JPS5918453U - 発光ダイオ−ド - Google Patents

発光ダイオ−ド

Info

Publication number
JPS5918453U
JPS5918453U JP1982113120U JP11312082U JPS5918453U JP S5918453 U JPS5918453 U JP S5918453U JP 1982113120 U JP1982113120 U JP 1982113120U JP 11312082 U JP11312082 U JP 11312082U JP S5918453 U JPS5918453 U JP S5918453U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
lead frame
chips
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982113120U
Other languages
English (en)
Inventor
卜部　鶴郎
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP1982113120U priority Critical patent/JPS5918453U/ja
Publication of JPS5918453U publication Critical patent/JPS5918453U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の発光ダイオードにおける構造断面図、第
２図はその駆動回路、第３図は本考案の一実施例におけ
る発光ダイオードによる構造断面図および第４図はその
駆動回路を示す。 図において、１，１ａ、１ｂは発光ダイオード半導体チ
ップ、２はリード線、３は樹脂および４ａ、　　４ａａ
、　　４ｂ、　　４ｂｂはリートフレームチある。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属リードフレームの一方の端部にｐ形基板による発光
    ダイオード半導体チップ、他方の金属リードフレームの
    端部にｎ形基板による発光ダイオード半導体チップをマ
    ウントし、両チップの電極をリード線により相互接続し
    て得られたマウント組立を、透明または着色の光散乱樹
    脂により端部をレンズ状に成形すると共にリードフレー
    ムにおける引出し端部を接続端子としてなり、２チツプ
    を直列接続としたことを特徴とする発光ダイオード。
JP1982113120U 1982-07-26 1982-07-26 発光ダイオ−ド Pending JPS5918453U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982113120U JPS5918453U (ja) 1982-07-26 1982-07-26 発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982113120U JPS5918453U (ja) 1982-07-26 1982-07-26 発光ダイオ−ド

Publications (1)

Publication Number Publication Date
JPS5918453U true JPS5918453U (ja) 1984-02-04

Family

ID=30261978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982113120U Pending JPS5918453U (ja) 1982-07-26 1982-07-26 発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS5918453U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63257742A (ja) * 1987-04-15 1988-10-25 Fuji Photo Film Co Ltd 写真プリンタ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63257742A (ja) * 1987-04-15 1988-10-25 Fuji Photo Film Co Ltd 写真プリンタ

Similar Documents

Publication Publication Date Title
JPS5918453U (ja) 発光ダイオ−ド
JPS6236312Y2 (ja)
JPH0651001Y2 (ja) 光結合素子
JPH0345668U (ja)
JPS60153557U (ja) 光結合素子
JPS6045451U (ja) 光結合素子
JPH056859U (ja) Ｌｅｄ表示装置
JPS59164258U (ja) 発光ダイオ−ド
JPS63105367U (ja)
JPH0485753U (ja)
JPS6049653U (ja) 三色発光半導体装置
JPS59125850U (ja) Ａｃホトカプラ
JPS62138469U (ja)
JPS60133653U (ja) 発光ダイオ−ド
JPS646054U (ja)
JPS60144258U (ja) 光半導体素子
JPS5872859U (ja) 低損失光散乱発光ダイオ−ド
JPH0396055U (ja)
JPS62112165U (ja)
JPS6365249U (ja)
JPS64350U (ja)
JPS6037261U (ja) 発光ダイオ−ドランプの発光部の放熱構造
JPS59177963U (ja) 発光ダイオ−ド
JPS59109165U (ja) 発光半導体装置
JPS6054352U (ja) 反射型光結合装置