JPS5739559A - Resin sealing method for ic - Google Patents
Resin sealing method for icInfo
- Publication number
- JPS5739559A JPS5739559A JP11426980A JP11426980A JPS5739559A JP S5739559 A JPS5739559 A JP S5739559A JP 11426980 A JP11426980 A JP 11426980A JP 11426980 A JP11426980 A JP 11426980A JP S5739559 A JPS5739559 A JP S5739559A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- mounting
- resin
- device hole
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title abstract 6
- 239000011347 resin Substances 0.000 title abstract 4
- 229920005989 resin Polymers 0.000 title abstract 4
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 239000011889 copper foil Substances 0.000 abstract 2
- 210000000707 wrist Anatomy 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11426980A JPS5739559A (en) | 1980-08-20 | 1980-08-20 | Resin sealing method for ic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11426980A JPS5739559A (en) | 1980-08-20 | 1980-08-20 | Resin sealing method for ic |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5739559A true JPS5739559A (en) | 1982-03-04 |
Family
ID=14633573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11426980A Pending JPS5739559A (en) | 1980-08-20 | 1980-08-20 | Resin sealing method for ic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5739559A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5109270A (en) * | 1989-04-17 | 1992-04-28 | Matsushita Electric Industrial Co., Ltd. | High frequency semiconductor device |
-
1980
- 1980-08-20 JP JP11426980A patent/JPS5739559A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5109270A (en) * | 1989-04-17 | 1992-04-28 | Matsushita Electric Industrial Co., Ltd. | High frequency semiconductor device |
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