JPS5783041A - Separating method for die - Google Patents

Separating method for die

Info

Publication number
JPS5783041A
JPS5783041A JP15835380A JP15835380A JPS5783041A JP S5783041 A JPS5783041 A JP S5783041A JP 15835380 A JP15835380 A JP 15835380A JP 15835380 A JP15835380 A JP 15835380A JP S5783041 A JPS5783041 A JP S5783041A
Authority
JP
Japan
Prior art keywords
die
wafer
sleeve
sheet
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15835380A
Other languages
Japanese (ja)
Inventor
Yoshimitsu Kushima
Hisaaki Kojima
Masao Yamazaki
Masashi Nishizaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Sharp Corp
Original Assignee
Shinkawa Ltd
Sharp Corp
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Sharp Corp, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP15835380A priority Critical patent/JPS5783041A/en
Publication of JPS5783041A publication Critical patent/JPS5783041A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To improve the reliability of pickup by a method wherein the die is positively attracted by lifting up the wafer, on which the die was adhered, with the guide sleeve of a lifting-up needle, and then the die is separated by thrusting it up. CONSTITUTION:After the wafer has been adhered and scribed on the wafer sheet 1 and cut into the die 2, the sheet 1 is stretched out and fixed on a wafer ring 4. Then, after the wafer ring 4 has been positioned at the position where the desired die 2 can be attracted by an attracting nozzle, 3, the sleeve 9 is raised and the point of which is protruded from the upper surface 4b of the ring 4. Subsequently, after the die 2 has been picked up by raising the thrusting-up needle 7 and the sleeve 9 are lowered. Thus, by utilizing the tension of the sheet 1 without providing a vacuum attracting mechanism at the sleeve 9, the inclination of the die 2 can be prevented and a reliable pick-up operation can be performed.
JP15835380A 1980-11-11 1980-11-11 Separating method for die Pending JPS5783041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15835380A JPS5783041A (en) 1980-11-11 1980-11-11 Separating method for die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15835380A JPS5783041A (en) 1980-11-11 1980-11-11 Separating method for die

Publications (1)

Publication Number Publication Date
JPS5783041A true JPS5783041A (en) 1982-05-24

Family

ID=15669795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15835380A Pending JPS5783041A (en) 1980-11-11 1980-11-11 Separating method for die

Country Status (1)

Country Link
JP (1) JPS5783041A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110299303A (en) * 2018-03-23 2019-10-01 旺矽科技股份有限公司 Chip picks assembly and chip moving method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110299303A (en) * 2018-03-23 2019-10-01 旺矽科技股份有限公司 Chip picks assembly and chip moving method
CN110299303B (en) * 2018-03-23 2021-09-14 旺矽科技股份有限公司 Chip picking assembly and chip moving method

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