JPS5914644A - Lead frame positioning device for assembling semiconductor device - Google Patents
Lead frame positioning device for assembling semiconductor deviceInfo
- Publication number
- JPS5914644A JPS5914644A JP57123976A JP12397682A JPS5914644A JP S5914644 A JPS5914644 A JP S5914644A JP 57123976 A JP57123976 A JP 57123976A JP 12397682 A JP12397682 A JP 12397682A JP S5914644 A JPS5914644 A JP S5914644A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- frame
- base
- positioning
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 230000032258 transport Effects 0.000 claims 3
- 230000007723 transport mechanism Effects 0.000 claims 1
- 230000000717 retained effect Effects 0.000 abstract 1
- 210000000078 claw Anatomy 0.000 description 11
- 239000008188 pellet Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明はたとえばグイボンディングまたはワイヤボン
デ１ング等の半導体装置組立工程において、リードフレ
ームを間欠送シして所定位置に位置決めするためのリー
ドフレーム位置決め装置に関する。Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to a lead frame positioning device for intermittently feeding and positioning a lead frame at a predetermined position in a semiconductor device assembly process such as wire bonding or wire bonding. Regarding.
集積回路等の半導体製品は第１図に示すように、薄板状
のリードフレーム１上に複数の半導体ペレット２を等間
隔に固着し、リードフレーム１の各リードポストと各半
導体ペレット２のパッドとにワ１ヤ３を放射状に配線す
ることによシ構成されている。上記製品の製造過程゛に
おいて、半導体ペレット２の接着はダイボンダにより、
ワづヤ３の接続はワづヤボンダによってそれぞれ行なわ
れる。そこで、これらのボンダのボンデ１フフ作業を実
施するため、リードフレーム１を各ボッディング作業位
置で停止させ、かつ、当該作業を受ける箇所を順次移動
させることが必要となり、これを実施するためリードフ
レーム１の間欠送り装置が使用される。As shown in FIG. 1, semiconductor products such as integrated circuits are manufactured by fixing a plurality of semiconductor pellets 2 on a thin lead frame 1 at equal intervals, and connecting each lead post of the lead frame 1 with the pad of each semiconductor pellet 2. It is constructed by wiring wires 3 radially throughout the area. In the manufacturing process of the above product, the semiconductor pellet 2 is bonded using a die bonder.
The wires 3 are each connected by wire bonders. Therefore, in order to carry out the bonding work of these bonders, it is necessary to stop the lead frame 1 at each boding work position and move the parts receiving the work in sequence. 1 intermittent feed device is used.
従来、この種の間欠送シ装置として、リードフレーム１
の抜き孔１ｂに係合自在な送シ爪（図示しない）を設け
るとともに０、送シ爪をカムまたはクランク機構によシ
間欠送シするものとし、リードフレーム１をｌピッチ送
るごとにリードフレーム１０両側端において半導体ベレ
ット２が接着される間隔に応じて等間隔に穿設された位
置決め孔１ｍに第２図で示すように、位置決めビン４を
挿入して位置決めし、リードフレーム１の間欠送りする
ようにしたもの、第３図（Ａ）（Ｂ）に示すように位置
決めビン５の先端を位置決め孔１ａに停止して間欠送り
するようにしたものなどがある。Conventionally, as this type of intermittent transmission device, a lead frame 1
A feed pawl (not shown) that can be freely engaged is provided in the punching hole 1b, and the feed pawl is moved intermittently by a cam or a crank mechanism, so that the lead frame 1 is moved l pitch every time the lead frame 1 is fed l pitch. As shown in FIG. 2, the positioning pins 4 are inserted into positioning holes 1 m that are equally spaced at both ends of 10 and are drilled at equal intervals according to the intervals at which the semiconductor pellets 2 are bonded. There is one in which the tip of the positioning pin 5 is stopped in the positioning hole 1a and is moved intermittently as shown in FIGS. 3(A) and 3(B).
第２図の位置決めビン４は位置決め孔１．ｓよりやや細
くしたもので、位置決めビン４は滑らかに挿入される。The positioning pin 4 in FIG. 2 has a positioning hole 1. It is slightly thinner than s, and the positioning pin 4 can be inserted smoothly.
第３図（Ａ） （Ｂ）は位置決めビン５の先端をテーパ
部く形成し、位置決め孔１ｍに直径のバラツキがあって
も位置決めできるようにしたものである。3(A) and 3(B) show that the tip of the positioning pin 5 is formed into a tapered part so that positioning can be performed even if there is variation in the diameter of the positioning hole 1m.
しかしながら、前者のものは、位置決め孔１ｓと位置決
めビン４との間に隙間があるため位置決め精度が悪く、
後者は位置決め精度は良いが、ビン挿入時と抜出時にリ
ードフレーム１を変形させる虞れがあるとともに、第３
図（Ｂ）に示すように、途中で引掛って確実に位置決め
ができないという欠点がある。However, the former has poor positioning accuracy because there is a gap between the positioning hole 1s and the positioning bin 4.
The latter has good positioning accuracy, but there is a risk of deforming the lead frame 1 when inserting and removing the bottle, and the third
As shown in Figure (B), there is a drawback that it gets caught in the middle and cannot be reliably positioned.
この発明＃ま上記事情に着目してなされたもので、その
目的とするところは、リードフレームを変形、破損させ
ることなく確実に搬送して所定位置く位置決めすること
ができる°ツ、−ドフレーム位置決め装置を提供するこ
とくある。・〔発明の概要〕
リードフレームを搬送する搬送路に板ばねなどの摩擦付
与機構を設け、リードフレームをその進行方向と直角に
押圧するとともに、リードフレームを送シ爪によって搬
送し、所定位置まで搬送したときそのリードフレームを
押え機構によって上下から挟持固定するようにしたこと
にある。This invention was made in view of the above-mentioned circumstances, and its purpose is to provide a lead frame that can reliably transport and position the lead frame at a predetermined position without deforming or damaging the lead frame. A positioning device is often provided.・[Summary of the invention] A friction imparting mechanism such as a leaf spring is provided on the conveyance path for conveying the lead frame, and the lead frame is pressed perpendicularly to its direction of movement, and the lead frame is conveyed by a feed pawl until it reaches a predetermined position. When the lead frame is transported, it is clamped and fixed from above and below by a holding mechanism.
以下、この発明を図面に示す一実施例にもとづいて説明
する。第４図および第５図はリードフレーム位置決め装
置を示すもので、１１は搬送路である。この搬送路１１
は平行に配設した一対のレール１２．Ｉｌｌとこれらレ
ール１２゜１２に設けた案内溝１３，１：Ｉとから構成
されている。そして、これら案内溝１３，１：Ｉによっ
てリードフレーム１を搬送するようになっている。この
リードフレーム１は第１図と同一であるため同一番号を
付してその説明を省略する。The present invention will be described below based on an embodiment shown in the drawings. 4 and 5 show a lead frame positioning device, and 11 is a conveyance path. This conveyance path 11
is a pair of rails 12 arranged in parallel. 1:I and guide grooves 13,1:I provided on these rails 12°12. The lead frame 1 is conveyed by these guide grooves 13, 1:I. Since this lead frame 1 is the same as that shown in FIG. 1, the same reference numerals are given and the explanation thereof will be omitted.
また、上記一方の案内溝１３にはその長手方向に離間し
て２個の凹所１４．１４が設けられ、これら凹所１４．
１４には摩擦付与機構を構成する板はね１５，１５が設
けられている。そして、これら板はね１５．１５はリー
ドフレーム１の一側面を押圧してリードフレーム１を他
方の案内溝１Ｂに押し付け、リードフレーム１の−進行
方向（矢印イ方向）と直角（矢印口）に摩擦力を付与す
るようになっている。また、上記。Further, one of the guide grooves 13 is provided with two recesses 14.14 spaced apart from each other in the longitudinal direction thereof, and these recesses 14.
14 is provided with plate springs 15, 15 constituting a friction applying mechanism. These plate springs 15.15 press one side of the lead frame 1 and press the lead frame 1 against the other guide groove 1B, and are perpendicular to the -progressing direction (direction of arrow A) of the lead frame 1 (direction of arrow A). It is designed to apply a frictional force to the Also, above.
搬送路１１の上部には移動ペース１６とこの移動ペース
１６の下面に突設されリードフレーム１の位置決め孔１
ａに係合する係合爪１７・・・とからなる搬送機構１８
が設けられている。この搬送機構１８は矢印へに示すよ
うな運動軌跡を描きながら後述する手段によってリード
フレーム１を矢印１方向に搬送するようになっている。In the upper part of the conveyance path 11, there is a moving pace 16 and a positioning hole 1 of the lead frame 1 protruding from the lower surface of the moving pace 16.
A conveyance mechanism 18 consisting of an engaging claw 17 that engages with a.
is provided. This conveyance mechanism 18 is configured to convey the lead frame 1 in the direction of the arrow 1 by means described later while drawing a movement locus as shown by the arrow.
さらに、搬送路１１の中途部には下部に設けたヒータ１
９と上部に設けた押え蓋２０とからなる押え機構２１が
設けられている。この押え機構２１はリードフレーム１
が所定位装置まで搬送されたとき押え蓋２０が下降して
ヒータ１゛９との間でリードフレーム１を挾持するよう
になっている。Furthermore, a heater 1 provided at the lower part of the conveyance path 11 is provided.
9 and a presser cover 20 provided at the top. This holding mechanism 21 is the lead frame 1
When the lead frame 1 is transported to a predetermined position, the holding lid 20 is lowered to clamp the lead frame 1 between the heater 1 and the heater 19.
しかして、第４図に示すように、リードフレーム１を板
はね１５．１５によって進行方向と直角方向に押圧叫、
摩擦力を付与した状態において、搬送機構１８の移動ペ
ース１６がまず下降すると係合爪１７・・・がリードフ
レーム１の位置決め孔１ａ・・・に挿入する。この状態
で、移動ペースＪ６が進行方向へ移動すると、係合爪１
７・・・によってリードフレーム１は摺動する。As shown in FIG.
When the moving pace 16 of the conveyance mechanism 18 first descends while a frictional force is applied, the engaging claws 17 are inserted into the positioning holes 1a of the lead frame 1. In this state, when the moving pace J6 moves in the advancing direction, the engaging claw 1
7... causes the lead frame 1 to slide.
このとき、リードフレーム１＃ま板ばね１５゜ｌ５によ
って摩擦力が付与されているため、係合爪１７は位置決
め孔１ａの進行方向側に当接する。したがって、係合爪
１７と位置決め孔１８との間に隙間（ｇ）が生じてもリ
ードフレーム１は係合爪１７によって正確に位置決めさ
れることになる。このようにしてリードフレーム１が１
ピツチすなわちＦ９ｉ定位置まで搬送されると、押え蓋
２０が下降してリードフレーム１をヒータ１９との間で
挟持固定する。この状態で、移動ベース１６が上昇する
と、係合爪１７・・・が位置決め孔１ｍから抜出するが
、このときリードフレーム１は押え機構２１によって固
定されているために位置ずれすることはなく、所定位置
に保持されることになる。一方、移動ベースＪ６は上昇
位置において進行方向と逆方向に戻りつぎのり−ドフレ
ーム１に対向し、ｌｆ１クルが完了する。At this time, since a frictional force is applied by the lead frame 1# cutter leaf spring 15°l5, the engaging claw 17 comes into contact with the positioning hole 1a on the advancing direction side. Therefore, even if a gap (g) occurs between the engaging claw 17 and the positioning hole 18, the lead frame 1 will be accurately positioned by the engaging claw 17. In this way, lead frame 1
When the lead frame 1 is conveyed to the pitch, that is, the fixed position F9i, the presser lid 20 is lowered to clamp and fix the lead frame 1 between it and the heater 19. In this state, when the movable base 16 rises, the engaging claws 17... are pulled out from the positioning hole 1m, but at this time, the lead frame 1 is fixed by the holding mechanism 21, so it does not shift. , will be held in place. On the other hand, the movable base J6 returns to the raised position in the opposite direction to the traveling direction and faces the next board frame 1, completing the lf1 cycle.
この発明は以上説明したように、リードフレームを搬送
する搬送路に摩擦付与機構を設け、リードフレームをそ
の進行方向と直角に押圧するようにしたから、リードフ
レームを係合爪によって搬送固定する際に、係合爪がリ
ードフレームの位置決め孔に密着した状態となり、位置
決めが正確にできる。しかも、所定位置まで搬送したの
ち押えｍ構によってリードフレームを挟持固定し九から
係合爪を位置決め孔から抜出する際に位置ずれすること
なく、ｔた。変形を与えることがなく、所定位置に正確
に位置決めすることができる□という効果を奏する。As explained above, in this invention, a friction applying mechanism is provided on the conveyance path for conveying the lead frame, and the lead frame is pressed perpendicularly to its traveling direction, so that when the lead frame is conveyed and fixed by the engaging claw, In addition, the engaging claws are brought into close contact with the positioning holes of the lead frame, allowing accurate positioning. Moreover, after the lead frame is conveyed to a predetermined position, the lead frame is clamped and fixed by the presser mechanism, and when the engaging claw is pulled out from the positioning hole, the position does not shift. This has the effect that it can be accurately positioned at a predetermined position without causing deformation.
第１図はリードフレームの平面図、第２図およびｆ４３
図（Ａ） （Ｂ）は従来のリードフレーム位置決め装置
を説明するための一部を示す断面図、第４図はこの発明
の一実施例を示す平面図、第５図は同じく断面図である
。
１１・・・搬送路、１５・・・板はね（摩擦付与機構）
、１８・・・搬送機構、１７・・・係合爪、２１・・・
押え機構。
出願人代理人 弁理土鈴 法式 彦
３Ｉｐｔ図
３ＩＰ２図
矛３図
（Ａ） （Ｂ）
３Ｉ？４図Figure 1 is a plan view of the lead frame, Figure 2 and f43
Figures (A) and (B) are cross-sectional views showing a part of a conventional lead frame positioning device, Figure 4 is a plan view showing an embodiment of the present invention, and Figure 5 is a cross-sectional view as well. . 11... Conveyance path, 15... Plate spring (friction imparting mechanism)
, 18... Conveyance mechanism, 17... Engagement claw, 21...
Presser foot mechanism. Applicant's agent Patent attorney Dorin Legal formula Hiko 3 Ipt Figure 3 IP 2 Figure 3 (A) (B) 3I? Figure 4
Claims (1)
られリードフレームをその進行方向と直角に押圧し摩擦
力を付与する摩擦付与機構と、上記リードフレームと係
合する送シ爪を有しリードフレームを搬送路に沿って搬
送する搬送機構と、上記搬送路に上下に対向して設けら
れ所定位置まで搬送したときそのリードフレームを上下
方向に挟持固定する押え機構とを具備したことを特徴と
する半導体装置組立用リードフレーム位置決め装置。A lead having a conveyance path for conveying the lead frame, a friction applying mechanism provided on the conveyance path for pressing the lead frame perpendicular to its traveling direction and applying a frictional force, and a feed pawl that engages with the lead frame. The lead frame is characterized by being equipped with a transport mechanism that transports the frame along a transport path, and a holding mechanism that is provided vertically opposite to the transport path and clamps and fixes the lead frame in the vertical direction when the lead frame is transported to a predetermined position. Lead frame positioning device for semiconductor device assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57123976A JPS5914644A (en) | 1982-07-16 | 1982-07-16 | Lead frame positioning device for assembling semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57123976A JPS5914644A (en) | 1982-07-16 | 1982-07-16 | Lead frame positioning device for assembling semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5914644A true JPS5914644A (en) | 1984-01-25 |
Family
ID=14873962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57123976A Pending JPS5914644A (en) | 1982-07-16 | 1982-07-16 | Lead frame positioning device for assembling semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5914644A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01145417A (en) * | 1987-11-30 | 1989-06-07 | Hitachi Ltd | Thrust bearing |
| JP2004207297A (en) * | 2002-12-24 | 2004-07-22 | Para Light Electronics Co Ltd | Method for manufacturing external heat sink structure of light emitting diode |
-
1982
- 1982-07-16 JP JP57123976A patent/JPS5914644A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01145417A (en) * | 1987-11-30 | 1989-06-07 | Hitachi Ltd | Thrust bearing |
| JP2004207297A (en) * | 2002-12-24 | 2004-07-22 | Para Light Electronics Co Ltd | Method for manufacturing external heat sink structure of light emitting diode |
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