JPS5645036A - Mounting method and apparatus for semiconductor pellet - Google Patents
Mounting method and apparatus for semiconductor pelletInfo
- Publication number
- JPS5645036A JPS5645036A JP12005979A JP12005979A JPS5645036A JP S5645036 A JPS5645036 A JP S5645036A JP 12005979 A JP12005979 A JP 12005979A JP 12005979 A JP12005979 A JP 12005979A JP S5645036 A JPS5645036 A JP S5645036A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- mounting
- island
- pellet
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To prevent a semiconductor pellet from being placed out of position or lost by discriminating the paste applying conditions at a given position by using a noncontact sensor after the paste applying process. CONSTITUTION:A lead frame 5 stops at a give position, and conductive paste 17 is applied from a nozzle 9 to a given position on an island 4. Then the lead frame 5 moves by a given distance, and the portion coated with the paste 17 reaches beneath a sensor 17; which applys light to the mounting position to which the paste 17 has been applied, converts the reflecting power into a binary signal to be compared with a value previously set, and discriminates between presence and absence of the paste applied. When no application of the paste is detected, a mounting head 8 is stopped after mounting a pellet on the front island, but a frame feeder 2, paste dispenser 6 and the sensor 7 are continued to operate. When the application of the paste is confirmed the head 8 starts operation: The head 8 attracts a pellet 3 on a table 15 by means of a collect 11, and mounts it at a given position on the island to which the paste has been applied. The constitution permits a highly reliable mounting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12005979A JPS5645036A (en) | 1979-09-20 | 1979-09-20 | Mounting method and apparatus for semiconductor pellet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12005979A JPS5645036A (en) | 1979-09-20 | 1979-09-20 | Mounting method and apparatus for semiconductor pellet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5645036A true JPS5645036A (en) | 1981-04-24 |
Family
ID=14776866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12005979A Pending JPS5645036A (en) | 1979-09-20 | 1979-09-20 | Mounting method and apparatus for semiconductor pellet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5645036A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03129837A (en) * | 1989-10-16 | 1991-06-03 | Nec Kyushu Ltd | Mounter |
JPH0515423U (en) * | 1991-08-06 | 1993-02-26 | 鹿児島日本電気株式会社 | Die bonding equipment |
WO2005013351A1 (en) * | 2003-07-31 | 2005-02-10 | Nec Machinery Corporation | Method for recognizing work in die bonder and die bonder |
JP2010118468A (en) * | 2008-11-12 | 2010-05-27 | Toshiba Corp | Apparatus and method for manufacturing semiconductor device |
-
1979
- 1979-09-20 JP JP12005979A patent/JPS5645036A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03129837A (en) * | 1989-10-16 | 1991-06-03 | Nec Kyushu Ltd | Mounter |
JPH0515423U (en) * | 1991-08-06 | 1993-02-26 | 鹿児島日本電気株式会社 | Die bonding equipment |
WO2005013351A1 (en) * | 2003-07-31 | 2005-02-10 | Nec Machinery Corporation | Method for recognizing work in die bonder and die bonder |
CN100383940C (en) * | 2003-07-31 | 2008-04-23 | 佳能机械株式会社 | Method for recognizing work in die bonder and die bonder |
JP2010118468A (en) * | 2008-11-12 | 2010-05-27 | Toshiba Corp | Apparatus and method for manufacturing semiconductor device |
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