JPS59109165U - 発光半導体装置 - Google Patents

発光半導体装置

Info

Publication number
JPS59109165U
JPS59109165U JP1983003143U JP314383U JPS59109165U JP S59109165 U JPS59109165 U JP S59109165U JP 1983003143 U JP1983003143 U JP 1983003143U JP 314383 U JP314383 U JP 314383U JP S59109165 U JPS59109165 U JP S59109165U
Authority
JP
Japan
Prior art keywords
light emitting
semiconductor device
emitting semiconductor
semiconductor substrate
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983003143U
Other languages
English (en)
Inventor
鶴　静夫
藤原　昌平
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP1983003143U priority Critical patent/JPS59109165U/ja
Publication of JPS59109165U publication Critical patent/JPS59109165U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Measurement Of Optical Distance (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１甲は従来の発光半導体装置を示す構成図、第１図 σ４ −［” 第２図ａは従来の発光半導体装置の平面図、第２図すは
そ（７）Ａ−Ａ’断面図、第３図ａ、　ｂ、　ｃぽ本考
案の実施例を示す要部正面図および各側断面図、第４図
は本考案の実施例を示す構成斜視図で　−ある。 ３１ａ−・・発光素子の裏面、３１ｂ−・・発光素子の
　　　　　・長辺側の側面、３１ｃ・＝ｐ−ｎ接合、３
１ｄ−・・発光　　　　−素子の表面、３１ｅ−・・発
光素子の短辺側の側面、３２・・−ヘッダー、３３−・
導電性接着剤、３４゜４３−・・反射板、３４ｂ−・・
長辺側の反射面、３４ｅ・・・短辺側の反射面、４４−
・・金鳳細線、４３−・リードフレーム、４５．４６−
・・外部端子、４７−・・透光性樹脂。 第２図　　　（０Ｌ）

Claims (1)

    【実用新案登録請求の範囲】
  1. （１）　　主面側にｐｎ接合を有する電導体基板と、前
    記半導体基板の側面に向き合って、導体基板側面Ｑ中一
    部位で穿み、同中間部から前記半導体基板の主面側およ
    び裏面側へそれぞれ広がる形状の反射体をそなえた発光
    半導体装置。 （２１半導体基板および反射体示単−のリードフレーム
    基部に載置された実用新案登録請求の範囲第１項に記載
    の発光半導体装置。 （３１半導体基板のｐｎ接合形状が平面長方形でなる実
    用新案登録請求の一第１項または第２項に記載の発光半
    導体装置。
JP1983003143U 1983-01-12 1983-01-12 発光半導体装置 Pending JPS59109165U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983003143U JPS59109165U (ja) 1983-01-12 1983-01-12 発光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983003143U JPS59109165U (ja) 1983-01-12 1983-01-12 発光半導体装置

Publications (1)

Publication Number Publication Date
JPS59109165U true JPS59109165U (ja) 1984-07-23

Family

ID=30134773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983003143U Pending JPS59109165U (ja) 1983-01-12 1983-01-12 発光半導体装置

Country Status (1)

Country Link
JP (1) JPS59109165U (ja)

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