JPS59230742A - Manufacture of copper lined laminated board - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は１寸法変化の少ない銅張積層板の製造に関する
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the production of copper-clad laminates with little change in one dimension.

一般に、銅張積層板はエポキシ樹脂あるいは他の樹脂で
変性したエポキシ樹脂等の熱硬化性樹脂のフェスをガラ
ス布等の基材に含浸させ乾燥して於て、基材が、ｔａ維
のモノフィラメント径が６．８〜７．６μｍであり、か
つ、経方向と緯方向の織密度の比（経／緯）が１．１０
〜１．２５である繊維布であることを特徴とするせので
ある。In general, copper-clad laminates are made by impregnating a base material such as glass cloth with a face of thermosetting resin such as epoxy resin or epoxy resin modified with other resins and drying it. The diameter is 6.8 to 7.6 μm, and the ratio of weave density in the warp and weft directions (warp/weft) is 1.10
〜1.25 is a fiber cloth.

繊維布基材としては、ガラス布、ケブラー繊維（芳香族
ポリアミド系繊維、デュポン社製商品名）等の合成繊維
布等が使用される。As the fiber cloth base material, glass cloth, synthetic fiber cloth such as Kevlar fiber (aromatic polyamide fiber, trade name manufactured by DuPont), etc. are used.

繊維のモノフィラメント径は、６．８〜７．６μｍであ
り１本発明に於ては、経方向、緯方向の織密度の比（経
／緯）が１．１０〜１．２５である繊維布基材を使用す
る。The monofilament diameter of the fiber is 6.8 to 7.6 μm, and in the present invention, the fiber cloth has a weave density ratio (warp/weft) of 1.10 to 1.25 in the warp direction and the weft direction. Use base material.

ガラス布の場合モノフィラメント径６．８〜７．６μｍ
のものは、ＪＩＳ−Ｒ−３４１３にガラス布記号ＥＣＥ
として分類されておりそれらの径のガラス布で９本発明
において織密度として経方向５５〜７０本、緯方向４５
〜６５本が好ましい。For glass cloth, the monofilament diameter is 6.8 to 7.6 μm.
Glass cloth symbol ECE is specified in JIS-R-3413.
In the present invention, the weave density is 55 to 70 in the warp direction and 45 in the weft direction for glass cloth with these diameters.
~65 is preferred.

経方向とは、繊維布巻取方向であり、緯方向とは、経方
向と直交する方向である。The warp direction is the winding direction of the fiber cloth, and the weft direction is a direction perpendicular to the warp direction.

熱硬化製樹脂としては、積層板用に用いられる一般のエ
ポキシ樹脂あるいはエポキシ樹脂を他の得た塗工布を少
なくとも１枚以上重ね合わせ、少なくとも片面にプリン
ト配線板用銅箔を介し、熱圧成形して製造する。このよ
うにして作成したガラス布基材等の銅張積層板に対し、
近年、印刷回路パターンの高密度化、部品搭載の自動化
が進んできたことにより１回路加工工程中での基板寸法
の変化が少ないことがより必要となってきた。The thermosetting resin is a general epoxy resin used for laminates, or at least one coated fabric coated with epoxy resin, which is layered with a copper foil for printed wiring boards on at least one side, and heat-pressed. Molded and manufactured. For copper-clad laminates such as glass cloth base materials created in this way,
In recent years, as the density of printed circuit patterns has increased and the automation of component mounting has progressed, it has become increasingly necessary to minimize changes in board dimensions during one circuit processing process.

従来からのガラス布基材では１寸法変化が大きく、なか
でも寸法変化の方向差が大きいものであり回路位置の寸
法が高い精度を必要とする部品搭載の自動化を困難にし
ていた。すなわち１回路加工工程中における基材の寸法
変化は、従来、経方向−０，０４２％、緯方向−０，０
１８％であり、変化率および変化率の方向差が大きく発
生し、高い寸法精度を必要とする部品搭載の自動化を困
難にしていた。Conventional glass cloth substrates have a large change in one dimension, and a particularly large difference in the direction of the change in dimension, making it difficult to automate the mounting of components that require high precision in circuit position dimensions. In other words, the dimensional change of the base material during one circuit processing process was conventionally -0,042% in the warp direction and -0,0% in the weft direction.
18%, a large difference in the rate of change and the direction of the rate of change occurred, making it difficult to automate component mounting, which requires high dimensional accuracy.

本発明は、このような点に鑑みてなされたもので、熱硬
化性樹脂を基材に含浸させて作成したプリプレグの必要
枚数を、少くともその片面に銅箔を重ね合せ、加熱加圧
する銅張積層板の製造法に樹脂（例えば、フェノール樹
脂、ポリイミド樹脂）で変性した樹脂などが使用される
。これらの熱硬化性樹脂ワニスを常法に従ってガラス布
等の基材に含浸し、乾燥しプリプレグを得る。樹脂分は
４５〜６５重量％が好まシ＜、乾燥条件は使用樹脂、基
材の種類によっても変るが、ＩｊＬ度１２０〜１８０℃
。The present invention has been made in view of these points, and consists of overlapping a required number of prepregs made by impregnating a base material with a thermosetting resin with copper foil on at least one side, and heating and pressing the copper foil. Resins modified with resins (for example, phenol resins, polyimide resins), etc. are used in the method of manufacturing stretched laminates. A base material such as glass cloth is impregnated with these thermosetting resin varnishes according to a conventional method and dried to obtain a prepreg. The resin content is preferably 45 to 65% by weight.Drying conditions vary depending on the resin used and the type of base material, but the IJL degree is 120 to 180°C.
.

時間５〜３０分が好ましい。Preferably the time is 5 to 30 minutes.

プリプレグの必要枚数を、その片面、又は両面に銅箔を
重ね合せ、加熱加圧して銅張積層板を製造する条件は２
通常の製造法で用いられている条件、すなわち、温度１
６０〜１８０℃、圧力４０〜１００Ｋｇ／　ｃｔＡ　、
時間５０〜１００分が使用される。The conditions for producing a copper-clad laminate by overlapping the required number of prepreg sheets with copper foil on one or both sides and heating and pressing them are 2.
Conditions used in normal manufacturing methods, i.e. temperature 1
60~180℃, pressure 40~100Kg/ctA,
A time of 50-100 minutes is used.

以上説明した本発明の銅張積層板の製造法に於ては１寸
法変化が小さく１寸法変化の方向差が小さい銅張積層板
が得られる。In the method for producing a copper-clad laminate of the present invention as described above, a copper-clad laminate with a small change in one dimension and a small difference in direction of a change in one dimension can be obtained.

実施例１〜３．比較例１〜３ モノフィラメント径が７．３μｍであり、経方向、緯方
向の織密度の比がそれぞれ別表に示すガラス布に、臭素
化ビスフェノールＡ型エポキシ樹脂ＤＥＲ５１１（ダウ
ケミカル社製商品名）に硬化剤としてジシアンジアミド
、硬化促進剤として２−エチル−４メチルイミダゾール
を配合したエポキシ樹脂ワニスを、樹脂分４０〜４７重
量％含浸し、硬化時間１５０〜２２０秒、樹脂流れ５〜
１５Ｍ量％になるよう乾燥させ塗工布を得、これを２枚
重ねさらにプリント配線板用銅箔を上下に介し熱圧成形
し銅張　　２゜積層板を作成した。このようにして得た
銅張積層板をＪＩＳ−Ｃ−６４８６の方法により１７０
℃３０３゜分の加熱条件で１寸法変化を測定した。その
結果を別表に示す。Examples 1-3. Comparative Examples 1 to 3 Brominated bisphenol A type epoxy resin DER511 (trade name manufactured by Dow Chemical Company) was applied to glass cloth in which the monofilament diameter was 7.3 μm and the ratio of weave density in the warp direction and weft direction was shown in the attached table. An epoxy resin varnish containing dicyandiamide as a curing agent and 2-ethyl-4-methylimidazole as a curing accelerator is impregnated with a resin content of 40 to 47% by weight, a curing time of 150 to 220 seconds, and a resin flow of 5 to 50%.
A coated cloth was obtained by drying to a concentration of 15 M%, and two sheets of this were stacked and then hot-press molded with copper foil for printed wiring boards interposed above and below to produce a copper-clad 2° laminate. The thus obtained copper clad laminate was manufactured using the method of JIS-C-6486.
One dimensional change was measured under heating conditions of 303°C. The results are shown in the attached table.

別　　表　　　　　　　　　　　　４゜□ ６゜ 手続ネｔｉ正書 昭和５８年　６月２４Ｌ１ 発明の名称 銅張積層板の製造法 補正をする者 事件との関係　　　特許出願人 名　　　　称（’４４５　）　日立化成工業株式会社代
理人 郵便番号　　１６０ 居　　所　　東京都新宿区西新宿二丁目１番１号日立化
成工業株式会社内 （電話　東京　３４６−３１１１　（大代表）明細書の
発明の詳細な説明の欄。Attached Table 4゜□ 6゜Procedure Neti Official Book June 24, 1981 L1 Name of Invention Relationship with the Case of Person Amending the Manufacturing Method for Copper Clad Laminates Patent Applicant Name ('445) Agent for Hitachi Chemical Co., Ltd. Person Postal Code: 160 Address: Hitachi Chemical Co., Ltd., 2-1-1 Nishi-Shinjuku, Shinjuku-ku, Tokyo (Telephone: Tokyo 346-3111 (main representative)) Detailed description of the invention in the specification.

補正の内容 （１）明細書画２頁１行〜第３頁末行に、［於て、基材
が、〜製造法に」とあるのを下記に訂正する。Contents of the amendment (1) In the description page 2, line 1 to the last line of page 3, the following is corrected: ``The base material is ... manufacturing method.''

−だ塗工布を少なくとも１枚以上重ね合ね−Ｉ、少なく
とも１１面にプリント配線板用銅箔を介し、熱圧成形し
て製造する。このようにして作成したガラス布基材等の
銅張積層板に対し、近年、印刷回路パターンの高密度化
、部品搭載の自動化が進んできたことにより２回路加工
工程中での基板４法の変化が少ないことがより必要とな
ってきた。- At least one coated fabric is layered on top of the other, and copper foil for printed wiring boards is interposed on at least 11 sides, and the fabric is hot-pressed to produce the fabric. In recent years, with regard to copper-clad laminates made of glass cloth substrates, etc., created in this way, four methods have been applied to the board during the two-circuit processing process, due to advances in the density of printed circuit patterns and the automation of component mounting in recent years. Less change has become more necessary.

従来からのガラス布基材では、手法変化が大きく、なか
でも寸法変化の方向差が大きいもので、ｂり回路位置の
寸法が高い精度を必要とする部品搭載の自動化を困難に
していた。すなわち１回路加工工程中における基材の寸
法変化は、従来、経方向−０，０４２％、緯方向−０，
０１８％であり、変化率および変化率の方向差が大きく
発生し、高い手法精度を必要とする部品搭載の自動化を
困難にし７てむイノこ。With conventional glass cloth substrates, there are large variations in methodologies, and in particular, large differences in the direction of dimensional changes, making it difficult to automate the mounting of components that require high precision in the dimensions of the circuit positions. In other words, the dimensional change of the base material during one circuit processing process was conventionally -0,042% in the warp direction, -0,042% in the weft direction,
018%, large differences in the rate of change and the direction of the rate of change occur, making it difficult to automate component mounting, which requires high precision.

本発明は、このような点に鑑ゐてなされたもので、熱硬
化性樹脂を基材に含浸さヒて作成したプリプレグの必要
枚数を、少くともその片面に銅箔を重ね合せ、加熱加圧
する銅張積層板の製造法に於て、基材が、繊維のモノフ
ィラメント径が６，８〜１．０ｉ）ｍであり、かつ、経
方向と緯方向の織密度の比（経／緯）が１．１０〜１．
２５である繊維布であることを特徴とするものである。The present invention has been made in view of the above-mentioned problems, and is made by superimposing the required number of prepreg sheets, which are made by impregnating a base material with a thermosetting resin, with copper foil on at least one side, and heating them. In the method of manufacturing a pressed copper-clad laminate, the base material has a fiber monofilament diameter of 6.8 to 1.0 m), and a ratio of weave density in the warp direction and weft direction (warp / weft) is 1.10 to 1.
It is characterized by being a fiber cloth having a rating of 25.

繊維布基材としては、ガラス布、芳香族ポリアミＩＳ系
繊維等の合成繊維布等が使用される。As the fiber cloth base material, glass cloth, synthetic fiber cloth such as aromatic polyamide IS fiber, etc. are used.

繊維のモノフィラメント径は、６．８〜７．６μｍであ
り９本発明に於ては、経方向、緯方向の織密度の比（経
／緯）が１．ｌＯ〜１．２５である繊維布基）Ａを使用
する。The monofilament diameter of the fiber is 6.8 to 7.6 μm, and in the present invention, the ratio of weave density in the warp and weft directions (warp/weft) is 1. A fiber fabric base) A with lO~1.25 is used.

ガラス布の場合モノフィラメント径６．８〜７．６ｐ　
Ｉｌ＋のものは、　　Ｊ　ｌ５−Ｒ−３４１３にガラス
布記号＋：ｃｇとして分類されておりそれらの径のガラ
ス布で１本発明において織密度として経方向５５〜・７
０本、緯方向４５〜６５本が好ましい。For glass cloth, monofilament diameter 6.8-7.6p
Il+ is classified as glass cloth code +:cg in Jl5-R-3413, and glass cloths with these diameters have a weaving density of 55 to 7 in the warp direction in the present invention.
Preferably, there are 0 lines and 45 to 65 lines in the latitudinal direction.

経方向とは、繊維布巻取方向であり、緯方向とは２経方
向と直交する方向である。The warp direction is the fiber cloth winding direction, and the weft direction is a direction perpendicular to the two warp directions.

熱硬化型樹脂としては、積層板用に用いられる一般のエ
ポキシ樹脂あるいはエポキシ樹脂を他の」（２）明細書
第５頁の別表を下記に訂正する。As the thermosetting resin, general epoxy resins used for laminates or other epoxy resins may be used. (2) The attached table on page 5 of the specification is corrected as follows.

別　　　表 ＵSeparate table U

Claims (1)

【特許請求の範囲】 １、熱硬化性樹脂を基材に含浸させて作成したプリプレ
グの必要枚数を、少くともその片面に銅箔を重ね合せ、
加熱加圧する銅張積層板の製造法に於て、基材が、繊維
のモノフィラメント径が６．８〜７．６μｍであり、か
つ、経方向と緯方向の織密度の比（経／緯）が１．１０
〜１．２５である繊維布であることを特徴とする銅張積
層板の製造法。 ２、繊維布がガラス布であり、熱硬化性樹脂がエポキシ
樹脂である特許請求の範囲第１項記載の銅張積層板の製
造法。[Claims] 1. Layering the required number of prepregs made by impregnating a base material with a thermosetting resin with copper foil on at least one side,
In the method of manufacturing a copper-clad laminate by heating and pressing, the base material has a fiber monofilament diameter of 6.8 to 7.6 μm, and the weave density ratio in the warp direction and the weft direction (warp / weft) is 1.10
1.25. 2. The method for manufacturing a copper-clad laminate according to claim 1, wherein the fiber cloth is a glass cloth and the thermosetting resin is an epoxy resin.