JPS6122394U - Cooling device inside the package - Google Patents

Cooling device inside the package

Info

Publication number
JPS6122394U
JPS6122394U JP10520484U JP10520484U JPS6122394U JP S6122394 U JPS6122394 U JP S6122394U JP 10520484 U JP10520484 U JP 10520484U JP 10520484 U JP10520484 U JP 10520484U JP S6122394 U JPS6122394 U JP S6122394U
Authority
JP
Japan
Prior art keywords
cooling device
package
device inside
components located
located above
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10520484U
Other languages
Japanese (ja)
Inventor
洋一 小川
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP10520484U priority Critical patent/JPS6122394U/en
Publication of JPS6122394U publication Critical patent/JPS6122394U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、電子回路パッケージが、シェルフに搭載され
た状態の斜視図、第２図は、本考案の一実施例の対流誘
導板を搭載した電子回路パッケージの外観図である。 １・・・・・・パッケージ、２・・・・・・対流誘導板
、３・・・・・・シエルフ。FIG. 1 is a perspective view of an electronic circuit package mounted on a shelf, and FIG. 2 is an external view of an electronic circuit package equipped with a convection guide plate according to an embodiment of the present invention. 1...Package, 2...Convection guide plate, 3...Shelf.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体その他の電気部品を搭載し、対流による冷却を行
う電子回路パッケージに於で、上下関係に位置する部品
間に対流誘導板を設け、上に位置する部品が、下に位置
する部品の熱の影響を受けないようにすることを特徴と
するパッケージ内冷却装置。In electronic circuit packages that are equipped with semiconductors and other electrical components and are cooled by convection, a convection guide plate is installed between the components located above and below, so that the components located above absorb the heat of the components located below. An in-package cooling device characterized by being unaffected.
JP10520484U 1984-07-13 1984-07-13 Cooling device inside the package Pending JPS6122394U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10520484U JPS6122394U (en) 1984-07-13 1984-07-13 Cooling device inside the package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10520484U JPS6122394U (en) 1984-07-13 1984-07-13 Cooling device inside the package

Publications (1)

Publication Number Publication Date
JPS6122394U true JPS6122394U (en) 1986-02-08

Family

ID=30664539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10520484U Pending JPS6122394U (en) 1984-07-13 1984-07-13 Cooling device inside the package

Country Status (1)

Country Link
JP (1) JPS6122394U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016157824A (en) * 2015-02-25 2016-09-01 株式会社日立エルジーデータストレージ Optical module and scanning type image display device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016157824A (en) * 2015-02-25 2016-09-01 株式会社日立エルジーデータストレージ Optical module and scanning type image display device
WO2016136466A1 (en) * 2015-02-25 2016-09-01 株式会社日立エルジーデータストレージ Light module and scanning image display device
CN107112717A (en) * 2015-02-25 2017-08-29 日立乐金光科技株式会社 Optical module and ing image display device
US10148920B2 (en) 2015-02-25 2018-12-04 Hitachi-Lg Data Storage, Inc. Optical module and scanning-type image display device

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