JPS58191694U - heat dissipation device - Google Patents
heat dissipation deviceInfo
- Publication number
- JPS58191694U JPS58191694U JP8965182U JP8965182U JPS58191694U JP S58191694 U JPS58191694 U JP S58191694U JP 8965182 U JP8965182 U JP 8965182U JP 8965182 U JP8965182 U JP 8965182U JP S58191694 U JPS58191694 U JP S58191694U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- plate
- dissipation device
- top plate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示す展開斜視図、及び第２
図はその断面図である。
主な図番の説明、１・・・背板、２・・・天板、３・・
・孔、６・・・パワーＩＣ１７・・・放熱板、９・・・
孔。FIG. 1 is an exploded perspective view showing one embodiment of the present invention, and FIG.
The figure is a sectional view thereof. Explanation of main drawing numbers, 1... Back plate, 2... Top plate, 3...
- Hole, 6... Power IC17... Heat sink, 9...
Hole.
Claims (1)
内に配置された発熱素子を外部から望み得る様に穿設さ
れた孔を有する金属製の背板と、前記発熱素子の放熱を
行う為前記背板に取付固定された放熱板とを備える放熱
装置において、前記背板の前記孔の上方部分であって、
前記放熱板により覆われる部分に複数の孔を設け、前記
放熱板。 から前記天板に伝導される熱量を減少させたことを特徴
とする放熱装置。[Claims for Utility Model Registration] A metal top plate, a metal back whose upper end is in contact with the top plate, and has a hole drilled through it so that a heating element placed inside the cabinet can be seen from the outside. In a heat dissipation device comprising a plate and a heat dissipation plate fixedly attached to the back plate for dissipating heat from the heating element, the upper part of the hole of the back plate,
A plurality of holes are provided in a portion covered by the heat sink. A heat dissipation device characterized in that the amount of heat conducted from the top plate to the top plate is reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8965182U JPS58191694U (en) | 1982-06-15 | 1982-06-15 | heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8965182U JPS58191694U (en) | 1982-06-15 | 1982-06-15 | heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58191694U true JPS58191694U (en) | 1983-12-20 |
Family
ID=30098250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8965182U Pending JPS58191694U (en) | 1982-06-15 | 1982-06-15 | heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58191694U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5030603B1 (en) * | 1971-06-24 | 1975-10-02 |
-
1982
- 1982-06-15 JP JP8965182U patent/JPS58191694U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5030603B1 (en) * | 1971-06-24 | 1975-10-02 |
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