JPS58143989A - Conveyor - Google Patents

Conveyor

Info

Publication number
JPS58143989A
JPS58143989A JP2110882A JP2110882A JPS58143989A JP S58143989 A JPS58143989 A JP S58143989A JP 2110882 A JP2110882 A JP 2110882A JP 2110882 A JP2110882 A JP 2110882A JP S58143989 A JPS58143989 A JP S58143989A
Authority
JP
Japan
Prior art keywords
chuck
air
wafer
fluid
bernoulli
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2110882A
Other languages
Japanese (ja)
Inventor
秀造 佐野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2110882A priority Critical patent/JPS58143989A/en
Publication of JPS58143989A publication Critical patent/JPS58143989A/en
Pending legal-status Critical Current

Links

Landscapes

  • Delivering By Means Of Belts And Rollers (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Manipulator (AREA)
  • Load-Engaging Elements For Cranes (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は、搬送装置に係シ、レジスト塗布つ自・エバの
ように非接触にハンドリングする必要が・ある場合の搬
送装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a conveying device used when there is a need for non-contact handling such as resist coating or evaporation.

第1図は、従来表面非接触に物体をノ・ンドリ。Figure 1 shows a conventional method for removing objects without contacting the surface.

ングする場合に用いられるベルヌーイの式の関。function of Bernoulli's equation used when

係を利用したチャックを示したものである (1、以下
ベルヌーイチャックと呼ぶ)。1F′i搬送す。
This shows a chuck that uses a chuck (1, hereinafter referred to as the Bernoulli chuck). Transport 1F'i.

る物体(例えばウェハ)である。2けベルヌニイチャソ
ク本体で、圧縮空気を送る管3、ニラ。
An object (e.g. a wafer) that The pipe that sends compressed air in the 2-tube Bernunei Chasok body is 3, the leek.

プル4及び噴流穴5から成っている。また、9゜け物体
1の横ずれ防止用ストッパである。ペルー、1゜ヌーイ
の式は で表わされる。ここでP:圧力9/−2γ:流体の比重
量Wtrl 、 v :流速m/s 、 y :重力の
加速度で9.8m/z2. A :基準面からの高さm
である。゛ベルヌーイチャック2に圧縮空気を送ると噴
゛流穴5より空気が噴出し、物体1に当たって空気は流
線6のごとく大気に流れ出る。すなわち゛(1)式にお
いて、まず流速がある場合もない場合。
It consists of a pull 4 and a jet hole 5. It is also a stopper for preventing lateral displacement of the object 1 having a 9° angle. Peru, the formula for 1° Nuy is expressed as. Here, P: pressure 9/-2 γ: specific weight of fluid Wtrl, v: flow velocity m/s, y: acceleration of gravity 9.8 m/z2. A: Height m from the reference plane
It is. When compressed air is sent to the Bernoulli chuck 2, the air is ejected from the ejection hole 5, hits the object 1, and the air flows out into the atmosphere like a streamline 6. In other words, in Equation (1), first, there is a case where there is a flow velocity and there is no flow velocity.

もhは等しく、従がって流速υによりベルター11イチ
ヤノク2と物体10間の圧力p1は    7)I =
 pQ −−u    ・・・・・・・・・・・・・・
・・・・・・・・・(2)   v で表わされ、負圧となることがわかる。ここで・poは
大気圧を示す。第2図はベルヌーイチャッ・り2と物体
1の間における圧力分布を示したもl・ので、結局、と
の負圧による力、空気噴出部の。
h is also equal, therefore, due to the flow velocity υ, the pressure p1 between the belter 11 and the object 10 is 7) I =
pQ −−u・・・・・・・・・・・・・・・
・・・・・・・・・(2) It is expressed as v, and it can be seen that the pressure is negative. Here, ・po indicates atmospheric pressure. Figure 2 shows the pressure distribution between the Bernoulli chat 2 and the object 1, so that the force due to the negative pressure and the air jet.

押し力及び物体重量の合計と物体1に作用する。The sum of the pushing force and the weight of the object acts on object 1.

大気圧による力が等しい関係 / p+<x、y)dz + F +my −poA 
−=−・−”−(s)   。
Relationship where the forces due to atmospheric pressure are equal / p+<x, y) dz + F +my -poA
−=−・−”−(s).

で物体1がチャック2に表面非接触で保持され、、。Object 1 is held by chuck 2 without surface contact.

る。なおここでm:物体1の質量、A。物体1の面積、
F:空気噴出部の押し力である。
Ru. Note that m: mass of object 1, A. Area of object 1,
F: Pushing force of the air jet section.

第3図は(3)式の関係をまとめたものであり縦軸はチ
ャックの吸着力を、横軸はチャックと物ハ シ負圧による力に相当する。点線で示す曲−力(体を吸
着できることがわかる。       1)・以上のよ
うな原理により作動するベルヌーイ・チャックではある
が、中央にのみ空気噴出口が・ある従来方式ではエアベ
アリングとしての働き・なするのはこの空気噴出口の付
近のみであシ、・従がって物体を吸着する時、物体に偏
荷重が作1)用すると(例えば、物体の質量分布が均一
でな。
FIG. 3 summarizes the relationship of equation (3), where the vertical axis corresponds to the suction force of the chuck, and the horizontal axis corresponds to the force due to the negative pressure between the chuck and the bar. The bending force shown by the dotted line (you can see that the body can be absorbed. 1) Although the Bernoulli chuck operates based on the principle described above, the conventional system with an air outlet only in the center functions as an air bearing. This occurs only in the vicinity of this air outlet. Therefore, when an object is adsorbed, if an uneven load is applied to the object (for example, the mass distribution of the object is not uniform).

い、チャック・物体面状態で吸着力がチャック。In the chuck/object surface state, the suction force is the chuck.

の場所によシ異なるなど)エアベアリングとし。(Depending on location, etc.) with air bearings.

ての力がない周辺部では物体がチャックの吸着。In the peripheral area where there is no force, the object will be attracted by the chuck.

表面に接触してしまう。come into contact with the surface.

これけ1例えば物体が表面にレジストを塗布したウェハ
のような場合には、レジストが破損したシ、また破損し
たレジストがじんあいとな。
For example, if the object is a wafer with a resist coated on its surface, the resist may be damaged, and the damaged resist may become dust.

って他のウェハ上にくっつくなど製品の歩留シな低下さ
せる要因となる。
This causes the wafers to stick to other wafers, resulting in lower product yields.

本発明の目的は、ベルヌーイチャックの物体−吸着時に
生ずる物体とチャック吸着面との接触をなくし表面に非
接触で物体をハンドリングしうる搬送装置を提供するに
ある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a conveying device that eliminates contact between an object and the chuck suction surface that occurs when a Bernoulli chuck picks up an object, and can handle the object without contacting the surface.

本発明の特徴は、圧縮空気の噴出口をチャノ1°。The feature of the present invention is that the compressed air outlet is set at 1°.

り中心から適当な円周上に5個以上設けて物体吸着時の
チャックと物体間の剛性を増すこと、′及び各噴出口か
らの空気流が相互に干渉し、流・速か小さくなるのを防
ぐためチャックの中央に・適当な穴を設は空気の逃げ道
を作ったことに存1−1し、この構成によシ、前記目的
を確実に達成で。
5 or more are installed on a suitable circumference from the center to increase the rigidity between the chuck and the object when picking up an object, and to prevent the airflow from each nozzle from interfering with each other and reducing the flow and speed. In order to prevent this, an appropriate hole is provided in the center of the chuck to create an escape route for air, and this configuration ensures that the above objective is achieved.

きたものである。It has come.

が搬送するワークであるウェハである。ウェハ、1.5
 ・ 1上にはマスク(図示せず)の半導体パターンを転写・
焼き付けするためレジストが塗布しであるが、このレジ
ストは機械的衝撃にもろく、また微細粒にこわれる性質
を有している。ベルヌーイチャック本体2には、適当な
中径r上に5〜4個の空気供給用管5、ニップル4及び
噴流穴5から成る空気供給部と、各空気供給部から゛噴
出した空気が相互に干渉することなく流れる゛ようにし
た逃げ穴7が形成されている。8はべ゛ルヌーイチャッ
ク2を上下及び旋回させるためII+のレバーであり、
各駆動部(図示せず)とつな・かっている。9t−tウ
ェハ1の横ずれを防止する・ストッパである。
The wafer is the workpiece that is transported by the wafer. wafer, 1.5
・ A semiconductor pattern of a mask (not shown) is transferred onto 1.
A resist is applied for baking, but this resist is fragile to mechanical shock and has the property of breaking into fine particles. The Bernoulli chuck main body 2 has an air supply section consisting of 5 to 4 air supply tubes 5, nipples 4, and jet holes 5 on a suitable medium diameter r, and the air ejected from each air supply section is connected to each other. An escape hole 7 is formed to allow the fluid to flow without interference. 8 is a lever II+ for vertically and rotating the Bernoulli chuck 2;
It is connected to each drive unit (not shown). This is a stopper that prevents the 9t-t wafer 1 from shifting laterally.

5                  i−また第4
図は本発明によυ得られるゝA/ X −T、c・′イ
チャック2とウエノ・1との間の圧力分布を示゛1゜し
たものである。
5 i-also the 4th
The figure shows the pressure distribution between the Ichak 2 and the Ueno 1 obtained by the present invention.

以上の構成において、ベルヌーイチャック2゜を固定し
たレバー8がまずウエノ・1に対し所定。
In the above configuration, the lever 8 to which the Bernoulli chuck 2° is fixed is first set against the Ueno 1.

の位置まで下降する。この時管3への空気供給。Descend to the position. At this time, air is supplied to tube 3.

は止めておく。次に空気を管3へ流すと空気は、1・ 
4 ・ 噴出口5を通って流線6のように片側は即大気(側に、
他の片側はベルヌーイチャック2の逃げ穴7を通って大
気に流れ出る。この結果ベルヌ−イチャック2とウェハ
1間には第4図のよう。
I'll stop it. Next, when air flows into tube 3, the air becomes 1.
4. Passing through the spout 5, one side is immediately exposed to the atmosphere (the other side is
The other side flows out into the atmosphere through the escape hole 7 of the Bernoulli chuck 2. As a result, there is a gap between the Bernoulli chuck 2 and the wafer 1 as shown in FIG.

な圧力分布が生じこの結果、基本式(3)の変形式゛Σ
fpin(x、y)r1g+ΣFi+rai−po(A
−A′)   =−・(4)が成立する条件によシウエ
ハ1はベルヌーイチ。
As a result, a modified form of basic equation (3) ゛Σ
fpin(x,y)r1g+ΣFi+rai-po(A
-A') =-・Shiwafer 1 is Bernoulich under the condition that (4) holds true.

ヤック2に表面非接触で吸着される。なおpirL“(
T、31) ;各空気供給部で得られる負圧分布、Fl
・:各空気供給部で生ずる空気噴出部の押し力、10A
′zペルヌー−fチャック逃げ大面積である。 ・この
場合、ウェハ1がベルヌーイチャック2・に、吸着され
る際、偏荷重がウェハ1に生じて・も各空気供給部の空
気噴出部の押し力、すなわ・ち第5図におけるエアベア
リング効果がチャツト。
It is adsorbed to Yak 2 without contacting the surface. Please note that pirL”(
T, 31); Negative pressure distribution obtained at each air supply section, Fl
・:Pushing force of air jet part generated in each air supply part, 10A
'z Pernoud - f chuck escape area is large.・In this case, when the wafer 1 is attracted to the Bernoulli chuck 2, an unbalanced load is generated on the wafer 1. ・Even if an uneven load is generated on the wafer 1, the pushing force of the air jet section of each air supply section, that is, the air bearing in FIG. The effect is chat.

り中央でなく外周部に働らくため、ウェハ1が。Wafer 1 acts on the outer periphery rather than the center.

ベルヌーイチャック2の吸着表面に接触するこ。Do not touch the suction surface of Bernoulli Chuck 2.

とばない。It won't fly.

本発明は1以上説明した構成・作用のもので、。The present invention has one or more of the configurations and functions described above.

本発明によれば複数個の空気供給部を有してい、1゜る
ため、ウェハ吸着時に偏荷重が生じても複数個の空気供
給部の押し力のために決してウェハ表面とチャック吸着
面とが接触することはなく、従がってウェハ表面上のレ
ジストを破損することがないので、半導体製造の歩留り
を著しく向上しうる効果かめる。
According to the present invention, since the present invention has a plurality of air supply sections and has a distance of 1°, even if an unbalanced load occurs during wafer adsorption, the pushing force of the plurality of air supply sections will prevent the wafer surface from colliding with the chuck adsorption surface. Since there is no contact between the resists and the resist on the wafer surface, there is no possibility of damaging the resist on the wafer surface, which has the effect of significantly improving the yield of semiconductor manufacturing.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のベルヌーイナヤックを示す断。 ヌーイテヤックを示す断面図、第5図は同じく・チャッ
クとウェハ間の圧力分布を示す説明図で・ある。 1・・・物体。 2・・・ベルヌーイチャツタ本体、      1・3
・・・流体供給管、   4・・・ニップル、5・・・
流体噴出口、   6・・・流体の流線、7・・・逃げ
穴、    8・・・レバー9・・・物体の横ずれ防止
ストッパ。 代理人弁理士 薄 1)利 幸 1.1・ 7 ・ f  1  図 2Z[B 負圧 ↑ 正圧 才  j  図 才   斗  図 7 5 団 に 正L
Figure 1 shows a cross-section of a conventional Bernoulina yak. FIG. 5 is a cross-sectional view showing the Nouiteyac, and is also an explanatory view showing the pressure distribution between the chuck and the wafer. 1...Object. 2... Bernoulli Chatta body, 1.3
...Fluid supply pipe, 4...Nipple, 5...
Fluid spout, 6... Fluid streamline, 7... Relief hole, 8... Lever 9... Stopper to prevent side shift of object. Agent Patent Attorney Susuki 1) Yuki Toshi 1.1・7・f 1 Figure 2Z[B Negative pressure ↑ Positive pressure Sai j Zuzai Do Figure 7 5 Positive L to group

Claims (1)

【特許請求の範囲】[Claims] 1、 流体を供給して負圧を作シ、物体を吸着・搬送す
るメカニズムにおいて、6個以上の流□体積出口と、前
記各流体噴出口から流れる流体が相互に干渉するのを防
ぐ流体の逃げ穴を゛設けたことを特徴とする搬送装置。
1. In a mechanism that supplies fluid to create negative pressure to adsorb and transport an object, there are six or more flow and volume outlets and a fluid flow outlet that prevents the fluid flowing from each of the fluid jet ports from interfering with each other. A conveying device characterized by having an escape hole.
JP2110882A 1982-02-15 1982-02-15 Conveyor Pending JPS58143989A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2110882A JPS58143989A (en) 1982-02-15 1982-02-15 Conveyor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2110882A JPS58143989A (en) 1982-02-15 1982-02-15 Conveyor

Publications (1)

Publication Number Publication Date
JPS58143989A true JPS58143989A (en) 1983-08-26

Family

ID=12045678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2110882A Pending JPS58143989A (en) 1982-02-15 1982-02-15 Conveyor

Country Status (1)

Country Link
JP (1) JPS58143989A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61111251A (en) * 1984-11-01 1986-05-29 Kuresen Sangyo Kk Holding device for flat laminar member
JPS6195740U (en) * 1984-11-26 1986-06-20
JP2011108879A (en) * 2009-11-18 2011-06-02 Koganei Corp Workpiece transfer apparatus
WO2012144120A1 (en) * 2011-04-20 2012-10-26 村田機械株式会社 Suction chuck, and transfer device of workpiece including same
JP2017214203A (en) * 2016-06-01 2017-12-07 大日本印刷株式会社 Sheet lifting device
JP2019034359A (en) * 2017-08-10 2019-03-07 株式会社前川製作所 Robot hand for food product

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5140343A (en) * 1974-09-25 1976-04-05 Ota Toshuki Aruminiumuno hyomenshoriho
JPS5525037A (en) * 1978-08-09 1980-02-22 Seiko Epson Corp Liquid form material injecting of display body

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5140343A (en) * 1974-09-25 1976-04-05 Ota Toshuki Aruminiumuno hyomenshoriho
JPS5525037A (en) * 1978-08-09 1980-02-22 Seiko Epson Corp Liquid form material injecting of display body

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61111251A (en) * 1984-11-01 1986-05-29 Kuresen Sangyo Kk Holding device for flat laminar member
JPH0215461B2 (en) * 1984-11-01 1990-04-12 Kuresen Sangyo Kk
JPS6195740U (en) * 1984-11-26 1986-06-20
JPH026018Y2 (en) * 1984-11-26 1990-02-14
JP2011108879A (en) * 2009-11-18 2011-06-02 Koganei Corp Workpiece transfer apparatus
WO2012144120A1 (en) * 2011-04-20 2012-10-26 村田機械株式会社 Suction chuck, and transfer device of workpiece including same
JP2012223860A (en) * 2011-04-20 2012-11-15 Murata Machinery Ltd Suction chuck, and transfer device of workpiece including same
CN103492135A (en) * 2011-04-20 2014-01-01 村田机械株式会社 Suction chuck, and transfer device of workpiece including same
JP2017214203A (en) * 2016-06-01 2017-12-07 大日本印刷株式会社 Sheet lifting device
JP2019034359A (en) * 2017-08-10 2019-03-07 株式会社前川製作所 Robot hand for food product

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