請求の範
囲第１項記載の螢光Ｘ線分析方法。[Scope of Claims] 1. In a method for quantifying the thickness and/or composition of a plating film containing a base metal component formed on a scratched metal plate by fluorescent X-ray analysis, the metal plate is attached to a guide having a curved surface. Fluorescence x#I! is characterized in that a member is rotated, X-rays are incident on a metal plate portion that is rotated 91 times on the guide member, and fluorescent X-rays are detected from the X-rays. Analysis method. 2. The fluorescent X-ray analysis method according to claim 1, wherein the incident direction of the X-rays and the detection direction of the fluorescent X-rays are closer to a tangent than a normal to the metal plate portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21293683A JPS60104241A (en) | 1983-11-11 | 1983-11-11 | Fluorescent x-ray analysis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21293683A JPS60104241A (en) | 1983-11-11 | 1983-11-11 | Fluorescent x-ray analysis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60104241A true JPS60104241A (en) | 1985-06-08 |
Family
ID=16630743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21293683A Pending JPS60104241A (en) | 1983-11-11 | 1983-11-11 | Fluorescent x-ray analysis |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60104241A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0210144A (en) * | 1988-06-28 | 1990-01-12 | Kawasaki Steel Corp | Method for measuring simultaneously thickness and composition of film |
| JP2013167584A (en) * | 2012-02-16 | 2013-08-29 | Hiroshima Univ | Specific surface area measurement method and device for thin-film sample |
-
1983
- 1983-11-11 JP JP21293683A patent/JPS60104241A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0210144A (en) * | 1988-06-28 | 1990-01-12 | Kawasaki Steel Corp | Method for measuring simultaneously thickness and composition of film |
| JPH0739987B2 (en) * | 1988-06-28 | 1995-05-01 | 川崎製鉄株式会社 | Simultaneous measurement of film thickness and composition |
| JP2013167584A (en) * | 2012-02-16 | 2013-08-29 | Hiroshima Univ | Specific surface area measurement method and device for thin-film sample |
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