JPS5847857B2 - expansion device - Google Patents
expansion deviceInfo
- Publication number
- JPS5847857B2 JPS5847857B2 JP55096066A JP9606680A JPS5847857B2 JP S5847857 B2 JPS5847857 B2 JP S5847857B2 JP 55096066 A JP55096066 A JP 55096066A JP 9606680 A JP9606680 A JP 9606680A JP S5847857 B2 JPS5847857 B2 JP S5847857B2
- Authority
- JP
- Japan
- Prior art keywords
- punch
- sheet
- cylindrical punch
- cylindrical
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Description
【発明の詳細な説明】
本発明はクランキング済みのウエハを接着した伸張性シ
ートから半導体チップ（以下単にチップと呼ぶ）を正確
に取りはずせるように、該チップの配列を正しくマトリ
ックス状になすための拡張機の新規な機構に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention is aimed at correctly arranging semiconductor chips (hereinafter simply referred to as chips) in a matrix so that they can be accurately removed from a stretchable sheet to which cranked wafers are bonded. This paper relates to a new mechanism for the expansion machine.
半導体装置の製造工程においては、ウエハをスクライブ
しこれをクラツキングして複数個のチツプを採取する工
程かある。In the manufacturing process of semiconductor devices, there is a step in which a wafer is scribed and cracked to obtain a plurality of chips.
該工程には、まず上記のウエハを粘着性のある伸張性の
シートに張り付け、該ウエハにスクライブとクラツキン
グをほどこした後、該シートの周囲を第１図に示したご
とく２枚の支持板１ではさみ、固定して、その中央部よ
りポンチと呼ばれる円筒形の部材２（以下円筒形ポンチ
と呼ぶ）を、その中に内蔵するヒータ４で加熱した上で
矢印イの方向に押し上げる。In this process, first, the above-mentioned wafer is pasted on an adhesive stretchable sheet, and after scribing and cracking are applied to the wafer, two support plates 1 are placed around the sheet as shown in FIG. A cylindrical member 2 called a punch (hereinafter referred to as a cylindrical punch) is heated by a heater 4 built therein, and then pushed up in the direction of arrow A.
かくすれば、シ一ト３は伸張性に富み、しかも熱膨張を
起こすので、すでにクラツキングされているウエハのチ
ツプ５の間隔は、該チツプ５が図示しないコレットによ
って吸着されるだけの寸法にまで広げられる。In this way, since the sheet 3 is highly extensible and causes thermal expansion, the distance between the chips 5 of the already cracked wafer is reduced to a size that allows the chips 5 to be attracted by a collet (not shown). It can be expanded.
その後、該シ一ト３は枠で固定さわて図示しないトラン
スファ・マシンに移され、そのあとで該シ一ト３上のチ
ップか採取される。Thereafter, the sheet 3 is fixed with a frame and transferred to a transfer machine (not shown), and then the chips on the sheet 3 are collected.
こうした作業はすべて自動化した機構によって行われる
ものであるか、かくすることにより、チップの向きを崩
さず一定方向に保ったままで不良チップの除去とか、良
品チップのコレットによる吸着移送、あるいは該チップ
のダイボンテイングなどが容易に行える。All of these operations are performed by automated mechanisms, or by doing so, it is possible to remove defective chips while keeping the chip in a fixed direction without changing its orientation, or to transport good chips by suction using a collet. Die bonding etc. can be easily performed.
しかるに上記従来の拡散機では、円筒型ポンチの中央部
と周辺部との間に温度差を生じ、そのため、該ポンチ上
面のシートの熱膨張は一定でなく、円筒形ポンチの外周
に近く位置するチップほど、チップ間隔が伸びないとい
う現象か生じる。However, in the above-mentioned conventional spreader, a temperature difference is created between the central part and the peripheral part of the cylindrical punch, and therefore the thermal expansion of the sheet on the upper surface of the punch is not constant, and the sheet is located close to the outer periphery of the cylindrical punch. A phenomenon occurs in which the chip spacing does not increase as the chip increases.
この現象が生じるとチップ配列は整然としたマトリック
ス状とはならず、外側に向かって凸形に湾曲した２次元
配列となってしまう。If this phenomenon occurs, the chip array will not be in an orderly matrix shape, but will be a two-dimensional array convexly curved outward.
前記のごとくチップのコレットによる採取は自動化さわ
た機構で行われるものであるから、上述のような現象か
現れるとコレットの位置合わせなどに相当な修正をチッ
プの採取ごとにカロえる心要か生じて来るし、上記チッ
プ配列の湾曲はウエハロツドごとに多少の異なりを生じ
るために、上記の修正を手動で行わねばならないという
ような不都合な事態まで生じる。As mentioned above, since the collection of chips with a collet is performed by an automated handling mechanism, if the above-mentioned phenomenon occurs, it is necessary to make considerable adjustments to the alignment of the collet every time a chip is collected. Moreover, since the curvature of the chip array differs somewhat from wafer rod to wafer rod, an inconvenient situation arises in which the above-mentioned correction has to be made manually.
そこで本発明はこうした欠点に鑑みてなされたもので、
前記円筒形ポンチの直径よりも犬なる一辺を有する角形
ポンチを、該円筒形ポンチの外側に沿って上昇移動でき
るように配置し、上述のごときチップ間隔か円筒形ポン
チ上記の周辺近傍で伸ひないという現象を一掃すべく、
円筒形ポンチを上昇せしめた後に角形ポンチを上昇せし
め、伸張度か不足しているシート剖分を必要なたけ伸張
せしめ、これによって円筒形ポンチ上面の周辺近傍に位
置するチップ相互間の距離を犬にして正しいマトリック
ス状のチップ配列となさんとするもので、第２図以下の
図面を用いて詳記する。Therefore, the present invention was made in view of these drawbacks.
A square punch having one side smaller than the diameter of the cylindrical punch is arranged so as to be able to move upwardly along the outside of the cylindrical punch, and the cylindrical punch is extended at the tip interval as described above or near the periphery of the cylindrical punch. In order to eliminate the phenomenon of not having
After raising the cylindrical punch, the rectangular punch is raised to stretch the sheet that is insufficient in elongation to the necessary length, thereby reducing the distance between the tips located near the periphery of the top surface of the cylindrical punch. The correct matrix-like chip arrangement is explained in detail using the drawings from FIG. 2 onwards.
第２図ａは本発明に係る新規な拡張装置の構造を示す断
面図ならびに平面図であって、後述する第２図ｂ，ｃと
共に前記第１図と同等部位には同一記号を付す。FIG. 2a is a cross-sectional view and a plan view showing the structure of a novel expansion device according to the present invention, and the same symbols are attached to the same parts as in FIG. 1, along with FIGS. 2b and 2c described later.
まず該第２図ａの下図は未だ伸張されていないシ一ト３
上にクラツキングか施されチップ状となされたウエハ６
が張りつけられており、その一力で該シートの下部には
円筒形ポンチ２と角形ボンチ８とか同心状に納めらわて
いる状態を、また第２図ａ上図は円筒形ポンチ２、角形
ポンチ８、支持板１、ならびにクランキングされたウエ
ハ６の相対位置をそれぞれ示したものである。First, the lower part of Figure 2a shows sheet 3 which has not been expanded yet.
Wafer 6 with cracking applied to the top and made into chips
The cylindrical punch 2 and the square punch 8 are placed concentrically at the bottom of the sheet by one force, and the upper part of Figure 2a shows the cylindrical punch 2 and the square punch 8. The relative positions of the punch 8, the support plate 1, and the cranked wafer 6 are shown.
なおヒータ４は円筒形ポンチ２に内蔵されている。Note that the heater 4 is built into the cylindrical punch 2.
いま円筒形ポンチ２内のヒータ４で該ポンチ２を加熱し
た上で第２図ｂの下図に示すごとく円筒形ポンチ２のみ
を矢印イ方向に上昇せしめると、シ一ト３は伸張と熱膨
張を起こして同図に示されたごとくに延び、したかつて
円筒形ポンチ上面のチップ間隔は広がる。Now, when the punch 2 is heated by the heater 4 inside the cylindrical punch 2 and only the cylindrical punch 2 is raised in the direction of arrow A as shown in the lower diagram of FIG. 2b, the sheet 3 will expand and thermally expand. The cylindrical punch is raised and extended as shown in the figure, and the gap between the tips on the top surface of the cylindrical punch widens.
しかしその広がり方は従来の拡散装置における前記した
広がり力と同じく、該ポンチの中央部で広く周辺部付近
で狭いものとなり、これは同図上図に見られごときもの
となる。However, the way it spreads is similar to the above-mentioned spreading force in the conventional diffusing device, widening at the center of the punch and narrowing near the periphery, as seen in the upper part of the figure.
しかし次に角形ポンチ８を第２図Ｃの下図中に示した矢
印口の方向に上昇せしめれば、該角形ポンチの角ばった
角部の張り出したがシ一ト３を同図Ｃの上図中に示した
矢印ハカ向に押し拡げる。However, if the square punch 8 is then raised in the direction of the arrow shown in the lower part of FIG. Push it out in the direction of the arrow shown inside.
前記第２図ｂ上図に見られた円筒形ポンチ上面の周辺都
におけるチップ間隔の広がりの不足は、この矢印ハカ向
へのシートの伸張によって修正され、円筒形ポンチの中
央部と同じだりのチップ間隔の広がりを持つようになる
ために、該チップ間隔は同図Ｃの上図に見られるごとく
正しくマトリックス状の配列を呈するようになる。The lack of widening of the chip spacing at the periphery of the upper surface of the cylindrical punch seen in the upper part of Fig. 2b is corrected by stretching the sheet in the direction of the arrow, and the gap becomes the same as the center of the cylindrical punch. Since the chip spacing is widened, the chip spacing becomes properly arranged in a matrix as shown in the upper part of FIG.
ただし、この場合、角形ポンチを第２図Ｃ下図に示した
円筒形ポンチと同じ高さにまで押し上げるならば、今度
は同図上図に示した矢印八方向のシートの伸張か大きく
なりすぎ、したかつて矢印八カ向へのチップ間隔が広が
りすぎてチップ配列はあたかも糸巻き形となってしまう
ことかある。However, in this case, if the square punch is pushed up to the same height as the cylindrical punch shown in the lower part of Figure 2C, the sheet will stretch too much in the eight directions of the arrows shown in the upper part of the same figure. In the past, the spacing between chips in the eight directions of the arrows became so wide that the chip arrangement became like a pincushion.
このようなチップ配列となれば、前記したコレットの位
置合わせなどに必要な修正をチップの採取ごとに力口え
る必要か生じるという不都合が起こるので、前記角形ポ
ンチの上昇停止位置は、実際に円形ポンチ上のチップ配
列か正しくマトリックス状を呈した位置で止める必要か
ある。If such a chip arrangement is used, there will be an inconvenience in that it will be necessary to make corrections necessary for collet positioning etc. each time a chip is collected. It is necessary to arrange the chips on the punch or to stop at a position where the chips form a correct matrix shape.
本発明による拡張装置を用いれば、チップのコレットに
よる自動機構による採取か正確に行えるようになり、作
業性が著しく向上するために、実用上大の効果が期待で
きる。By using the expansion device according to the present invention, it becomes possible to accurately collect chips using an automatic mechanism using a collet, and work efficiency is significantly improved, so that great practical effects can be expected.
第１図は従来の円筒形ポンチのみを用いた状態を示す図
、第２図ａは本発明に係る円筒形ポンチと角形ポンチを
用いる場合の新規な拡張装置の構造を示す平面図ならび
に断面図、第２図ｂ，ｃは本発明の拡張装置を用いてチ
ップ間隔の拡張を行う状態を示した図である。
１：支持板、２：円筒形ポンチ、３：シート、４：ヒー
タ、６：クラツキングされたウエハ、８：角形ポンチ。Fig. 1 is a diagram showing a state in which only a conventional cylindrical punch is used, and Fig. 2a is a plan view and a sectional view showing the structure of a novel expansion device using a cylindrical punch and a square punch according to the present invention. , FIGS. 2b and 2c are diagrams showing a state in which the chip spacing is expanded using the expansion device of the present invention. 1: support plate, 2: cylindrical punch, 3: sheet, 4: heater, 6: cracked wafer, 8: square punch.
Claims (1)
ＨＢ＋固定して、該シート中央部を加熱されたポンチで
押し付けることにより該シートを伸はして所定のチップ
間隔を得る拡張装置において、該ポンチを、円筒形のも
のと、該円筒形ポンチの直径よりも犬なる一辺を有する
角形補正ポンチとの同心２重構造となし、かつ前記円筒
形ポンチと角形ポンチを別個に移動可能に設置してなる
ことを特徴とする拡張装置。1. In an expansion device, the periphery HB+ of the sheet to which the cranked wafer is glued is fixed, and the central part of the sheet is pressed with a heated punch to stretch the sheet to obtain a predetermined chip spacing. , has a concentric double structure of a cylindrical punch and a square correction punch having one side larger than the diameter of the cylindrical punch, and the cylindrical punch and the square punch are installed movably separately. An expansion device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55096066A JPS5847857B2 (en) | 1980-07-14 | 1980-07-14 | expansion device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55096066A JPS5847857B2 (en) | 1980-07-14 | 1980-07-14 | expansion device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5721835A JPS5721835A (en) | 1982-02-04 |
| JPS5847857B2 true JPS5847857B2 (en) | 1983-10-25 |
Family
ID=14155045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55096066A Expired JPS5847857B2 (en) | 1980-07-14 | 1980-07-14 | expansion device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5847857B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4591583B2 (en) | 2008-09-10 | 2010-12-01 | ウシオ電機株式会社 | Discharge lamp |
| JP4678059B2 (en) | 2009-03-02 | 2011-04-27 | ウシオ電機株式会社 | Short arc type discharge lamp |
| JP4760964B2 (en) | 2009-07-02 | 2011-08-31 | ウシオ電機株式会社 | Short arc type discharge lamp |
| JP4826669B2 (en) | 2009-11-05 | 2011-11-30 | ウシオ電機株式会社 | Short arc type discharge lamp |
-
1980
- 1980-07-14 JP JP55096066A patent/JPS5847857B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5721835A (en) | 1982-02-04 |
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