JPS5897844U - High power hybrid integrated circuit device - Google Patents
High power hybrid integrated circuit deviceInfo
- Publication number
- JPS5897844U JPS5897844U JP19694481U JP19694481U JPS5897844U JP S5897844 U JPS5897844 U JP S5897844U JP 19694481 U JP19694481 U JP 19694481U JP 19694481 U JP19694481 U JP 19694481U JP S5897844 U JPS5897844 U JP S5897844U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- high power
- power hybrid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の高電力用混成集積回路装置の一例を示す
断面図、第２図は同装置の要部を示す分解斜視図、第３
図は本考案の高電力用混成集積回路装置の一実施例を示
す断面図、第４図は同装置の要部を示す分解斜視図であ
る。
３・・・・・・樹脂パッケージ、４・・・・・・印刷基
板、５・・・・・・半導体ＩＣチップ、６・・・・・・
アルミナ磁器基板、７・・・・・・ヒートスプレッダ、
８・・・・・・パワートランジスタチップ、１０・・・
・・・放熱板、１１・・聞バランサ、１０ａ、１１ａ・
・・・・・嵌合部。Fig. 1 is a cross-sectional view showing an example of a conventional high-power hybrid integrated circuit device, Fig. 2 is an exploded perspective view showing the main parts of the device, and Fig. 3 is a cross-sectional view showing an example of a conventional high-power hybrid integrated circuit device.
The figure is a sectional view showing an embodiment of the high power hybrid integrated circuit device of the present invention, and FIG. 4 is an exploded perspective view showing the main parts of the device. 3...Resin package, 4...Printed circuit board, 5...Semiconductor IC chip, 6...
Alumina porcelain substrate, 7... heat spreader,
8...Power transistor chip, 10...
... Heat sink, 11... Balancer, 10a, 11a.
·····Fitting portion.
Claims (1)
放熱板に、この放熱板に対向するように配置される金属
よりなるバランサを嵌合し、かつその放熱板とバランサ
とを樹脂パッケージに一体化成形した高電力用混成集積
回路装置。A balancer made of metal and arranged to face the heat sink is fitted to a heat sink on which semiconductor IC chips, transistor chips, etc. are placed, and the heat sink and balancer are integrally molded into a resin package. High power hybrid integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19694481U JPS5897844U (en) | 1981-12-25 | 1981-12-25 | High power hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19694481U JPS5897844U (en) | 1981-12-25 | 1981-12-25 | High power hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5897844U true JPS5897844U (en) | 1983-07-02 |
Family
ID=30110170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19694481U Pending JPS5897844U (en) | 1981-12-25 | 1981-12-25 | High power hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5897844U (en) |
-
1981
- 1981-12-25 JP JP19694481U patent/JPS5897844U/en active Pending
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