JPS5721835A - Expanding device - Google Patents

Expanding device

Info

Publication number
JPS5721835A
JPS5721835A JP9606680A JP9606680A JPS5721835A JP S5721835 A JPS5721835 A JP S5721835A JP 9606680 A JP9606680 A JP 9606680A JP 9606680 A JP9606680 A JP 9606680A JP S5721835 A JPS5721835 A JP S5721835A
Authority
JP
Japan
Prior art keywords
punch
square
cylindrical
sheet
interval
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9606680A
Other languages
Japanese (ja)
Other versions
JPS5847857B2 (en
Inventor
Kunimichi Nakao
Takashi Uemura
Akihiko Miyazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55096066A priority Critical patent/JPS5847857B2/en
Publication of JPS5721835A publication Critical patent/JPS5721835A/en
Publication of JPS5847857B2 publication Critical patent/JPS5847857B2/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To forming the array of chips in a correct matrix by individually and movably forming a cylindrical punch and a square correcting punch larger than the cylindrical punch in a concentrical double structure. CONSTITUTION:Cracked wafer 6 is lined on a sheet 3, and cylindrical and square punches are concentrically dispsoed in double structure on the lower part thereof. When the punch 2 is heated by a heater 4 in the cylindrical punch 2 and is raised, the sheet 3 stretches and thermally expands to allow the chip interval on the upper surface of the cylindrical punch to be expanded, but to be reduced at the interval in the vicinity of the periphery of the punch. When the square punch 8 is, on the other hand, raised, the extension of the square corners of the square punch expands the sheet 3, the insufficient expansion of the periphery of the circular punch is corrected by the elongations of the sheet in the directions of arrows c, and the interval of the chips becomes equal to the center of the punch.
JP55096066A 1980-07-14 1980-07-14 expansion device Expired JPS5847857B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55096066A JPS5847857B2 (en) 1980-07-14 1980-07-14 expansion device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55096066A JPS5847857B2 (en) 1980-07-14 1980-07-14 expansion device

Publications (2)

Publication Number Publication Date
JPS5721835A true JPS5721835A (en) 1982-02-04
JPS5847857B2 JPS5847857B2 (en) 1983-10-25

Family

ID=14155045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55096066A Expired JPS5847857B2 (en) 1980-07-14 1980-07-14 expansion device

Country Status (1)

Country Link
JP (1) JPS5847857B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009039899A1 (en) 2008-09-10 2010-03-11 Ushiodenki K.K. discharge lamp
DE102010008913A1 (en) 2009-03-02 2010-09-09 Ushio Denki K.K. Short-arc discharge lamp
DE102010022630A1 (en) 2009-07-02 2011-01-05 Ushio Denki K.K. Short-arc discharge lamp comprises lighting tube, which forms discharge chamber, and pair of electrodes is provided, which is arranged in lighting tube of electrode main body
DE102010047130A1 (en) 2009-11-05 2011-05-12 Ushio Denki K.K. Short-arc discharge lamp

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009039899A1 (en) 2008-09-10 2010-03-11 Ushiodenki K.K. discharge lamp
DE102010008913A1 (en) 2009-03-02 2010-09-09 Ushio Denki K.K. Short-arc discharge lamp
DE102010022630A1 (en) 2009-07-02 2011-01-05 Ushio Denki K.K. Short-arc discharge lamp comprises lighting tube, which forms discharge chamber, and pair of electrodes is provided, which is arranged in lighting tube of electrode main body
DE102010047130A1 (en) 2009-11-05 2011-05-12 Ushio Denki K.K. Short-arc discharge lamp

Also Published As

Publication number Publication date
JPS5847857B2 (en) 1983-10-25

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