JPS57137130A - Method for resin sealing - Google Patents

Method for resin sealing

Info

Publication number
JPS57137130A
JPS57137130A JP2332381A JP2332381A JPS57137130A JP S57137130 A JPS57137130 A JP S57137130A JP 2332381 A JP2332381 A JP 2332381A JP 2332381 A JP2332381 A JP 2332381A JP S57137130 A JPS57137130 A JP S57137130A
Authority
JP
Japan
Prior art keywords
cavity
resin
molds
peripheral side
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2332381A
Other languages
Japanese (ja)
Inventor
Kunihito Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2332381A priority Critical patent/JPS57137130A/en
Publication of JPS57137130A publication Critical patent/JPS57137130A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B29C2045/7343—Heating or cooling of the mould heating or cooling different mould parts at different temperatures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To seal up an electronic part with a resin without generating flash in a transfer molding method by casting the resin into the cavity of molds while keeping the temperature of the peripheral side of the cavity higher than that of the other parts. CONSTITUTION:A heater 6 is provided in the peripheral side of the cavity 5 of molds. The molds are heated, an electronic parts (e.g., IC frame 8, etc.) is set in place, the molds are put together, and then a thermosetting resin is cast through a resin injection port 2 into the cavity. The sealing resin is divided through a runner 3 into each gate 4, filled up each cavity 5, and quickly hardened when coming into contact with the peripheral side the cavity 5 and the frame 8, the temperatures of which are higher than the other parts. Thus, a resin-sealed molding without flash can be obtained.
JP2332381A 1981-02-18 1981-02-18 Method for resin sealing Pending JPS57137130A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2332381A JPS57137130A (en) 1981-02-18 1981-02-18 Method for resin sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2332381A JPS57137130A (en) 1981-02-18 1981-02-18 Method for resin sealing

Publications (1)

Publication Number Publication Date
JPS57137130A true JPS57137130A (en) 1982-08-24

Family

ID=12107373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2332381A Pending JPS57137130A (en) 1981-02-18 1981-02-18 Method for resin sealing

Country Status (1)

Country Link
JP (1) JPS57137130A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1026407C2 (en) * 2004-06-11 2005-12-14 Fico Bv Method and device for controllable encapsulation of electronic components.
GB2527669A (en) * 2015-05-21 2015-12-30 Daimler Ag Method for producing at least one sealing element on a surface of a plate for a fuel cell system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1026407C2 (en) * 2004-06-11 2005-12-14 Fico Bv Method and device for controllable encapsulation of electronic components.
WO2005120799A1 (en) * 2004-06-11 2005-12-22 Fico B.V. Method and device for controllable encapsulation of electronic components
US8425826B2 (en) 2004-06-11 2013-04-23 Fico B.V. Method and device for controllable encapsulation of electronic components
GB2527669A (en) * 2015-05-21 2015-12-30 Daimler Ag Method for producing at least one sealing element on a surface of a plate for a fuel cell system

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