JPS5844895U - heat dissipation device - Google Patents
heat dissipation deviceInfo
- Publication number
- JPS5844895U JPS5844895U JP13944481U JP13944481U JPS5844895U JP S5844895 U JPS5844895 U JP S5844895U JP 13944481 U JP13944481 U JP 13944481U JP 13944481 U JP13944481 U JP 13944481U JP S5844895 U JPS5844895 U JP S5844895U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation device
- hole group
- heat
- dissipation member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図イは従来の装置における放熱孔群を示す平面図、
第１図口は従来装置の熱による対流状態を示す縦断正面
図、第２図イは本考案装置における放熱孔群を示す平面
図、第２図口は本考案装置の熱による対流状態を示す縦
断正面図、第３図は従来装置と本考案装置の筐体上面部
の測定温度をグラフにしたものである。
１：筐体、２：放熱孔、３：ヒートシンク。Figure 1A is a plan view showing a group of heat radiation holes in a conventional device;
The opening in Figure 1 is a vertical front view showing the state of convection due to heat in the conventional device. Figure 2 A is a plan view showing the group of heat radiation holes in the device of the present invention. The opening in Figure 2 shows the state of convection due to heat in the device of the present invention. The longitudinal sectional front view, FIG. 3, is a graph of the temperature measured at the upper surface of the casing of the conventional device and the device of the present invention. 1: Housing, 2: Heat radiation hole, 3: Heat sink.
Claims (1)
筐体の上面部に設けられたる放熱孔群を放熱部材に対し
て複数個所に分割し、かつ上記放熱部材の中心部より略
々等距離に上記放熱孔群を配設したことを特徴とする放
熱装置。In devices that release internal heat loss from electronic equipment to the outside world,
The heat dissipation hole group provided on the upper surface of the housing is divided into a plurality of locations with respect to the heat dissipation member, and the heat dissipation hole group is arranged at approximately the same distance from the center of the heat dissipation member. Heat dissipation device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13944481U JPS5844895U (en) | 1981-09-18 | 1981-09-18 | heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13944481U JPS5844895U (en) | 1981-09-18 | 1981-09-18 | heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5844895U true JPS5844895U (en) | 1983-03-25 |
Family
ID=29932634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13944481U Pending JPS5844895U (en) | 1981-09-18 | 1981-09-18 | heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5844895U (en) |
-
1981
- 1981-09-18 JP JP13944481U patent/JPS5844895U/en active Pending
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