JPS5721835A - Expanding device - Google Patents
Expanding deviceInfo
- Publication number
- JPS5721835A JPS5721835A JP9606680A JP9606680A JPS5721835A JP S5721835 A JPS5721835 A JP S5721835A JP 9606680 A JP9606680 A JP 9606680A JP 9606680 A JP9606680 A JP 9606680A JP S5721835 A JPS5721835 A JP S5721835A
- Authority
- JP
- Japan
- Prior art keywords
- punch
- square
- cylindrical
- sheet
- interval
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
PURPOSE:To forming the array of chips in a correct matrix by individually and movably forming a cylindrical punch and a square correcting punch larger than the cylindrical punch in a concentrical double structure. CONSTITUTION:Cracked wafer 6 is lined on a sheet 3, and cylindrical and square punches are concentrically dispsoed in double structure on the lower part thereof. When the punch 2 is heated by a heater 4 in the cylindrical punch 2 and is raised, the sheet 3 stretches and thermally expands to allow the chip interval on the upper surface of the cylindrical punch to be expanded, but to be reduced at the interval in the vicinity of the periphery of the punch. When the square punch 8 is, on the other hand, raised, the extension of the square corners of the square punch expands the sheet 3, the insufficient expansion of the periphery of the circular punch is corrected by the elongations of the sheet in the directions of arrows c, and the interval of the chips becomes equal to the center of the punch.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55096066A JPS5847857B2 (en) | 1980-07-14 | 1980-07-14 | expansion device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55096066A JPS5847857B2 (en) | 1980-07-14 | 1980-07-14 | expansion device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5721835A true JPS5721835A (en) | 1982-02-04 |
JPS5847857B2 JPS5847857B2 (en) | 1983-10-25 |
Family
ID=14155045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55096066A Expired JPS5847857B2 (en) | 1980-07-14 | 1980-07-14 | expansion device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5847857B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009039899A1 (en) | 2008-09-10 | 2010-03-11 | Ushiodenki K.K. | discharge lamp |
DE102010008913A1 (en) | 2009-03-02 | 2010-09-09 | Ushio Denki K.K. | Short-arc discharge lamp |
DE102010022630A1 (en) | 2009-07-02 | 2011-01-05 | Ushio Denki K.K. | Short-arc discharge lamp comprises lighting tube, which forms discharge chamber, and pair of electrodes is provided, which is arranged in lighting tube of electrode main body |
DE102010047130A1 (en) | 2009-11-05 | 2011-05-12 | Ushio Denki K.K. | Short-arc discharge lamp |
-
1980
- 1980-07-14 JP JP55096066A patent/JPS5847857B2/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009039899A1 (en) | 2008-09-10 | 2010-03-11 | Ushiodenki K.K. | discharge lamp |
DE102010008913A1 (en) | 2009-03-02 | 2010-09-09 | Ushio Denki K.K. | Short-arc discharge lamp |
DE102010022630A1 (en) | 2009-07-02 | 2011-01-05 | Ushio Denki K.K. | Short-arc discharge lamp comprises lighting tube, which forms discharge chamber, and pair of electrodes is provided, which is arranged in lighting tube of electrode main body |
DE102010047130A1 (en) | 2009-11-05 | 2011-05-12 | Ushio Denki K.K. | Short-arc discharge lamp |
Also Published As
Publication number | Publication date |
---|---|
JPS5847857B2 (en) | 1983-10-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS52118858A (en) | Thermal reactor | |
JPS57205238A (en) | Seat | |
DK582486D0 (en) | METHOD AND APPARATUS FOR PRESSURE FORMING PLATE MATERIALS WITH A LITTLE EXTENSION | |
JPS5721835A (en) | Expanding device | |
JPS5586173A (en) | Manufacture of photo display device | |
JPS5752525A (en) | Method for press forming | |
JPS56131931A (en) | Controlling device of wafer temperature | |
JPH04255243A (en) | Sheet expander | |
JPS5260567A (en) | Production of semiconductor device | |
JPS6422552A (en) | Screen printing plate | |
GB1532437A (en) | Die for use in securing a deformable element to a sheet | |
JPS55147433A (en) | Press die material of double acting type | |
JPS52156551A (en) | Semiconductor wafer breaking method | |
SU566659A1 (en) | Device for stamping | |
JPS56149199A (en) | Forming method of diaphragm for speaker | |
FR2335345A1 (en) | Dimpled or relief metal sheet esp. for foil insulation - has large dimples superimposed on finer relief pattern | |
JPS55105346A (en) | Method for arranging semiconductor pellet | |
JPS51134957A (en) | Combustion heating device | |
JPS53116539A (en) | Exothermic device | |
JPS55103744A (en) | Semiconductor device | |
JPS5329579B2 (en) | ||
JPS5216971A (en) | Base plate heat treatment method and wafer for semiconductor | |
JPS5680137A (en) | Manufacture of semiconductor device | |
JPS5443961A (en) | Manufacture of synthetic resin tile | |
JPS55107709A (en) | Checker brick |