JPS59230744A - Manufacture of copper lined laminated board - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は１寸法変化の少ない銅張積層板の製造に関する
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the production of copper-clad laminates with little change in one dimension.

一般に、銅張積層板はエポキシ樹脂ある１１）は他め樹
脂で変性したエポキシ樹脂等の熱硬化性樹脂のワニスを
ガラス布等の基材に含浸させ乾燥して得た塗工布を少な
くとも１枚以上重ね合わせ、少なくとも片面にプリント
配線板用銅箔を介し、熱圧成形して製造する。このよう
にして作成したガラス布基材等の銅張積層板に対し、近
年、印刷回路パターンの高密度化部品搭載の自動化が進
んできたことにより９回路加工工程中での基板寸法の変
化が少ないことがより必要となってきた。Generally, copper-clad laminates are made using epoxy resin.11) A coated cloth obtained by impregnating a base material such as glass cloth with a thermosetting resin varnish such as an epoxy resin modified with another resin and drying the coated cloth is generally used. It is manufactured by stacking two or more sheets together and hot-pressing them with copper foil for printed wiring boards interposed on at least one side. With regard to copper-clad laminates made in this way, such as glass cloth substrates, changes in board dimensions during the 9-circuit processing process have been made in recent years due to progress in automation of mounting high-density components on printed circuit patterns. Less has become more necessary.

従来からのガラス布基材では１寸法変化が大きく、なか
でも寸法変化の方向差が大きいものであり回路位置の寸
法が高い精度を必要とする部品搭載の自動化を困難にし
ていた。すなわち１回路加工工程中における基材の寸法
変化は、従来、経方向−０，０４２％、緯方向−０，０
１８％であり、変化率および変化率の方向差が大きく発
生し、高い寸法精度を必要とする部品搭載の自動化を困
難にしていた。Conventional glass cloth substrates have a large change in one dimension, and a particularly large difference in the direction of the change in dimension, making it difficult to automate the mounting of components that require high precision in circuit position dimensions. In other words, the dimensional change of the base material during one circuit processing process was conventionally -0,042% in the warp direction and -0,0% in the weft direction.
18%, a large difference in the rate of change and the direction of the rate of change occurred, making it difficult to automate component mounting, which requires high dimensional accuracy.

本発明は、このような点に鑑みてなされたもので、熱硬
化性樹脂を基材に含浸させて作成したプリプレグの必要
枚数を、少くともその片面に銅箔を重ね合せ、加熱加圧
する銅張積層板の製造法に・於て、プリプレグが、経方
向、緯方向の引張弾性率（経／緯）が０．９〜１．１で
ある繊維布基材に熱硬化性樹脂を含浸したものであるこ
とを特徴とするものである。The present invention has been made in view of these points, and consists of overlapping a required number of prepregs made by impregnating a base material with a thermosetting resin with copper foil on at least one side, and heating and pressing the copper foil. In the method for producing a tension laminate, the prepreg impregnates a thermosetting resin into a fiber cloth base material having a tensile modulus (warp/latitude) of 0.9 to 1.1 in the warp and weft directions. It is characterized by being a thing.

引張弾性率Ｅとは１図面に示す応力−歪曲線Ａの直線部
分ａより下式より求め出すものである。The tensile modulus E is determined from the following formula from the straight line portion a of the stress-strain curve A shown in Figure 1.

（σ４−σ、） こ こで、σ５．σ１　　：応力（引張荷重）ε１　、ε、
Ｌ　　：歪　（伸□び量）勉　　　　ニガラス布の初期
長さ ま た。ガラス布の経方向とはガラス布巻取方向であり、緯
方向は経方向と直交する方向である。　繊維布基材とし
ては、ガラス布、ケブラー繊維　（芳香族ポリアミド系
繊維、デュポン社製商品名）等の合成繊維布等が使用さ
れる。(σ4−σ,) Here, σ5. σ1: Stress (tensile load) ε1, ε,
L: Strain (stretching amount) Also the initial length of the glass cloth. The warp direction of the glass cloth is the winding direction of the glass cloth, and the weft direction is a direction perpendicular to the warp direction. As the fiber cloth base material, glass cloth, synthetic fiber cloth such as Kevlar fiber (aromatic polyamide fiber, trade name manufactured by DuPont), etc. are used.

熱硬化製樹脂としては、積層板用に用いられる一般のエ
ポキシ樹脂あるいはエポキシ樹脂を他の樹脂（例えば、
フェノール樹脂、ポリイミド樹脂）で変性した樹脂など
が使用される。これらの熱硬化性樹脂ワニスを常法に従
ってガラス布等の基材に含浸し、乾燥しプリプレグを得
る。樹脂分は４５〜６５重量％が好ましく、乾燥条件は
使用樹脂、基材の種類によっても変るが、温度１２０〜
１８０”Ｃ。As the thermosetting resin, general epoxy resin used for laminates or epoxy resin with other resins (for example,
Resins modified with phenolic resins, polyimide resins, etc. are used. A base material such as glass cloth is impregnated with these thermosetting resin varnishes according to a conventional method and dried to obtain a prepreg. The resin content is preferably 45-65% by weight, and the drying conditions vary depending on the resin used and the type of base material, but the temperature is 120-65%.
180"C.

時間５〜３０分が好ましい。Preferably the time is 5 to 30 minutes.

プリプレグの必要枚数を、その片面、又は両面に銅箔を
重ね合せ、加熱加圧して銅張積層板を製造する条件は２
通常の製造法で用いられている条件、すなわち、温度１
６０〜１８０℃、圧力４０〜１００Ｋｇ／ｃＪ、時間５
０〜１００分が使用される。The conditions for producing a copper-clad laminate by overlapping the required number of prepreg sheets with copper foil on one or both sides and heating and pressing them are 2.
Conditions used in normal manufacturing methods, i.e. temperature 1
60~180℃, pressure 40~100Kg/cJ, time 5
0 to 100 minutes are used.

以上説明した本発明の銅張積層板の製造法に於ては２寸
法変化が小さく１寸法変化の方向差が小さい銅張積層板
が得られる。In the method for manufacturing a copper-clad laminate of the present invention as described above, a copper-clad laminate with small two-dimensional change and a small directional difference in one-dimensional change can be obtained.

実施例１〜３．比較例１〜３ 経方向、緯方向の引張弾力率がそれぞれ、別表に示すガ
ラス布に、臭素化ビスフェノールＡ型エポキシ樹脂ＤＥ
Ｒ５１１（ダウケミカル社製商品名）に硬化剤としてジ
シアンジアミド、硬化促進剤として２−エチル−４メチ
ルイミダゾールを配合したエポキシ樹脂ワニスを、樹脂
分４０〜４７重量％含浸し、硬化時間１５０〜２２０秒
、樹脂流れ５〜１５重量％になるよう乾燥させ塗工布を
得、これを２枚重ねさらにプリント配線板用銅箔を上下
に介し熱圧成形し銅張積層板を作成した。このようにし
て得た銅張積層板をＪ　Ｉ　５−Ｃ−６４８６方法によ
り１７０℃３０分の加熱条件で９寸法変化を測定した。Examples 1-3. Comparative Examples 1 to 3 Brominated bisphenol A type epoxy resin DE
An epoxy resin varnish containing dicyandiamide as a curing agent and 2-ethyl-4-methylimidazole as a curing accelerator is impregnated with R511 (trade name manufactured by Dow Chemical Company) with a resin content of 40 to 47% by weight, and a curing time of 150 to 220 seconds. A coated cloth was obtained by drying the coated cloth so that the resin flow was 5 to 15% by weight, and two sheets of this were stacked and then hot-press molded with copper foil for printed wiring boards interposed above and below to produce a copper-clad laminate. The copper-clad laminate thus obtained was subjected to measurement of nine dimensional changes under heating conditions of 170° C. for 30 minutes according to the J I 5-C-6486 method.

その結果を別表に示す。The results are shown in the attached table.

以］−ン白 別　　　表 図面は応力−歪曲線を示すグラフである。]-n white Separate table The drawing is a graph showing stress-strain curves.

８１ｇ−２ 手続補正式 昭和５８年　６月２．１１コ ２、　発明の名称 銅張積層板の製造法 ３、補正をする者 事件との関係　　　特許出願人 名　　　　称（４４５）　　日立化成工業株式会社４、
代理人 郵便番号　　１６０ 居　　所　　東京都新宿区西新宿二丁目１番１号口立化
成工業株式会社内 （電話　東京　３４６−３１１１　（大代表）明細書の
発明の詳細な説明の欄。81g-2 Procedural amendment formula June 2, 1980, 2.11 Co. 2, Name of invention Method for manufacturing copper-clad laminates 3, Relationship to the case of the person making the amendment Patent applicant name (445) Hitachi Chemical Co., Ltd. 4 ,
Agent postal code: 160 Address: 2-1-1 Nishi-Shinjuku, Shinjuku-ku, Tokyo, Tate Kasei Kogyo Co., Ltd. (Telephone: Tokyo 346-3111 (main representative)) Column for detailed description of the invention in the specification.

６、補正の内容 ＋１．１明ｔｉｌ＋　、！ｆ第５頁の別表を下記に訂正
する。6. Correction details +1.1 clear til+ ,! The attached table on page 5 of f is corrected as follows.

記 別　　　表 以上Record Separate table that's all

Claims (1)

【特許請求の範囲】 １、熱硬化性樹脂を基材に含浸させて作成したプリプレ
グの必要枚数を、少（ともその片面に銅箔を重ね合せ、
加熱加圧する銅張積層板の製造法に於て、プリプレグが
、経方向、緯方向の引張弾性率の比（経／緯）が０．９
〜１．１である繊維布基材に熱硬化性樹脂を含浸したも
のであることを特徴とする銅張積層板の製造法。 ２、繊維布基材がガラス布であり、熱硬化性樹脂がエポ
キシ樹脂である特許請求の範囲第１項記載の銅張積層板
の製造法。[Claims] 1. The required number of prepregs made by impregnating a base material with a thermosetting resin is reduced (at least by overlapping copper foil on one side of the prepreg,
In the method of manufacturing copper-clad laminates by heating and pressing, the prepreg has a tensile modulus ratio (warp/latitude) of 0.9 in the warp direction and the weft direction.
~1.1 A method for producing a copper-clad laminate, characterized in that the fiber cloth base material is impregnated with a thermosetting resin. 2. The method for producing a copper-clad laminate according to claim 1, wherein the fiber cloth base material is a glass cloth and the thermosetting resin is an epoxy resin.