JPS5931397Y2 - transfer molding machine - Google Patents
transfer molding machineInfo
- Publication number
- JPS5931397Y2 JPS5931397Y2 JP1976125398U JP12539876U JPS5931397Y2 JP S5931397 Y2 JPS5931397 Y2 JP S5931397Y2 JP 1976125398 U JP1976125398 U JP 1976125398U JP 12539876 U JP12539876 U JP 12539876U JP S5931397 Y2 JPS5931397 Y2 JP S5931397Y2
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- temperature
- transfer molding
- molding machine
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【考案の詳細な説明】
本考案はトランスファ成形機に関し、特に成形品カル部
の硬化時間を短縮させる装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a transfer molding machine, and more particularly to a device for shortening the curing time of the cull portion of a molded product.
第１図１よび第２図を用いて従来技術を説明する。The prior art will be explained using FIGS. 1 and 2.
まず、第１図のように樹脂１をポット２に投入する。First, resin 1 is poured into pot 2 as shown in FIG.
そして樹脂１は下降してくるプランジャ３によって、上
型４、下型５によって形成されるランナ６、キャビティ
７に充填され、第２図のような状態になる。Then, the descending plunger 3 fills the runner 6 and cavity 7 formed by the upper mold 4 and lower mold 5 with the resin 1, resulting in a state as shown in FIG.
なか、上架８にはプランジャ駆動部（図示せず）が設置
されている。Among them, a plunger drive section (not shown) is installed on the upper frame 8.
上型４、下型５は内蔵するヒータ２５、熱電対２６トよ
び外部にある温度調節器（図示せず）によってレジン１
が硬化する温度（金型温度としては１５０〜２００℃）
に保持されている。The upper mold 4 and the lower mold 5 are heated to the resin 1 by a built-in heater 25, thermocouple 26, and external temperature controller (not shown).
The temperature at which it hardens (150 to 200°C as mold temperature)
is held in
したがって、キャビティ７、ランナ６中の樹脂は一定時
間後硬化する。Therefore, the resin in the cavity 7 and runner 6 is cured after a certain period of time.
しかしプランジャ３には熱源がないので第１図のように
上昇した状態では室温が金型温度より１００℃以上低い
ため外気によって冷される。However, since the plunger 3 does not have a heat source, in the elevated state as shown in FIG. 1, the room temperature is 100° C. or more lower than the mold temperature, so it is cooled by the outside air.
樹脂１の投入や金型４，５の掃除のため通常１〜２分第
１図のようにプランジャ３をポット２かう出して訃かな
ければならずプランジャ底面９の温度は金型温度よう約
２０℃以上低くなっている。In order to pour in the resin 1 and clean the molds 4 and 5, it is usually necessary to take out the plunger 3 into the pot 2 for 1 to 2 minutes as shown in Figure 1, and the temperature of the bottom surface 9 of the plunger is approximately the same as the mold temperature. The temperature has dropped by more than 20℃.
したがって第２図のような状態でレジンを硬化させる時
成形品カル１０は温度の低いプランジャ底面９に接して
いるため硬化が悪く、カル部１０を十分硬化させるには
長い硬化時間が必要で成形効率が悪くなるという欠点が
あった。Therefore, when curing the resin in the state shown in Figure 2, the molded product cull 10 is in contact with the low-temperature plunger bottom 9, so curing is poor, and a long curing time is required to fully cure the cull portion 10, resulting in molding. The drawback was that it was less efficient.
さらにカル部の樹脂硬化が不十分のため未反応物による
当該部の金型の汚染が大きい欠点がある。Furthermore, since the resin in the cull part is insufficiently cured, there is a drawback that the mold in this part is heavily contaminated by unreacted substances.
本考案は上記の問題点を解決するために、プランジャ内
部に電熱ヒータおよび感熱体を内蔵し、前記電熱ヒータ
釦よび感熱体に接続して温度調節器を設けることによっ
て、より短時間にカル部を硬化させ、成形時間（プラン
ジャを下ろした時から製品を取り出すために型開きを開
始する時までの時間）の短縮ができるトランスファ成形
機を提供するものである。In order to solve the above-mentioned problems, the present invention incorporates an electric heater and a heat sensitive element inside the plunger, and provides a temperature regulator connected to the electric heater button and heat sensitive body. The purpose of the present invention is to provide a transfer molding machine that can shorten the molding time (the time from when the plunger is lowered to when the mold opens to take out the product).
以下本考案を第３図１よび第４図に示す一実施例によっ
て説明する。The present invention will be explained below with reference to an embodiment shown in FIGS. 3 and 4.
各図に釦いて第１図と同一番号を付したものは同一部分
である。The buttons in each figure with the same numbers as in Figure 1 are the same parts.
第３図に示すようにプランジャ１１はプランジャ上部１
２とプランジャ下部１３とに分割され、中間に断熱材１
９（たとえばアスベスト）を挿入し、両部１２゜１３は
強度を持たせるために互いにねじ締結されている。As shown in FIG.
2 and a plunger lower part 13, with a heat insulating material 1 in the middle.
9 (for example, asbestos) is inserted, and both parts 12 and 13 are screwed together for strength.
このように両者１２，１３はねじ締結によって連結され
且つ断熱材１９により熱伝導面積が減少している形をし
ている故プランジャ下部１３からの熱がプランジャ駆動
装置（図示せず）に接続するプランジャ上部１２へ伝導
するのを極力少くするためである。In this way, both 12 and 13 are connected by screw fastening, and the heat conduction area is reduced by the heat insulating material 19. Therefore, the heat from the plunger lower part 13 is connected to the plunger driving device (not shown). This is to minimize conduction to the plunger upper part 12.
第４図に示すようにプランジャ下部１３には孔２０．２
１が穿設され、孔２０にはプランジャ底部を加熱するた
めのカートリッジヒータ１４が埋設され、また孔２１に
はプランジャ底部の温度を検知するための感熱体１５（
たとえば熱電対、サーミスタ）がそれぞれ埋設されてい
る。As shown in FIG. 4, the lower part 13 of the plunger has a hole 20.2.
A cartridge heater 14 for heating the bottom of the plunger is buried in the hole 20, and a heat sensitive element 15 (for detecting the temperature of the bottom of the plunger) is embedded in the hole 21.
For example, thermocouples and thermistors) are embedded in each.
カートリッジヒータ１４、感熱体１５に接続された導線
２２，２３Ｉ／′ｉそれぞれプランジャ下部１３の側面
に穿設された孔１６，１７を通過して外部に設置された
温度調節器１８に接続されている。Conductive wires 22 and 23I/'i connected to the cartridge heater 14 and the heat sensitive body 15 pass through holes 16 and 17 drilled in the sides of the plunger lower part 13, respectively, and are connected to a temperature regulator 18 installed outside. There is.
プランジャ下部１３の底面にはプランジャ底板２４が取
付けられている。A plunger bottom plate 24 is attached to the bottom surface of the plunger lower part 13.
上記のように構成したので感熱体１５、温度調節器１８
によってカートリッジヒータ１４に与える電力を調節し
プランジャ底部２の温度を所望の樹脂硬化温度に保つこ
とができる。Since the configuration is as described above, the heat sensitive body 15 and the temperature regulator 18
By adjusting the power applied to the cartridge heater 14, the temperature of the plunger bottom 2 can be maintained at a desired resin curing temperature.
第３図にトいてプランジャ底部２４の温度をたとえば金
型温度と同一温度にして熱硬化性樹脂の成形を行なえば
従来より成形時間を短縮してもカル部１０の樹脂は製品
キャビティ部７やランナ部６の樹脂より硬化不足になる
ことはない。As shown in FIG. 3, if the thermosetting resin is molded with the plunger bottom 24 at the same temperature as the mold temperature, the resin in the cull part 10 will be absorbed into the product cavity 7 and even if the molding time is shorter than before. The resin of the runner part 6 will not be insufficiently cured.
たとえば酸無水物硬化型エポキシ系成形材料を用いて成
形した所従来のトランスファ成形機に釦いて金型温度１
７０℃で３ｍ１ｎの成形時間を要したが本考案によるト
ランスファ成形機では金型温度、プランジャ底部温度共
に１７０℃に設定して約１．５ｍ１ｎでカル部１０も固
１り成形可能となった。For example, when molding is performed using an acid anhydride-curing epoxy molding material, the mold temperature is 1.
It took a molding time of 3 ml at 70° C., but with the transfer molding machine according to the present invention, the mold temperature and plunger bottom temperature were both set at 170° C., and the cull portion 10 could be solidly molded in about 1.5 ml.
以上詳細に説明したように本考案によれば、プランジャ
内−に電熱ヒータ釦よび感熱体を内蔵し、前記電熱ヒー
タ釦よび感熱体に接続して温度調節器を設けるようにし
たので、トランスファ成形にかけるカル部の硬化が速か
になり成形時間を短かくできる。As explained in detail above, according to the present invention, an electric heater button and a heat sensitive body are built into the plunger, and a temperature regulator is provided connected to the electric heater button and heat sensitive body, so that transfer molding is possible. Curing of the cull part caused by molding becomes faster and molding time can be shortened.
また本考案によればカル部の硬化が十分となるので未硬
化物がプランジャの底部に付着したりすることが防止さ
れると共に、それらが落ちて金型等を汚したりすること
が低減され、プランジャ及び金型の清掃が容易になると
共に金型掃除の回数も低減させることが可能となる。Furthermore, according to the present invention, since the cull portion is sufficiently cured, it is possible to prevent uncured materials from adhering to the bottom of the plunger, and to reduce the possibility that they will fall and contaminate the mold, etc. The plunger and the mold can be easily cleaned, and the number of times the mold must be cleaned can be reduced.
よってこれらによりトランスファ成形の効率を向上させ
ることができる。Therefore, the efficiency of transfer molding can be improved by these.
更に本考案によるトランスファ成形機では硬化時に樹脂
に直接触れるプランジャの底部及び金型面の温度を全て
同一に保つことが可能となるので、室温付近と１５０〜
２００℃とによって硬化性の著しく異なる樹脂、例えば
潜存性硬化促進剤を含むエポキシ系成形材料のようなも
のでもカル部の硬化を速やかにして同じ成形サイクルで
硬化させることができる効果を奏する。Furthermore, with the transfer molding machine according to the present invention, it is possible to keep the temperature of the bottom of the plunger and the mold surface, which are in direct contact with the resin during curing, at the same temperature, so the temperature is around room temperature and 150 - 150℃.
Even with resins whose curing properties differ significantly depending on the temperature at 200°C, such as epoxy molding materials containing latent curing accelerators, the cull portion can be cured quickly and cured in the same molding cycle.
また本考案によればプランジャの温度が一定に保持され
るのでプランジャと金型との間に嵌合すきまが生じるこ
とが防止されてプランジャと金型との間にノ〈りの発生
を防止してプランジャの摩耗を防止して高信頼性を有す
るトランスファ成形機を得ることができる実用的効果を
奏する。Furthermore, according to the present invention, since the temperature of the plunger is maintained constant, it is possible to prevent a fitting gap between the plunger and the mold, thereby preventing the occurrence of nozzles between the plunger and the mold. This has the practical effect of preventing wear of the plunger and providing a highly reliable transfer molding machine.
第１図２よび第２図は従来のトランスファ成形機の樹脂
硬化に関係する部分を示す図であって、第１図はプラン
ジャが上昇した状態、第２図はプランジャが下降した状
態を示す図、第３図は本考案によるトランスファ成形機
の一実施例を示す構成図、第４図は第３図に耘けるプラ
ンジャ下部の詳細を示す断面図である。
符号の説明、１１・・・プランジャ、１４・・・カート
リッジ、ヒータ、１５・・・感熱体、１８・・・温度調
節器。Figures 1 and 2 are diagrams showing parts related to resin curing of a conventional transfer molding machine, with Figure 1 showing the state in which the plunger is raised, and Figure 2 showing the state in which the plunger is lowered. 3 is a block diagram showing an embodiment of the transfer molding machine according to the present invention, and FIG. 4 is a sectional view showing details of the lower part of the plunger shown in FIG. 3. Explanation of symbols: 11... Plunger, 14... Cartridge, heater, 15... Heat sensitive element, 18... Temperature regulator.
Claims (1)
ランジャの下部に電熱ヒータ釦よび感熱体を内蔵し、上
記電熱ヒータｐよび感熱体に接続さへ且つ該感熱体によ
って感知されるプランジャ底部の温度により、上記電熱
ヒータでプランジャ底部を加熱する温度を調節する温度
調節器を設け、更に上記プランジャ下部を、プランジャ
駆動装置と接続されるプランジャ上部と断熱材を介して
一体的に連結したことを特徴とするトランスファ成形機
。An electric heater button and a heat sensitive body are built into the lower part of the plunger inserted into the pot in the transfer molding machine, and the temperature at the bottom of the plunger is connected to the electric heater and the heat sensitive body and sensed by the heat sensitive body. According to the present invention, a temperature controller is provided to adjust the temperature at which the bottom of the plunger is heated by the electric heater, and the lower part of the plunger is integrally connected to the upper part of the plunger connected to the plunger driving device via a heat insulating material. Transfer molding machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976125398U JPS5931397Y2 (en) | 1976-09-20 | 1976-09-20 | transfer molding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976125398U JPS5931397Y2 (en) | 1976-09-20 | 1976-09-20 | transfer molding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5343066U JPS5343066U (en) | 1978-04-13 |
| JPS5931397Y2 true JPS5931397Y2 (en) | 1984-09-05 |
Family
ID=28734810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976125398U Expired JPS5931397Y2 (en) | 1976-09-20 | 1976-09-20 | transfer molding machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5931397Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5949007A (en) * | 1982-09-14 | 1984-03-21 | Marantz Japan Inc | Low frequency amplifier of battery driven electronic device |
-
1976
- 1976-09-20 JP JP1976125398U patent/JPS5931397Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5343066U (en) | 1978-04-13 |
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