JPS596210B2 - Manufacturing method of electroforming mold for slush molding - Google Patents

Manufacturing method of electroforming mold for slush molding

Info

Publication number
JPS596210B2
JPS596210B2 JP52046641A JP4664177A JPS596210B2 JP S596210 B2 JPS596210 B2 JP S596210B2 JP 52046641 A JP52046641 A JP 52046641A JP 4664177 A JP4664177 A JP 4664177A JP S596210 B2 JPS596210 B2 JP S596210B2
Authority
JP
Japan
Prior art keywords
mold
electroforming
matrix
metal
metal body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52046641A
Other languages
Japanese (ja)
Other versions
JPS53130765A (en
Inventor
紘 多田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MoonStar Co
Original Assignee
Moon Star Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Moon Star Chemical Corp filed Critical Moon Star Chemical Corp
Priority to JP52046641A priority Critical patent/JPS596210B2/en
Publication of JPS53130765A publication Critical patent/JPS53130765A/en
Publication of JPS596210B2 publication Critical patent/JPS596210B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Description

【発明の詳細な説明】 本発明は、スラッシュ成形用電鋳モールドの製造法に関
する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an electroforming mold for slush molding.

スラッシュ成形法によつて得られた製品は、人形部品、
玩具、帽子カバー、靴等のように広範囲にわたつている
が、とりわけ、ポリ塩化ビニルプラスチゾルを使用した
靴が最も多く製造されている。
Products obtained by the slush molding method include doll parts,
Polyvinyl chloride plastisol is used in a wide variety of products, including toys, hat covers, shoes, etc., but shoes using polyvinyl chloride plastisol are the most widely manufactured.

一般に、ポリ塩化ビニルプラスチゾルによるスラッシュ
成形靴は、製品となるべき形状を有する実際の革靴を作
成し、これを電鋳モールド作成用の母型とし、この母型
表面に銀を沈着したり、カーボン粉末を塗着したりして
形成された導電体を陰電極とし、ニッケルや銅を陽電極
として電鋳し、母型表面を精密に写しとつたモールドを
用いるので、革靴のしぼ、模様、縫目等と同じ外観を自
在に現出でき、独得のしなやかさ、感触等を与えること
ができるため広く履用されている。
Generally, slush-molded shoes using polyvinyl chloride plastisol are made by creating actual leather shoes with the desired shape as a product, and using this as a matrix for making electroforming molds.Silver is deposited on the surface of this matrix, carbon is A conductive material formed by applying powder is used as the negative electrode, and nickel or copper is electroformed as the positive electrode, and a mold that precisely copies the mother mold surface is used, so the grains, patterns, and stitching of leather shoes can be easily seen. It is widely used because it can freely create the same appearance as the eyes, and it can give a unique suppleness and feel.

また、これらの靴は一体成形のため貼合せ加工を要せず
、従来の貼合せ加工を施した靴のように縫目からの剥離
は考えられず、そのため剥離間隙から水や油の浸透もな
く、加うるにポリ塩化ビニル特有の耐薬品性、耐油性等
も有するすぐれた機能の靴を製造しうる。上記のように
ポリ塩化ビニルプラスチゾルによるスラッシュ成形靴は
すぐれた性質を数多く有するが、さらにデザインと履用
感を向上させるために厚い踵部が設けられている。
In addition, these shoes are integrally molded and do not require lamination, so there is no chance of them peeling off from the seams like with conventional laminated shoes, and water and oil will not penetrate through the gaps between the peels. In addition, it is possible to manufacture shoes with excellent functionality, which also has chemical resistance, oil resistance, etc., which are unique to polyvinyl chloride. Although slush molded shoes made of polyvinyl chloride plastisol have many excellent properties as described above, they are also provided with a thick heel portion to improve design and comfort.

踵部を厚くするためには現在次のような方法が採用され
ている。
The following methods are currently used to thicken the heel.

そのうちの一つの方法は、ポリ塩化ビニルプラスチゾル
を加熱した靴モールドに充満し、靴モールド内壁に1〜
3nの半ゲル化層を付着させ未ゲル化ポリ塩化ビニルプ
ラスチゾルを排出し、次いで踵部空間にポリ塩化ビニル
プラスチゾル又は熱硬化性可塑剤を混合したポリ塩化ビ
ニルプラスチゾル等の填料を注入しゲル化させ数値の厚
さとする方法であり、他の一つの方法は踵部のない靴モ
ールドを使用して胴部と底部を有する靴本体を成形し、
予じめ別工程で成形された踵部を貼着する方法である。
し力化前者の方法によつて踵部の厚い靴を製造すると、
踵部にポリ塩化ビニルプラスチゾルを使用した場合はゲ
ル化のために長時間を要し、熱硬化性可塑剤を混合した
ポリ塩化ビニルプラスチゾルを使用した場合には材料費
が高価になる欠点があり、後者の方法によつて靴を製造
すると工程が複雑になる欠点があつた。
One method is to fill a heated shoe mold with polyvinyl chloride plastisol and apply 1 to 30% on the inner wall of the shoe mold.
A semi-gelled layer of 3N is attached and the ungelled polyvinyl chloride plastisol is discharged, and then a filler such as polyvinyl chloride plastisol or polyvinyl chloride plastisol mixed with a thermosetting plasticizer is injected into the heel space and gelled. Another method is to use a shoe mold without a heel to form a shoe body with a torso and a sole,
This method involves attaching a heel part that has been previously formed in a separate process.
When manufacturing shoes with thick heel parts by the former method,
When polyvinyl chloride plastisol is used for the heel, it takes a long time to gel, and when polyvinyl chloride plastisol mixed with a thermosetting plasticizer is used, the material cost is high. However, manufacturing shoes using the latter method had the disadvantage of complicating the process.

その上何れの方法においても厚い踵部のために全体が重
くなる欠点を併せ有していた。このような欠点は、製品
の踵部にぬすみ部を設けることによつて解決するが、ぬ
すみ部即ち凹陥部のある母型を使用して電鋳モールドを
製造するとき、電鋳工程において、金属イオンは電極の
凸部に電着し易く、凹部があるときはその入口部分に電
着した金属の厚みが増して行き、凹部の入口を狭ばめる
状態となるために、電鋳浴液の凹部への拡散供給が不充
分となり、凹部に充分金属が電着せず、従来良好なモー
ルドが得られなかつたために欠点の解決が難かしかつた
Furthermore, both methods have the drawback that the thick heel portion makes the entire shoe heavy. These drawbacks can be solved by providing a hollow part in the heel of the product, but when manufacturing an electroforming mold using a master mold with a hollow part, that is, a concave part, metal is removed during the electroforming process. Ions are easy to electrodeposit on the convex parts of the electrode, and when there is a concave part, the thickness of the electrodeposited metal at the entrance increases, narrowing the entrance of the concave part, so the electroforming bath liquid The diffusion and supply to the concave portions was insufficient, and the metal was not sufficiently electrodeposited in the concave portions, making it difficult to obtain a good mold in the past, making it difficult to solve the problem.

本発明は、簡単な方法によつて凹陥部を有する母型から
良好なスラツシユ成形用電鋳モールドを製造する方法を
提供し、もつて、上記のような加工上の欠点を解決しよ
うとするものである。
The present invention provides a method for manufacturing a good electroforming mold for slush forming from a mother mold having a concave portion by a simple method, thereby solving the above-mentioned processing disadvantages. It is.

本発明は、母型の表面に形成した銀膜等の導電体を陰電
極として母型上に陽電極の金属を電鋳した後、母型を除
去する公知のスラツシユ成形用電鋳モールドの製造法に
おいて、横断面面積が深さの6倍以下の数値の柱形状の
凹陥部4を1または2以上形成した母型1を用い、母型
1の凹陥部4を充填する形状の金属体5の全表面を電鋳
モールドの最内面を形成する金属と同種の金属でメツキ
し該金属体5を母型1の凹陥部4に取り外し自在に嵌合
装填し、母型表面の導電体とともに金属体5の開放面を
も陰電極とし、母型表面と金属体5の開放面に陽電極の
金属を電着することによつて金属体5を一体に固着して
なることを特徴とする構成からなる。母型の凹陥部4は
、本発明のモールドによつて製造される製品の厚肉相応
部に設け、この製品肉厚をぬすむ程度の深さをもつ柱形
状でこの厚肉部がプロツク化しない程度の個数を配置す
る。
The present invention manufactures a known electroforming mold for slush forming, in which a conductive material such as a silver film formed on the surface of a matrix is used as a negative electrode, and a positive electrode metal is electroformed onto the matrix, and then the matrix is removed. In the method, a metal body 5 shaped to fill the recesses 4 of the mother mold 1 is used, using a matrix 1 in which one or more column-shaped recesses 4 with a cross-sectional area of 6 times the depth or less are formed. The entire surface of the metal body 5 is plated with the same kind of metal as the metal that forms the innermost surface of the electroforming mold, and the metal body 5 is removably fitted and loaded into the recess 4 of the mother mold 1, and the metal body 5 is plated with the same kind of metal as the metal that forms the innermost surface of the electroforming mold. A structure characterized in that the open surface of the metal body 5 is also used as a negative electrode, and the metal body 5 is fixed integrally by electrodepositing a positive electrode metal on the surface of the matrix and the open surface of the metal body 5. Consisting of The concave portion 4 of the mother mold is provided in a thick-walled portion of the product manufactured by the mold of the present invention, and has a columnar shape with a depth sufficient to penetrate the product wall thickness so that this thick-walled portion does not become a block. Arrange the same number of pieces.

柱形状の凹陥部4の横断面面積が深さに比してかなり大
きいときは、電鋳時に電鋳浴液の凹陥部内への拡散供給
に問題はないが、横断面面積の数値が深さの数値の6倍
以下になると電鋳浴液の凹陥部内への拡散供給が不充分
となる。本発明は、このような凹陥部を有する母型から
電鋳モールドを製造するのに有用である。金属体5は、
その表面を電鋳モールドの最内面と同種の金属でメツキ
されており、母型の凹陥部に丁度嵌合装填され原則とし
て開放面が母型表面とほゾ同一面上にあるが、若干面上
に出ていても又は若干下つていても、僅かであれば電鋳
時の金属イオンの電着に支障はない。
If the cross-sectional area of the column-shaped concave portion 4 is considerably larger than the depth, there will be no problem with the diffusion and supply of the electroforming bath liquid into the concave portion during electroforming. If the value is less than 6 times, the electroforming bath liquid will not be sufficiently diffused and supplied into the recessed portion. The present invention is useful for manufacturing an electroforming mold from a master mold having such a concave portion. The metal body 5 is
Its surface is plated with the same kind of metal as the innermost surface of the electroforming mold, and it is fitted and loaded exactly into the concave part of the mother mold, so that in principle the open surface is on the same plane as the mother mold surface, but it is slightly uneven. Even if it protrudes upward or slightly downward, as long as it is slight, it will not impede electrodeposition of metal ions during electroforming.

母型表面は、表面上で銀鏡反応を行わせて表面に銀を沈
着させる等の方法で表面に導電体を形成させる。このと
き金属体5の表面と母型表面の導電体が連続的に接触し
て互に通電可能となるのが普通である。従つて母型表面
の導電体を陰電極とすれば、金属体5も陰電極となる。
母型表面の導電体及び金属体5を陰電極とし、電鋳浴中
で陽電極の金属を母型表面上及び金属体5の開放面上に
電着せしめ、電鋳する。金属体5の表面は電鋳モールド
の最内面を形成する金属と同種の金属でメツキされてい
るため、金属体5の開放面は電鋳時に同種の金属イオン
を電着して一体に固着されて電鋳モールドの一部分を形
成するものとなる。電鋳時には陽電極の金属の電着を不
充分とする凹陥部が母型にないので、電鋳は良好に行わ
れる。電鋳終了後母型を除去すると、金属体5は母型か
ら取り外されて電鋳モールド内部に突起となつてモール
ドと一体化されている。実施例 ブーツをスラツシユ成形するために使用するモールドの
製造法について説明する〇第1図に示すように踵部2接
地面3に直径8m11L深さ10m71Lの円孔を凹陥
部4として有する革ブーツの電鋳用の母型1とする。
A conductor is formed on the surface of the matrix by a method such as causing a silver mirror reaction on the surface to deposit silver on the surface. At this time, it is normal that the surface of the metal body 5 and the conductor on the surface of the matrix are in continuous contact and can conduct electricity with each other. Therefore, if the conductor on the surface of the matrix is used as a negative electrode, the metal body 5 also becomes a negative electrode.
The conductor on the surface of the matrix and the metal body 5 are used as negative electrodes, and the metal of the positive electrode is electrodeposited on the surface of the matrix and the open surface of the metal body 5 in an electroforming bath, and electroformed. Since the surface of the metal body 5 is plated with the same type of metal as the metal forming the innermost surface of the electroforming mold, the open surface of the metal body 5 is fixed together by electrodepositing the same type of metal ions during electroforming. This will form part of the electroforming mold. During electroforming, there are no recesses in the matrix that would cause insufficient electrodeposition of the metal of the positive electrode, so electroforming is performed well. When the mother mold is removed after electroforming is completed, the metal body 5 is removed from the mother mold and becomes a protrusion inside the electroforming mold and is integrated with the mold. EXAMPLE A manufacturing method of a mold used for slush molding boots will be explained. As shown in FIG. Let it be the mother mold 1 for electroforming.

それぞれの凹陥部4に第2図に示すような表面をニツケ
ルメツキした直径87It7!L、長さ10m1Lの銅
円柱からなる金属体5を嵌合する。このとき円柱の一底
面6が母型表面とほマ同一面で表面に現出している。第
3図に示すように、母型内7にワツクスを充満させ電鋳
を行う浴内での水圧に耐えうるようにし表面8特に縫目
15を防水処理し、さらに界面活性剤で表面8を親水化
する。
Each concave portion 4 has a nickel-plated surface as shown in FIG. 2 and has a diameter of 87It7! L, a metal body 5 made of a copper cylinder with a length of 10 m1L is fitted. At this time, one bottom surface 6 of the cylinder is exposed on the surface almost flush with the surface of the matrix. As shown in Fig. 3, the inside of the matrix 7 is filled with wax to withstand the water pressure in the electroforming bath, the surface 8, especially the seams 15, is waterproofed, and the surface 8 is further coated with a surfactant. Becomes hydrophilic.

次いで表面8を導電性にするために、双頭スプレーガン
により硝酸銀溶液とぶどう糖溶液を同時にスプレーし銀
鏡反応により硝酸銀を還元し母型1の表面8に銀膜をつ
くる。この母型1をスルフアミン酸ニツケル浴の陰極に
取り付け、陽極はニツケル板とし、0.5Vの電圧で4
0〜48時間電鋳を行い約0.3m7!Lのニツケル層
を母型表面に付着させ浴から引き上げる。
Next, in order to make the surface 8 conductive, a silver nitrate solution and a glucose solution are simultaneously sprayed using a double-headed spray gun, and the silver nitrate is reduced by a silver mirror reaction to form a silver film on the surface 8 of the matrix 1. This matrix 1 was attached to the cathode of a nickel sulfamic acid bath, the anode was a nickel plate, and a voltage of 0.5V was applied to
Approximately 0.3m7 after electroforming for 0 to 48 hours! A nickel layer of L is deposited on the surface of the mold and removed from the bath.

ニツケル電鋳の終わつた上記母型を硫酸銅浴の陰極に取
り付け、陽極は電気銅とし、2の電圧で20〜24時間
電鋳を行い約0.7m1Lの銅層を付着させる。電鋳に
使用した母型内7のワツクスを溶出し、母型1を取り出
し、第4図、第5図に示すようなニツケル層9、銅層1
0よりなり空窩部11の踵部表面12に突起13を有す
るスラツシユ成形用ブーツモールド14を得た。尚、本
実施例で得た上記スラツシユ成形用ブーツモールド14
を使用し、ポリ塩化ビニルプラスチゾルでスラツシユ成
形法により踵部の厚いブーツを製造したが、踵部にはぬ
すみが形成されているために、踵部の低い靴と同程度の
工程時間で軽くて履用感の良好なブーツを製造すること
ができた。
The mother mold after nickel electroforming is attached to the cathode of a copper sulfate bath, the anode is electrolytic copper, and electroforming is carried out for 20 to 24 hours at a voltage of 2 to deposit a copper layer of about 0.7 ml. The wax in the mother mold 7 used for electroforming is eluted, the mother mold 1 is taken out, and a nickel layer 9 and a copper layer 1 are formed as shown in FIGS. 4 and 5.
A boot mold 14 for forming a slush having a protrusion 13 on the heel surface 12 of the cavity 11 was obtained. Incidentally, the boot mold 14 for slush molding obtained in this example
boots with a thick heel were manufactured using polyvinyl chloride plastisol using the slush molding method, but because the heel had a slush, it was possible to create boots that were lightweight and took about the same process time as shoes with a low heel. It was possible to manufacture boots that were comfortable to wear.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の実施例に使用する母型の要部斜視図、
第2図は第1図凹陥部4に嵌合する金属体5の斜視図、
第3図は電鋳前処理工程を説明する母型の斜視図、第4
図は本実施例によつて得られたスラツシユ成形用ブーツ
モールドの縦断面図、第5図は第4図のA部分の拡大図
を示す。 1・・・・・・母型、4・・・・・・凹陥部、5・・・
・・・金属体、9・・・・・・ニツケル層、10・・・
・・・銅層、13・・・・・・突起、14・・・・・・
モールド。
FIG. 1 is a perspective view of the main parts of the matrix used in the embodiment of the present invention;
FIG. 2 is a perspective view of the metal body 5 that fits into the concave portion 4 of FIG. 1;
Figure 3 is a perspective view of the mother mold to explain the electroforming pretreatment process;
The figure shows a longitudinal sectional view of the boot mold for slush forming obtained in this example, and FIG. 5 shows an enlarged view of portion A in FIG. 4. 1...Mother mold, 4...Concave portion, 5...
...Metal body, 9...Nickel layer, 10...
...Copper layer, 13...Protrusion, 14...
mold.

Claims (1)

【特許請求の範囲】[Claims] 1 母型の表面に形成した銀膜等の導電体を陰電極とし
て母型上に陽電極の金属を電鋳した後、母型を除去する
スラッシュ成形用電鋳モールドの製造法において、横断
面面積が深さの6倍以下の数値を有する柱形状の凹陥部
4を1または2以上形成した母型1を用い、母型1の凹
陥部4を充填する形状の金属体5の全表面を電鋳モール
ドの最内面を形成する金属と同種の金属でメッキし、該
金属体5を母型1に凹陥部4に取外し自在に嵌合装填し
、母型表面の導電体とともに金属体5の開放面をも陰電
極とすることを特徴とするスラッシュ成形用電鋳モール
ドの製造法。
1 In a method for manufacturing an electroforming mold for slush forming, in which a conductive material such as a silver film formed on the surface of a matrix is used as a negative electrode, and after electroforming a positive electrode metal onto the matrix, the matrix is removed. Using a matrix 1 in which one or more column-shaped depressions 4 having an area of 6 times the depth or less are formed, the entire surface of a metal body 5 shaped to fill the depressions 4 of the matrix 1 is formed. The metal body 5 is plated with the same kind of metal as the metal that forms the innermost surface of the electroforming mold, and the metal body 5 is removably fitted and loaded into the concave portion 4 of the mother mold 1, and the metal body 5 is plated with the conductor on the surface of the mother mold. A method for manufacturing an electroforming mold for slush molding, characterized in that the open surface is also used as a negative electrode.
JP52046641A 1977-04-20 1977-04-20 Manufacturing method of electroforming mold for slush molding Expired JPS596210B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52046641A JPS596210B2 (en) 1977-04-20 1977-04-20 Manufacturing method of electroforming mold for slush molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52046641A JPS596210B2 (en) 1977-04-20 1977-04-20 Manufacturing method of electroforming mold for slush molding

Publications (2)

Publication Number Publication Date
JPS53130765A JPS53130765A (en) 1978-11-15
JPS596210B2 true JPS596210B2 (en) 1984-02-09

Family

ID=12752920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52046641A Expired JPS596210B2 (en) 1977-04-20 1977-04-20 Manufacturing method of electroforming mold for slush molding

Country Status (1)

Country Link
JP (1) JPS596210B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5620365U (en) * 1979-07-23 1981-02-23
JPS5669342A (en) * 1979-11-12 1981-06-10 Osamu Izumi Ni3al alloy with superior oxidation resistance, sulfurization resistance and ductility

Also Published As

Publication number Publication date
JPS53130765A (en) 1978-11-15

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