JPS5799750A - Method of forming electric connection - Google Patents

Method of forming electric connection

Info

Publication number
JPS5799750A
JPS5799750A JP56162908A JP16290881A JPS5799750A JP S5799750 A JPS5799750 A JP S5799750A JP 56162908 A JP56162908 A JP 56162908A JP 16290881 A JP16290881 A JP 16290881A JP S5799750 A JPS5799750 A JP S5799750A
Authority
JP
Japan
Prior art keywords
paste
electric connection
conductive
forming electric
electrical connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56162908A
Other languages
English (en)
Other versions
JPH0128502B2 (ja
Inventor
Furooren Jiyorujiyu
Jiyuruden Fuiritsupu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of JPS5799750A publication Critical patent/JPS5799750A/ja
Publication of JPH0128502B2 publication Critical patent/JPH0128502B2/ja
Granted legal-status Critical Current

Links

Classifications

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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP56162908A 1980-10-15 1981-10-14 Method of forming electric connection Granted JPS5799750A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8022083A FR2492164B1 (fr) 1980-10-15 1980-10-15 Procede de realisation simultanee de liaisons electriques multiples, notamment pour le raccordement electrique d'une micro-plaquette de semiconducteurs

Publications (2)

Publication Number Publication Date
JPS5799750A true JPS5799750A (en) 1982-06-21
JPH0128502B2 JPH0128502B2 (ja) 1989-06-02

Family

ID=9246931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56162908A Granted JPS5799750A (en) 1980-10-15 1981-10-14 Method of forming electric connection

Country Status (6)

Country Link
US (1) US4442966A (ja)
JP (1) JPS5799750A (ja)
DE (1) DE3140348A1 (ja)
FR (1) FR2492164B1 (ja)
GB (1) GB2090071B (ja)
IE (1) IE52529B1 (ja)

Cited By (7)

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JPS61207025A (ja) * 1985-03-12 1986-09-13 Casio Comput Co Ltd 半導体ペレツトの接合方法
JPS6450446A (en) * 1987-07-16 1989-02-27 Sgs Thomson Microelectronics Method and structure for integrated circuit pad contact
JPH03125443A (ja) * 1989-10-09 1991-05-28 Sharp Corp 実装基板の電極及び該実装基板の電極を有する液晶表示装置
JPH03204964A (ja) * 1989-05-05 1991-09-06 Internatl Business Mach Corp <Ibm> 電気的回路パツケージ及び電気的回路パツケージを作る方法
JPH05503191A (ja) * 1989-12-18 1993-05-27 エポキシ・テクノロジー・インコーポレーテツド 導電性ポリマー及び絶縁体を使用したフリツプチツプ技術
JPH05206379A (ja) * 1991-10-04 1993-08-13 Internatl Business Mach Corp <Ibm> マルチチップモジュールおよびその製造方法
JP2016203237A (ja) * 2015-04-28 2016-12-08 日立化成株式会社 導電性接合体および該接合体の製造方法

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US4859268A (en) * 1986-02-24 1989-08-22 International Business Machines Corporation Method of using electrically conductive composition
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
DE3785720T2 (de) * 1986-09-25 1993-08-12 Toshiba Kawasaki Kk Verfahren zum herstellen eines filmtraegers.
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US5076485A (en) * 1990-04-24 1991-12-31 Microelectronics And Computer Technology Corporation Bonding electrical leads to pads with particles
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US5866951A (en) * 1990-10-12 1999-02-02 Robert Bosch Gmbh Hybrid circuit with an electrically conductive adhesive
DE4032397A1 (de) * 1990-10-12 1992-04-16 Bosch Gmbh Robert Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstruktur
US5193732A (en) * 1991-10-04 1993-03-16 International Business Machines Corporation Apparatus and methods for making simultaneous electrical connections
US5288007A (en) * 1991-10-04 1994-02-22 International Business Machine Corporation Apparatus and methods for making simultaneous electrical connections
US5170930A (en) * 1991-11-14 1992-12-15 Microelectronics And Computer Technology Corporation Liquid metal paste for thermal and electrical connections
US6077725A (en) * 1992-09-03 2000-06-20 Lucent Technologies Inc Method for assembling multichip modules
US5545589A (en) * 1993-01-28 1996-08-13 Matsushita Electric Industrial Co., Ltd. Method of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor device
US5450290A (en) * 1993-02-01 1995-09-12 International Business Machines Corporation Printed circuit board with aligned connections and method of making same
US5766670A (en) * 1993-11-17 1998-06-16 Ibm Via fill compositions for direct attach of devices and methods for applying same
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
US5445308A (en) * 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
CA2156941A1 (en) * 1995-08-21 1997-02-22 Jonathan H. Orchard-Webb Method of making electrical connections to integrated circuit
US5741430A (en) * 1996-04-25 1998-04-21 Lucent Technologies Inc. Conductive adhesive bonding means
US6558979B2 (en) * 1996-05-21 2003-05-06 Micron Technology, Inc. Use of palladium in IC manufacturing with conductive polymer bump
JP3030271B2 (ja) 1997-05-19 2000-04-10 富士通株式会社 半導体部品の実装方法
US6110760A (en) 1998-02-12 2000-08-29 Micron Technology, Inc. Methods of forming electrically conductive interconnections and electrically interconnected substrates
US6406988B1 (en) 1998-04-24 2002-06-18 Amerasia International Technology, Inc. Method of forming fine pitch interconnections employing magnetic masks
US6580035B1 (en) 1998-04-24 2003-06-17 Amerasia International Technology, Inc. Flexible adhesive membrane and electronic device employing same
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US6589376B1 (en) 1998-04-28 2003-07-08 International Business Machines Corporation Method and composition for mounting an electronic component and device formed therewith
US6428650B1 (en) 1998-06-23 2002-08-06 Amerasia International Technology, Inc. Cover for an optical device and method for making same
US6136128A (en) 1998-06-23 2000-10-24 Amerasia International Technology, Inc. Method of making an adhesive preform lid for electronic devices
US6409859B1 (en) 1998-06-30 2002-06-25 Amerasia International Technology, Inc. Method of making a laminated adhesive lid, as for an Electronic device
US6399178B1 (en) 1998-07-20 2002-06-04 Amerasia International Technology, Inc. Rigid adhesive underfill preform, as for a flip-chip device
US6221752B1 (en) * 1998-08-20 2001-04-24 United Microelectronics Corp. Method of mending erosion of bonding pad
US6316289B1 (en) 1998-11-12 2001-11-13 Amerasia International Technology Inc. Method of forming fine-pitch interconnections employing a standoff mask
US6246587B1 (en) * 1998-12-03 2001-06-12 Intermedics Inc. Surface mounted device with grooves on a termination lead and methods of assembly
US6535393B2 (en) * 1998-12-04 2003-03-18 Micron Technology, Inc. Electrical device allowing for increased device densities
US6255208B1 (en) 1999-01-25 2001-07-03 International Business Machines Corporation Selective wafer-level testing and burn-in
US6177729B1 (en) 1999-04-03 2001-01-23 International Business Machines Corporation Rolling ball connector
DE10117880B4 (de) * 2001-04-10 2009-01-29 Mühlbauer Ag Verfahren zum Vereinzeln von elektronischen Bauteilen aus einem Verbund
US7743963B1 (en) 2005-03-01 2010-06-29 Amerasia International Technology, Inc. Solderable lid or cover for an electronic circuit
JP2009246166A (ja) * 2008-03-31 2009-10-22 Fujitsu Ltd 電子部品パッケージおよび基板ユニット並びにプリント配線板およびその製造方法
US9240563B2 (en) * 2010-10-11 2016-01-19 Koninklijke Philips N.V. Multi-device OLED
ITTO20110980A1 (it) * 2011-10-27 2013-04-28 St Microelectronics Srl Struttura incapsulante schermata e relativo metodo di fabbricazione
CN110744163B (zh) * 2019-11-11 2022-04-19 重庆理工大学 一种抗热迁移微焊点结构及其制备方法
CN112839439A (zh) * 2019-11-25 2021-05-25 Oppo（重庆）智能科技有限公司 印刷线路板组件及制备方法、电子设备

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US3809797A (en) * 1971-11-16 1974-05-07 Du Pont Seal ring compositions and electronic packages made therewith
JPS5279773A (en) * 1975-12-26 1977-07-05 Seiko Epson Corp Bonding method of ic
CA1097495A (en) * 1976-05-24 1981-03-17 James H. Aumiller Electrically conductive adhesive
US4147669A (en) * 1977-03-28 1979-04-03 Rockwell International Corporation Conductive adhesive for providing electrical and thermal conductivity
DE2829917A1 (de) * 1978-07-07 1980-01-24 Semikron Gleichrichterbau Verfahren zum herstellen von halbleiterbauelementen
JPS5835367B2 (ja) * 1978-07-18 1983-08-02 ミツミ電機株式会社 回路素子基板及びその製造方法
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207025A (ja) * 1985-03-12 1986-09-13 Casio Comput Co Ltd 半導体ペレツトの接合方法
JPS6450446A (en) * 1987-07-16 1989-02-27 Sgs Thomson Microelectronics Method and structure for integrated circuit pad contact
JPH03204964A (ja) * 1989-05-05 1991-09-06 Internatl Business Mach Corp <Ibm> 電気的回路パツケージ及び電気的回路パツケージを作る方法
JPH03125443A (ja) * 1989-10-09 1991-05-28 Sharp Corp 実装基板の電極及び該実装基板の電極を有する液晶表示装置
JPH05503191A (ja) * 1989-12-18 1993-05-27 エポキシ・テクノロジー・インコーポレーテツド 導電性ポリマー及び絶縁体を使用したフリツプチツプ技術
JPH05206379A (ja) * 1991-10-04 1993-08-13 Internatl Business Mach Corp <Ibm> マルチチップモジュールおよびその製造方法
JP2016203237A (ja) * 2015-04-28 2016-12-08 日立化成株式会社 導電性接合体および該接合体の製造方法

Also Published As

Publication number Publication date
GB2090071A (en) 1982-06-30
IE52529B1 (en) 1987-12-09
FR2492164B1 (fr) 1987-01-23
IE812380L (en) 1982-04-15
US4442966A (en) 1984-04-17
JPH0128502B2 (ja) 1989-06-02
GB2090071B (en) 1984-05-23
DE3140348A1 (de) 1982-08-26
FR2492164A1 (fr) 1982-04-16

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