JPS5887356U - semiconductor equipment - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はビスの取り付は穴の形状が円である従来のパッ
ケージの平面図、第２図は第１図を上方向より見た断面
図で外付は放熱板にビスで取り付けられた状態である。 第３図はビスの取り付は穴２個の内、片方の穴の形状を
横方向に広げたパッケージの従来例の平面図、第４図は
本考案の切り込みを２個の穴両方に施したパッケージの
平面図、第５図は第４図の穴の形状の詳細図である。 １０１・・・円形状の穴、１０２・・・内部放熱板、１
０３・・・モールド樹脂、１０４・・・リード、２０１
・・・外付は放熱板、２０２・・・ビス、３０１・・・
横方向へ広げた形状の穴、４０１・・・切り込みを設け
た穴。Figure 1 is a plan view of a conventional package with circular holes for screw attachment, and Figure 2 is a cross-sectional view of Figure 1 viewed from above, showing that external components are attached to the heat sink with screws. state. Figure 3 is a plan view of a conventional package in which the shape of one of the two holes is widened laterally for screw installation, and Figure 4 is a plan view of a conventional example of a package in which the notches of the present invention are made in both holes. FIG. 5, which is a plan view of the package, is a detailed view of the shape of the hole shown in FIG. 101...Circular hole, 102...Internal heat sink, 1
03...Mold resin, 104...Lead, 201
... External heat sink, 202... screw, 301...
A hole with a shape that expands in the horizontal direction, 401... A hole with a notch.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外部へ取り付けるための穴が設けである金属板を有する
半導体装置において、前記穴に切り込みが設けである事
を特徴とする半導体装置。1. A semiconductor device comprising a metal plate provided with a hole for external attachment, characterized in that the hole is provided with a notch.