JPS59112940U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS59112940U
JPS59112940U JP1983189055U JP18905583U JPS59112940U JP S59112940 U JPS59112940 U JP S59112940U JP 1983189055 U JP1983189055 U JP 1983189055U JP 18905583 U JP18905583 U JP 18905583U JP S59112940 U JPS59112940 U JP S59112940U
Authority
JP
Japan
Prior art keywords
support
semiconductor device
model registration
mentioned utility
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983189055U
Other languages
Japanese (ja)
Inventor
保敏 栗原
八野　耕明
浩介 中村
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP1983189055U priority Critical patent/JPS59112940U/en
Publication of JPS59112940U publication Critical patent/JPS59112940U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図〜第９図は、それぞれ、本考案半導体装置の異な
る実施例を示す部分的縦断面図である。 １・・・シリコントランジスタペレット、２・・・支持
体、３．４・・・リード線。1 to 9 are partial longitudinal sectional views showing different embodiments of the semiconductor device of the present invention. DESCRIPTION OF SYMBOLS 1... Silicon transistor pellet, 2... Support body, 3.4... Lead wire.

Claims (1)

【実用新案登録請求の範囲】 １　少なくとも１個の半導体素子を炭化ケイ素を主成分
とする焼結支持体に載置していることを特徴とする半導
体装置。 ２　上記実用新案登録請求の範囲第１項記載の半導体装
置において、支持体は更に金属製の支持体に載置されて
いることを特徴とする半導体装置。 ３　上記実用新案登録請求の範囲第１項記載の半導体装
置において、半導体素子は支持体に直接あるいはろう層
を介して載置されていることを特徴とする半導体装置。 ４　上記実用新案登録請求の範囲第１項記載の半導体装
置において、半導体素子はキャップが支持体と共に形成
する封止体中に封止されていることを特徴とする半導体
装置。 ５　上記実用新案登録請求の範囲第１項記載の半導体装
置において、支持体は炭化ケイ素を主成分としたアルミ
ニウムとの焼結体よりなること　゛を特徴とする半導体
装置。[Claims of Utility Model Registration] 1. A semiconductor device characterized in that at least one semiconductor element is mounted on a sintered support whose main component is silicon carbide. 2. The semiconductor device according to claim 1 of the above-mentioned utility model registration, characterized in that the support is further placed on a metal support. 3. The semiconductor device according to claim 1 of the above-mentioned utility model registration, characterized in that the semiconductor element is mounted on a support directly or through a solder layer. 4. The semiconductor device according to claim 1 of the above-mentioned utility model registration, wherein the semiconductor element is sealed in a sealing body formed by the cap together with the support. 5. The semiconductor device according to claim 1 of the above-mentioned utility model registration, characterized in that the support body is made of a sintered body of silicon carbide as a main component and aluminum.
JP1983189055U 1983-12-07 1983-12-07 semiconductor equipment Pending JPS59112940U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983189055U JPS59112940U (en) 1983-12-07 1983-12-07 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983189055U JPS59112940U (en) 1983-12-07 1983-12-07 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS59112940U true JPS59112940U (en) 1984-07-30

Family

ID=30407705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983189055U Pending JPS59112940U (en) 1983-12-07 1983-12-07 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS59112940U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128535A (en) * 1985-11-29 1987-06-10 Fujitsu Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128535A (en) * 1985-11-29 1987-06-10 Fujitsu Ltd Semiconductor device

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