JPS62252193A - Method of connecting leads of parts to through-holes of printed board - Google Patents
Method of connecting leads of parts to through-holes of printed boardInfo
- Publication number
- JPS62252193A JPS62252193A JP9518486A JP9518486A JPS62252193A JP S62252193 A JPS62252193 A JP S62252193A JP 9518486 A JP9518486 A JP 9518486A JP 9518486 A JP9518486 A JP 9518486A JP S62252193 A JPS62252193 A JP S62252193A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- circuit board
- printed circuit
- conductive adhesive
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 16
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、プリント基板の組立方法に関し、プリント基
板のスルーホールと部品リードとの接続方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of assembling a printed circuit board, and more particularly to a method of connecting through holes of a printed circuit board and component leads.
［従来の技ｖＲ］
従来プリント基板上に部品を搭載してプリント基板のス
ルーホールと部品リードとを接続する接続方法としては
、はんだ付けによる接続方法が一般的に行われていた。[Conventional Techniques vR] Conventionally, as a connection method for mounting components on a printed circuit board and connecting through holes of the printed circuit board and component leads, soldering has generally been used.
［解決すべき問題点］
このような従来の接続方法では、特にプリント基板の板
圧が大となりかつスルーホールが小径となってアスペク
ト比すなわちプリント基板の板厚／スルーホールの径が
大になると、スルーホール内に溶融はんだを浸透させる
ことが困難になりはんだ付は時に発生するガスがスルー
ホールの内部に滞留しやすくなって、長いはんだ付は時
間を必要とする等の問題点が生じていた。[Problems to be solved] In this conventional connection method, especially when the thickness of the printed circuit board becomes large and the diameter of the through hole becomes small, the aspect ratio, that is, the thickness of the printed circuit board/diameter of the through hole becomes large. , it becomes difficult to infiltrate the molten solder into the through-hole, and the gas that is sometimes generated during soldering tends to stay inside the through-hole, causing problems such as long soldering takes time. Ta.
［問題点の解決手段］
上記従来の問題点を解決すべく本発明は、特に板Ｊ！７
が大で、スルーホールが小径のプリント基板のスルーホ
ールと部品リードとの機械的かつ電気的接続を可能にし
てなる接続方法を提供せんとするものである。[Means for Solving Problems] In order to solve the above-mentioned conventional problems, the present invention is particularly directed to the board J! 7
It is an object of the present invention to provide a connection method that enables mechanical and electrical connection between a through hole of a printed circuit board having a large diameter and a small diameter through hole and a component lead.
そのために本発明は、プリント基板のスルーホールと部
品リードとの接続方法において、前記プリント基板のス
ルーホールに粘性を持った導電性接着剤を充填し、前記
スルーホールに部品リードを挿入し、前記導電性接着剤
に適した温度に加熱することにより、プリント基板のス
ルーホールと部品リードとを導電性接着剤によって電気
的かつ機械的に接続してなることを特徴とする接続方法
を提供するものである。To this end, the present invention provides a method for connecting a through hole of a printed circuit board and a component lead, in which the through hole of the printed circuit board is filled with a viscous conductive adhesive, the component lead is inserted into the through hole, and the component lead is inserted into the through hole. Provided is a connection method characterized by electrically and mechanically connecting a through hole of a printed circuit board and a component lead with a conductive adhesive by heating the conductive adhesive to a temperature suitable for the conductive adhesive. It is.
［実施例］
次に本発明の実施例について添付図面を参照しつつ具体
的に説明する。[Example] Next, an example of the present invention will be specifically described with reference to the accompanying drawings.
第１図は本発明の接続方法の一実施例において導電性接
着剤がプリント基板のスルーホール内に充填された状態
を示す断面図である。第２図は本発明の接続方法の一実
施例においてプリント基板のスルーホール内に充填され
た導電性接着剤により部品リードがスルーホールに対し
て接続された状態を示す断面図である。FIG. 1 is a sectional view showing a state in which a conductive adhesive is filled into a through hole of a printed circuit board in an embodiment of the connection method of the present invention. FIG. 2 is a cross-sectional view showing a state in which a component lead is connected to a through hole of a printed circuit board using a conductive adhesive filled in the through hole in an embodiment of the connection method of the present invention.
先ず本発明の接続方法において使用される各部材につい
て説明する。First, each member used in the connection method of the present invention will be explained.
ｌは粘性を持った導電性接着剤で、プリント基板３のス
ルーホール２内に充填されている。４は部品５から延長
された部品リードで、プリント基板３のスルーホール２
内に充填された導電性接着剤１中に挿通され前記導電性
接着剤１によってスルーホール２に対して固着接続され
ている。1 is a viscous conductive adhesive that is filled into the through hole 2 of the printed circuit board 3. 4 is a component lead extended from component 5, which is connected to through hole 2 of printed circuit board 3.
The conductive adhesive 1 is inserted into the conductive adhesive 1 filled therein, and is firmly connected to the through hole 2 by the conductive adhesive 1.
更に本発明の接続方法の構成および作用について説明す
る。Furthermore, the structure and operation of the connection method of the present invention will be explained.
第１図に示すようにプリント基板３のスルーホール２内
に粘性を持った導電性接着剤ｌが充填される。そののち
第２図に示すように、プリント基板３のスルーホール２
内の導電性接着剤１中に部品５の部品リード４が挿入さ
れる。最後に導電性接着剤１が硬化するまで加熱される
。これにより硬化した導電性接着剤１によってプリント
基板３のスルーホール２と部品リード４とが互いに機械
的かつ電気的に接続されることになる。As shown in FIG. 1, the through holes 2 of the printed circuit board 3 are filled with a viscous conductive adhesive l. After that, as shown in FIG. 2, the through hole 2 of the printed circuit board 3 is
The component lead 4 of the component 5 is inserted into the conductive adhesive 1 inside. Finally, the conductive adhesive 1 is heated until it hardens. As a result, the through holes 2 of the printed circuit board 3 and the component leads 4 are mechanically and electrically connected to each other by the hardened conductive adhesive 1.
［発明の効果］
以上説明したように本発明は、プリント基板のスルーホ
ールに粘性を持った導電性接着剤を充填し、前記スルー
ホールに部品リードを挿入し、前記導電性接着剤に通し
た温度に加熱することにより、プリント基板のスルーホ
ールと部品リードとを導電性接着剤によって電気的かつ
機械的に接続してなるので、プリント基板の板厚が大で
そのスルーホールが小径で、すなわちアスペクト比が大
きくてもプリント基板のスルーホールと部品リードとの
接続を容易にかつ確実になし得る効果を有し、はんだ付
けによるガスの発生等のない高信頼性の機械的かつ電気
的接続を可能とする効果を有する。[Effects of the Invention] As explained above, the present invention is characterized in that a through hole in a printed circuit board is filled with a viscous conductive adhesive, a component lead is inserted into the through hole, and the lead is passed through the conductive adhesive. By heating the printed circuit board to a high temperature, the through holes of the printed circuit board and the component leads are electrically and mechanically connected using a conductive adhesive. Even if the aspect ratio is large, it is possible to easily and reliably connect the through holes of the printed circuit board to the component leads, and it provides highly reliable mechanical and electrical connections that do not generate gas due to soldering. It has the effect of making it possible.
第１図は本発明の接続方法の一実施例において導電性接
着剤がプリント基板のスルーホール内に充填された状態
を示す断面図、第２図は同実施例においてプリント基板
のスルーホール内に充填された導電性接着剤により部品
リードがスルーホールに対して接続された状態を示す断
面図である。
１：導電性接着剤
２ニスルーホール
３ニブリント基板
４：部品リードFIG. 1 is a cross-sectional view showing a through hole of a printed circuit board filled with conductive adhesive in an embodiment of the connection method of the present invention, and FIG. FIG. 3 is a cross-sectional view showing a state in which component leads are connected to through-holes by filled conductive adhesive. 1: Conductive adhesive 2 Varnish through hole 3 Niblint board 4: Component lead
Claims (1)
法において、前記プリント基板のスルーホールに粘性を
持った導電性接着剤を充填し、前記スルーホールに部品
リードを挿入し、前記導電性接着剤に適した温度に加熱
することにより、プリント基板のスルーホールと部品リ
ードとを導電性接着剤によって電気的かつ機械的に接続
してなることを特徴とするプリント基板のスルーホール
と部品リードとの接続方法。In a method for connecting a through hole of a printed circuit board and a component lead, the through hole of the printed circuit board is filled with a viscous conductive adhesive, the component lead is inserted into the through hole, and the conductive adhesive is suitable for the conductive adhesive. A method of connecting a through hole of a printed circuit board and a component lead, the method comprising electrically and mechanically connecting the through hole of the printed circuit board and the component lead with a conductive adhesive by heating the through hole of the printed circuit board to a certain temperature. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9518486A JPS62252193A (en) | 1986-04-24 | 1986-04-24 | Method of connecting leads of parts to through-holes of printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9518486A JPS62252193A (en) | 1986-04-24 | 1986-04-24 | Method of connecting leads of parts to through-holes of printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62252193A true JPS62252193A (en) | 1987-11-02 |
Family
ID=14130665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9518486A Pending JPS62252193A (en) | 1986-04-24 | 1986-04-24 | Method of connecting leads of parts to through-holes of printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62252193A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005104303A1 (en) * | 2004-03-30 | 2005-11-03 | Mitsubishi Denki Kabushiki Kaisha | Wiring branch unit |
| JP2013189356A (en) * | 2012-03-15 | 2013-09-26 | Sumitomo Precision Prod Co Ltd | Discharge cell, and ozone gas generator |
-
1986
- 1986-04-24 JP JP9518486A patent/JPS62252193A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005104303A1 (en) * | 2004-03-30 | 2005-11-03 | Mitsubishi Denki Kabushiki Kaisha | Wiring branch unit |
| JP2013189356A (en) * | 2012-03-15 | 2013-09-26 | Sumitomo Precision Prod Co Ltd | Discharge cell, and ozone gas generator |
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