JPS57137130A - Method for resin sealing - Google Patents
Method for resin sealingInfo
- Publication number
- JPS57137130A JPS57137130A JP2332381A JP2332381A JPS57137130A JP S57137130 A JPS57137130 A JP S57137130A JP 2332381 A JP2332381 A JP 2332381A JP 2332381 A JP2332381 A JP 2332381A JP S57137130 A JPS57137130 A JP S57137130A
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- resin
- molds
- peripheral side
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C2045/7343—Heating or cooling of the mould heating or cooling different mould parts at different temperatures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
PURPOSE:To seal up an electronic part with a resin without generating flash in a transfer molding method by casting the resin into the cavity of molds while keeping the temperature of the peripheral side of the cavity higher than that of the other parts. CONSTITUTION:A heater 6 is provided in the peripheral side of the cavity 5 of molds. The molds are heated, an electronic parts (e.g., IC frame 8, etc.) is set in place, the molds are put together, and then a thermosetting resin is cast through a resin injection port 2 into the cavity. The sealing resin is divided through a runner 3 into each gate 4, filled up each cavity 5, and quickly hardened when coming into contact with the peripheral side the cavity 5 and the frame 8, the temperatures of which are higher than the other parts. Thus, a resin-sealed molding without flash can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2332381A JPS57137130A (en) | 1981-02-18 | 1981-02-18 | Method for resin sealing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2332381A JPS57137130A (en) | 1981-02-18 | 1981-02-18 | Method for resin sealing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57137130A true JPS57137130A (en) | 1982-08-24 |
Family
ID=12107373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2332381A Pending JPS57137130A (en) | 1981-02-18 | 1981-02-18 | Method for resin sealing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57137130A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL1026407C2 (en) * | 2004-06-11 | 2005-12-14 | Fico Bv | Method and device for controllable encapsulation of electronic components. |
GB2527669A (en) * | 2015-05-21 | 2015-12-30 | Daimler Ag | Method for producing at least one sealing element on a surface of a plate for a fuel cell system |
-
1981
- 1981-02-18 JP JP2332381A patent/JPS57137130A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL1026407C2 (en) * | 2004-06-11 | 2005-12-14 | Fico Bv | Method and device for controllable encapsulation of electronic components. |
WO2005120799A1 (en) * | 2004-06-11 | 2005-12-22 | Fico B.V. | Method and device for controllable encapsulation of electronic components |
US8425826B2 (en) | 2004-06-11 | 2013-04-23 | Fico B.V. | Method and device for controllable encapsulation of electronic components |
GB2527669A (en) * | 2015-05-21 | 2015-12-30 | Daimler Ag | Method for producing at least one sealing element on a surface of a plate for a fuel cell system |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69526868D1 (en) | INJECTION MOLDING DEVICE WITH A VALVE OPENING TYPE | |
DE2966918D1 (en) | Pressure generating device and use thereof | |
JPS61274910A (en) | Mold for sealing semiconductive resin | |
JPS57137130A (en) | Method for resin sealing | |
JPS565746A (en) | Hot runner mold for injection molding | |
JPS5722034A (en) | Molding method for thermosetting material | |
JPS57128931A (en) | Resin sealing for semiconductor device | |
JPS57117935A (en) | Molding structure for synthetic resin molding | |
JPS6436421A (en) | Injection molding method for gate seal | |
JPS6136940A (en) | Semiconductor resin sealing device | |
JPS5525359A (en) | Continuous injection molding machine | |
ES398320A1 (en) | Process for moulding structures of plastics material | |
GB1411837A (en) | Transfer moulding | |
JPS5753334A (en) | Polyestel resin injection molding machine and polyestel resin molding by said machine | |
JPS56130332A (en) | Shrinkage dent preventive molding | |
ATE14282T1 (en) | PLASTIC MULTIPLE INJECTION MOLDING WITH INCLINED HOT RUNNER. | |
JPS56108236A (en) | Method and apparatus for resin seal for semiconductor device | |
JPH06132331A (en) | Semiconductor sealing mold | |
JPS56100429A (en) | Resin molding method | |
JPS57191032A (en) | Hot runner mold device | |
JPS5720437A (en) | Resin sealing metal mold for semiconductor device | |
JPS5664446A (en) | Method of molding synthetic resin insert for metal terminal, metal terminal and mold | |
JPS5663415A (en) | Resin sealing molding method of semiconductor device | |
JPS56167410A (en) | Manufacture of synthetic resin molding | |
JPS5782012A (en) | Casting mold and molding method using said mold |