JPH0752740B2 - Bonding method - Google Patents
Bonding methodInfo
- Publication number
- JPH0752740B2 JPH0752740B2 JP63166545A JP16654588A JPH0752740B2 JP H0752740 B2 JPH0752740 B2 JP H0752740B2 JP 63166545 A JP63166545 A JP 63166545A JP 16654588 A JP16654588 A JP 16654588A JP H0752740 B2 JPH0752740 B2 JP H0752740B2
- Authority
- JP
- Japan
- Prior art keywords
- bond tool
- bonding
- sample
- bond
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明はインナーリードボンダー、アウターリードボン
ダー、バンプボンダー等におけるボンデイング方法に係
り、特にテープに形成された複数のリードにIC又は基板
等（以下ICで総称する）の複数個のバンプ又は複数個の
バンプ単体をギャグボンデイング（同時多点接合）する
ボンデイング方法に関する。Description: TECHNICAL FIELD The present invention relates to a bonding method for an inner lead bonder, an outer lead bonder, a bump bonder, etc., and particularly to an IC or a substrate (hereinafter Generically referred to as IC) and a bonding method for gag bonding (simultaneous multi-point bonding) of a plurality of bumps or a plurality of bumps alone.
［従来の技術］ 従来のギャグボンデイング方法として、例えば特開昭54
−11664号公報及び特開昭54−11667号公報に示すものが
知られている。この方法は、第３図及び第４図に示すよ
うに、ガイド板１に沿って間欠移送されるテープ２に形
成されたリード３と試料台４により順次送られるIC5と
を位置合せした後、ボンドツール６を下降、試料台４を
上昇させて複数のリード３にIC5の複数のバンプ5aをボ
ンデイングする。ボンデイング後は、ボンドツール６が
上昇、試料台４が下降し、その後にテープ２が移送され
て次のリード３部分がボンデイング位置に位置され、ま
た試料台４が送られて次のIC5がボンデイング位置に位
置され、前記した動作を行ってボンデイングされる。[Prior Art] As a conventional gag bonding method, for example, Japanese Patent Laid-Open No.
The ones disclosed in Japanese Patent Laid-Open No. 11664 and Japanese Patent Laid-Open No. 54-11667 are known. In this method, as shown in FIGS. 3 and 4, after aligning the leads 3 formed on the tape 2 which is intermittently transferred along the guide plate 1 and the IC 5 which is sequentially fed by the sample table 4, The bond tool 6 is lowered and the sample table 4 is raised to bond the bumps 5a of the IC 5 to the leads 3. After bonding, the bond tool 6 rises and the sample table 4 descends, then the tape 2 is transferred and the next lead 3 part is positioned at the bonding position, and the sample table 4 is sent to bond the next IC5. It is placed in the position and bonded by performing the above-mentioned operation.
上記従来の方法は、ボンドツール６を常に一定位置で上
下動させてボンデイングを行っている。In the above-mentioned conventional method, bonding is performed by always moving the bond tool 6 up and down at a fixed position.
［発明が解決しようとする課題］ 上記従来技術は、ボンドツール６と試料（リード３及び
IC5）との接触点が常に同ポジションであり、ボンドツ
ール６の一定箇所が常に試料に圧接するので、摩耗箇所
が限定され、ボンドツール６の寿命が短いという問題が
あった。[Problems to be Solved by the Invention] In the above-described conventional technique, the bond tool 6 and the sample (lead 3 and
Since the contact point with IC5) is always at the same position and a fixed part of the bond tool 6 is constantly in pressure contact with the sample, there is a problem that the wear part is limited and the life of the bond tool 6 is short.
本発明の目的は、ボンドツールの寿命を大幅に向上させ
ることができるボンデイング方法を提供することにあ
る。An object of the present invention is to provide a bonding method that can significantly improve the life of a bond tool.
［課題を解決するための手段］ 上記目的は、ボンドツールと試料側との相対位置を毎回
又は複数回毎に変え、ボンドツールと試料との圧接面を
変えてギャグボンデイングすることにより達成される。[Means for Solving the Problems] The above object is achieved by changing the relative position between the bond tool and the sample side every time or every plural times, and changing the pressure contact surface between the bond tool and the sample for gag bonding. .
［作用］ ボンドツールが試料に接触する位置を毎回又は複数回毎
に変えてボンデイングするので、摩耗が均一化でき、ボ
ンドツールの寿命が大幅に向上する。[Operation] Bonding is performed by changing the position where the bond tool comes into contact with the sample every time or every plural times, so that wear can be made uniform and the life of the bond tool is significantly improved.
［実施例］ 以下、本発明の一実施例を第１図及び第２図により説明
する。なお、第３図及び第４図と同じ又は相当部材には
同一符合を付して説明する。リード３とIC5とを位置合
せされた後、ボンドツール６が実線6Aで示すように下降
し、また試料台４が上昇して複数のリード３にIC5の複
数のバンプ5aをボンデイングする。ボンデイング後は、
ボンドツール６が上昇、試料台４が下降する。次にテー
プ２が移送されて次のリード３部分がボンデイング位置
に位置され、また試料台４が送られて次のIC5がボンデ
イング位置に位置される。以上の動作は従来と同じであ
る。[Embodiment] An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. The same or corresponding members as those in FIGS. 3 and 4 are designated by the same reference numerals for description. After the lead 3 and the IC 5 are aligned with each other, the bond tool 6 descends as shown by a solid line 6A, and the sample table 4 rises to bond the plurality of bumps 5a of the IC 5 to the plurality of leads 3. After bonding,
The bond tool 6 rises and the sample table 4 descends. Next, the tape 2 is transferred to position the next lead 3 at the bonding position, and the sample table 4 is sent to position the next IC 5 at the bonding position. The above operation is the same as the conventional one.
次にボンドツール６が下降する前又はボンドツール６の
下降と同時に、ボンドツール６は図示しないXYテーブル
によって一点鎖線6Bで示すように水平方向に移動させら
れて下降し、試料台４が上昇してリード３にバンプ5aが
ボンデイングされる。その後は前記した動作と同様にボ
ンドツール６が上昇、試料台４が下降する。次のリード
３とIC5とのボンデイングには、ボンドツール６は二点
鎖線6Cで示す水平方向に移動させられて行われる。以
後、ボンドツール６は6A、6B、6Cの順に位置を変えてボ
ンデイングが行われる。Next, before the bond tool 6 descends, or at the same time as the bond tool 6 descends, the bond tool 6 is moved horizontally by the XY table (not shown) as shown by the alternate long and short dash line 6B and descends, and the sample table 4 rises. The bump 5a is bonded to the lead 3. After that, the bond tool 6 is raised and the sample stage 4 is lowered similarly to the above-described operation. The bonding between the lead 3 and the IC 5 is performed by moving the bond tool 6 in the horizontal direction indicated by the chain double-dashed line 6C. After that, the bond tool 6 is changed in position in the order of 6A, 6B, and 6C, and bonding is performed.
このように、ボンドツール６が試料に接触する位置を毎
回又は複数回毎に変えてボンデイングするので、摩耗が
均一化でき、ボンドツール６の寿命が大幅に向上する。In this way, the bonding tool 6 is bonded by changing the position of contact with the sample every time or every plural times, so that wear can be made uniform and the life of the bond tool 6 is significantly improved.
なお、上記実施例においては、毎回ボンドツール６の位
置を変えたが、複数回毎に変えるようにしてもよい。ま
たボンドツール６の位置を変えたが、ボンドツール６の
位置は一定で、テープ２を支持しているXYテーブル及び
試料台４を支持しているXYテーブルを駆動して試料側を
ボンドツール６に対してずらしてもよい。Although the position of the bond tool 6 is changed every time in the above embodiment, it may be changed every plural times. Although the position of the bond tool 6 is changed, the position of the bond tool 6 is constant, and the XY table supporting the tape 2 and the XY table supporting the sample table 4 are driven to move the bond tool 6 to the sample side. You may shift with respect to.
［発明の効果］ 以上の説明から明らかなように、本発明によれば、ボン
ドツールが試料に接触する位置を毎回又は複数回毎に変
えてボンデイングするので、摩耗が均一化でき、ボンド
ツールの寿命が大幅に向上する。[Effects of the Invention] As is clear from the above description, according to the present invention, the position where the bond tool comes into contact with the sample is changed every time or every plural times to perform bonding, so that the wear can be made uniform and the bond tool The life is greatly improved.
第１図（ａ）（ｂ）は本発明の一実施例の動作を示す正
面図、第２図は試料とボンドツールとの接触位置を示す
平面図、第３図（ａ）（ｂ）は従来例の動作を示す正面
図、第４図は試料とボンドツールとの接触位置を示す平
面図である。 2:テープ、3:リード、 5a:バンプ、6:ボンドツール、 6A、6B、6C:ボンドツールの試料への接触位置。1 (a) and (b) are front views showing the operation of one embodiment of the present invention, FIG. 2 is a plan view showing the contact position between the sample and the bond tool, and FIGS. 3 (a) and (b) are FIG. 4 is a front view showing the operation of the conventional example, and FIG. 4 is a plan view showing the contact position between the sample and the bond tool. 2: Tape, 3: Lead, 5a: Bump, 6: Bond tool, 6A, 6B, 6C: Bond tool contact position on the sample.
Claims (1)
のバンプとをボンドツールで圧接させてギャグボンデイ
ングするボンデイング方法において、ボンドツールと試
料側との相対位置を毎回又は複数回毎に変え、ボンドツ
ールと試料との圧接面を変えてギャグボンデイングする
ことを特徴とするボンデイング方法。1. A bonding method in which a plurality of leads and a plurality of bumps formed on a tape are pressed against each other with a bond tool to perform gag bonding, and the relative position between the bond tool and the sample side is changed every time or every plural times. Bonding method characterized by changing the pressure contact surface between the bond tool and the sample to perform gag bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63166545A JPH0752740B2 (en) | 1988-07-04 | 1988-07-04 | Bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63166545A JPH0752740B2 (en) | 1988-07-04 | 1988-07-04 | Bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0216746A JPH0216746A (en) | 1990-01-19 |
| JPH0752740B2 true JPH0752740B2 (en) | 1995-06-05 |
Family
ID=15833258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63166545A Expired - Lifetime JPH0752740B2 (en) | 1988-07-04 | 1988-07-04 | Bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0752740B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5204282A (en) * | 1988-09-30 | 1993-04-20 | Nippon Soken, Inc. | Semiconductor circuit structure and method for making the same |
| US6437168B1 (en) | 2000-09-05 | 2002-08-20 | Nippon Shokubai Co., Ltd. | Method for production of aromatic fluorine compound |
-
1988
- 1988-07-04 JP JP63166545A patent/JPH0752740B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0216746A (en) | 1990-01-19 |
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