JPS59209858A - Method of pasting paper on woody board - Google Patents
Method of pasting paper on woody boardInfo
- Publication number
- JPS59209858A JPS59209858A JP8472083A JP8472083A JPS59209858A JP S59209858 A JPS59209858 A JP S59209858A JP 8472083 A JP8472083 A JP 8472083A JP 8472083 A JP8472083 A JP 8472083A JP S59209858 A JPS59209858 A JP S59209858A
- Authority
- JP
- Japan
- Prior art keywords
- paper
- board
- powder
- resin
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、パーティクルボード、ファイバーボード等の
木質板上に紙を貼着する方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for pasting paper onto a wood board such as particle board or fiberboard.
元来パーティクルボード、ファイバーボード等はその表
面が不均質であるためその上に塗装したり、印刷、また
、接着等の加工をする場合、表面に一旦紙を貼り、その
上から加工する方法がとられている。パーティクルボー
ド、ファイバーボードに紙を貼ると、その表面が均質と
なる上強度が増し、品質向上には有効な手段である。Particleboard, fiberboard, etc. originally have non-uniform surfaces, so when painting, printing, gluing, etc. It is taken. Pasting paper on particle board or fiberboard makes the surface uniform and increases strength, making it an effective means of improving quality.
しかしながら、紙を貼着するための接着剤は一般に水性
のものが殆どで、パーティクルボード、ファイバーボー
ドは吸水性が高いため接着剤の水分が浸透、膨潤してボ
ードの表面が毛ばだってきて紙が貼りにくいなど作業性
が低下し、且つ製品の強度低下など弊害が多い。そこで
一部ではフィルム状の接着性樹脂を使用して貼着を行っ
ているがコストが高くなるため普及するに至っていない
。However, most adhesives used to attach paper are generally water-based, and particleboard and fiberboard have high water absorption, so the water in the adhesive penetrates and swells, causing the surface of the board to become hairy. There are many disadvantages such as reduced workability, such as difficulty in pasting paper, and reduced strength of the product. Therefore, in some cases, adhesive resin in the form of a film is used for pasting, but it has not become widespread due to the high cost.
本発明は上記の点に鑑みてなされたもので、水性若しく
は液体状のものは一切使用することなく完全な乾式法で
もって板面への接着強度高くあらゆる種類の紙を貼着加
工出来る方法を提供するものである。The present invention has been made in view of the above points, and provides a method for bonding all kinds of paper with high adhesive strength to the board surface using a completely dry method without using any water-based or liquid materials. This is what we provide.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
第1図は本発明に用いる装置の1例を示すものでまずパ
ーティクルボード、ファイバーボード等の木質板tをコ
ロコンベア10によって搬送しつつ粉末散布機8の下を
通して木質板lの表面に接着性ポリオレフィン系樹脂の
粉末2を20〜80f /M2の割合で散布する。接着
性ポリオレフィン系樹脂の粉末2としては、例えば、東
燃石油化学株式会社製OMP、HA−40等のようにポ
リオレフィン系樹脂を化学変性して接着性を付加したも
のを用いる。また粉末の粒度としては、50メツシュ以
上であれば特に細かくする必要はない。FIG. 1 shows an example of the apparatus used in the present invention. First, a wooden board t such as particle board or fiberboard is conveyed by a roller conveyor 10 and passed under a powder spreader 8 to form an adhesive on the surface of the wooden board l. Sprinkle polyolefin resin powder 2 at a rate of 20 to 80 f/M2. As the adhesive polyolefin resin powder 2, for example, a polyolefin resin that has been chemically modified to have adhesive properties, such as OMP and HA-40 manufactured by Tonen Petrochemical Co., Ltd., is used. Further, the particle size of the powder does not need to be particularly fine as long as it is 50 mesh or more.
ポリオレフィン系樹脂は一般に細かく粉砕するのが困難
で高価となるため50メツシュ程度の粗い粉末を使用す
る方が安価である。粉末散布機8としては、粉末静電塗
装機を用いるのが好ましい。Polyolefin resins are generally difficult to finely grind and are expensive, so it is cheaper to use coarse powder of about 50 mesh. As the powder spreader 8, it is preferable to use a powder electrostatic coating machine.
次いで、赤外線等の加熱装置4の下を通して粉末と共に
板表面を予熱したのち加熱ロール5に通して加熱、加圧
し接着性ポリオレフィン系樹脂粉末を板表面に均等に耐
着させて、均一な厚みの接着性ポリオレフィン系樹脂層
を形成する。Next, the surface of the board is preheated together with the powder by passing it under a heating device 4 such as infrared rays, and then heated and pressurized by passing it through a heating roll 5 to make the adhesive polyolefin resin powder evenly adhere to the board surface, so that it has a uniform thickness. Form an adhesive polyolefin resin layer.
引続いて、その上に伸縮性をもたない紙6を供給し、加
熱ロール7に通して紙と接着性ポリオレフィン系樹脂層
とを押圧、加熱して完全に熔融、接着させる。Subsequently, a non-stretchable paper 6 is supplied thereon and passed through a heating roll 7 to press and heat the paper and the adhesive polyolefin resin layer to completely melt and adhere.
又、より完壁な接着をはかるため必要によって加熱ロー
ル7の直後に加熱ロール8を設は充分なる熱供給を行う
ことも有効である。Furthermore, in order to achieve more perfect adhesion, it is also effective to provide a heating roll 8 immediately after the heating roll 7, if necessary, to supply sufficient heat.
こののち冷却ロール群9を通して表面から冷却すれば木
質板上に強固に紙を貼着することができる。このように
完全な乾式法で紙を貼着したパーティクルボード、ファ
イバーボード等11は、例えば、水性接着剤による膨潤
など起こしていないため板のそり、強度低下などが無く
その上接着性ポリオレフィン系樹脂層が防水効果を発揮
して、優れた木質板として各種用途に使用出来る。If the paper is then cooled from the surface through the cooling roll group 9, the paper can be firmly adhered to the wood board. Particle board, fiber board, etc. 11 to which paper is pasted using a completely dry method, for example, does not undergo swelling due to water-based adhesives, so there is no warpage or loss of strength, and in addition, adhesive polyolefin resin is used. The layer has a waterproof effect and can be used for various purposes as an excellent wood board.
尚本発明方法のうちの加熱ロール5を省略して紙6を供
給する方法も考えられるが、加熱ロール5を省略した場
合には接着性ポリオレフィン系樹脂が完全な層を形成す
る以前に紙6が重ねられる結果となり、粒度の粗い粉末
を用いた場合には、粗い粒子の部分で樹脂が紙を透過し
て表面に滲み出ることが多条あるので、紙を重ねる時に
は、接着性樹脂表面は出来るだけ平坦であることが必要
である。従って、加熱ロール5による加熱、加圧は本発
明方法に欠くことのできないものである。A method of the present invention in which the heating roll 5 is omitted and the paper 6 is supplied may also be considered, but if the heating roll 5 is omitted, the paper 6 is supplied before the adhesive polyolefin resin forms a complete layer. If a powder with coarse particles is used, the resin may pass through the paper in the coarse particles and seep out onto the surface, so when stacking papers, the adhesive resin surface is It needs to be as flat as possible. Therefore, heating and pressurization by the heating roll 5 are essential to the method of the present invention.
次に本発明方法を実施例により具体的に説明する。Next, the method of the present invention will be specifically explained using examples.
〈実施例1〉
装置として第1図に示すものを用い、加熱ロール6は2
20℃、加熱ロール7及び8は200℃、冷却ロール9
は水冷温にそれぞれ設定し、加熱装置4は長さ4 ms
粉末散布機8としては粉末静電塗装機を用い、コロコン
ベア10の・送り速度は6m / minとした。接着
性ポリオレフィン系樹脂の粉末2としては、三井石油化
学工業株式会社製アトマーの粉末、NS−100を用い
、紙6としては、一般に使用されている薄葉紙28 f
/M2を用いた。又木質板1としては、竹原工業株式
会社製タケハラボードの厚さ2.7ミリのものを用いた
。<Example 1> The apparatus shown in FIG. 1 was used, and the heating roll 6 was
20°C, heating rolls 7 and 8 are 200°C, cooling roll 9
are respectively set to the water cooling temperature, and the heating device 4 has a length of 4 ms.
An electrostatic powder coating machine was used as the powder spreader 8, and the feed speed of the roller conveyor 10 was 6 m/min. As the adhesive polyolefin resin powder 2, Atmer powder NS-100 manufactured by Mitsui Petrochemical Industries, Ltd. was used, and as the paper 6, commonly used thin paper 28F was used.
/M2 was used. As the wood board 1, a 2.7 mm thick Takehara board manufactured by Takehara Kogyo Co., Ltd. was used.
まず木質板1の上に、三井石油化学工業株式会社製アト
マーの粉末NS−100を20f/M2の割合で均一に
散布しつつ加熱装置4に送り、上面から加熱して樹脂の
融点近くまで温度を上げ加熱ロール5を通して加熱、加
圧を行い樹脂を熔融させながら、樹脂と木質板とを接着
せしめ、同時に均等、平滑な樹脂層を形成した。引続い
て長尺の紙6を上部から供給して樹脂層の上に重ねつつ
加熱ロール7で加熱、加圧しなから貼着を行った。First, Atmer powder NS-100 manufactured by Mitsui Petrochemical Industries, Ltd. is uniformly spread on the wooden board 1 at a rate of 20 f/M2 and sent to the heating device 4, and heated from the top until the temperature approaches the melting point of the resin. The resin was heated and pressed through the heating roll 5 to melt the resin and adhere the resin to the wooden board, at the same time forming an even and smooth resin layer. Subsequently, a long piece of paper 6 was fed from above, and while being overlapped on top of the resin layer, it was heated and pressed with a heating roll 7 before being pasted.
加熱ロール7の熱で樹脂層の表面は再び熔融し、その押
圧力で樹脂層と紙とは強固に接着する。更に加熱ロール
8で再度加熱、加圧を行い樹脂層と紙との接着に万全を
期した。The surface of the resin layer is melted again by the heat of the heating roll 7, and the resin layer and paper are firmly adhered by the pressing force. Further, heating and pressure were applied again using a heating roll 8 to ensure perfect adhesion between the resin layer and the paper.
そののち冷却ロール群9を通過させて樹脂を硬化、安定
させることによって、表面に紙が貼着された、強度、耐
水性の優れた木質板11を得た。Thereafter, the resin was passed through a group of cooling rolls 9 to harden and stabilize the resin, thereby obtaining a wood board 11 having excellent strength and water resistance and having paper adhered to the surface.
【図面の簡単な説明】
図面は、本発明方法を実施するために用いた装置の一実
施例の概略正面図である。BRIEF DESCRIPTION OF THE DRAWINGS The drawing is a schematic front view of an embodiment of the apparatus used to carry out the method of the invention.
Claims (1)
接着性ポリオレフィン系樹脂の粉末を散布し、これを予
熱したのち熱ロールで加熱加圧して木質板面に均等に耐
着させ、次いでこの上に伸縮性を有しない紙を乗せ、そ
の上から熱ロールで加熱、加圧して前記紙を木質板面に
貼りつけることを特徴とする木質板上に紙を貼着する方
法。Adhesive polyolefin resin powder is sprinkled on a wooden board such as particle board or fiberboard, and after preheating it, it is heated and pressed with a hot roll to make it adhere evenly to the wooden board surface, and then a stretchable resin is applied on top of this. A method for pasting paper onto a wooden board, which comprises placing paper that does not have a carbon fiber on the surface of the wood board, and heating and pressing the paper with a hot roll to paste the paper onto the surface of the wood board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8472083A JPS59209858A (en) | 1983-05-14 | 1983-05-14 | Method of pasting paper on woody board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8472083A JPS59209858A (en) | 1983-05-14 | 1983-05-14 | Method of pasting paper on woody board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59209858A true JPS59209858A (en) | 1984-11-28 |
Family
ID=13838512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8472083A Pending JPS59209858A (en) | 1983-05-14 | 1983-05-14 | Method of pasting paper on woody board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59209858A (en) |
-
1983
- 1983-05-14 JP JP8472083A patent/JPS59209858A/en active Pending
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