JPS59112940U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS59112940U JPS59112940U JP1983189055U JP18905583U JPS59112940U JP S59112940 U JPS59112940 U JP S59112940U JP 1983189055 U JP1983189055 U JP 1983189055U JP 18905583 U JP18905583 U JP 18905583U JP S59112940 U JPS59112940 U JP S59112940U
- Authority
- JP
- Japan
- Prior art keywords
- support
- semiconductor device
- model registration
- mentioned utility
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図〜第9図は、それぞれ、本考案半導体装置の異な
る実施例を示す部分的縦断面図である。 1・・・シリコントランジスタペレット、2・・・支持
体、3.4・・・リード線。
る実施例を示す部分的縦断面図である。 1・・・シリコントランジスタペレット、2・・・支持
体、3.4・・・リード線。
Claims (1)
- 【実用新案登録請求の範囲】 1 少なくとも1個の半導体素子を炭化ケイ素を主成分
とする焼結支持体に載置していることを特徴とする半導
体装置。 2 上記実用新案登録請求の範囲第1項記載の半導体装
置において、支持体は更に金属製の支持体に載置されて
いることを特徴とする半導体装置。 3 上記実用新案登録請求の範囲第1項記載の半導体装
置において、半導体素子は支持体に直接あるいはろう層
を介して載置されていることを特徴とする半導体装置。 4 上記実用新案登録請求の範囲第1項記載の半導体装
置において、半導体素子はキャップが支持体と共に形成
する封止体中に封止されていることを特徴とする半導体
装置。 5 上記実用新案登録請求の範囲第1項記載の半導体装
置において、支持体は炭化ケイ素を主成分としたアルミ
ニウムとの焼結体よりなること ゛を特徴とする半導体
装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983189055U JPS59112940U (ja) | 1983-12-07 | 1983-12-07 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983189055U JPS59112940U (ja) | 1983-12-07 | 1983-12-07 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59112940U true JPS59112940U (ja) | 1984-07-30 |
Family
ID=30407705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983189055U Pending JPS59112940U (ja) | 1983-12-07 | 1983-12-07 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59112940U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62128535A (ja) * | 1985-11-29 | 1987-06-10 | Fujitsu Ltd | 半導体装置 |
-
1983
- 1983-12-07 JP JP1983189055U patent/JPS59112940U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62128535A (ja) * | 1985-11-29 | 1987-06-10 | Fujitsu Ltd | 半導体装置 |
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