JPS5329579B2 - - Google Patents
Info
- Publication number
- JPS5329579B2 JPS5329579B2 JP9605776A JP9605776A JPS5329579B2 JP S5329579 B2 JPS5329579 B2 JP S5329579B2 JP 9605776 A JP9605776 A JP 9605776A JP 9605776 A JP9605776 A JP 9605776A JP S5329579 B2 JPS5329579 B2 JP S5329579B2
- Authority
- JP
- Japan
- Prior art keywords
- ech
- solder
- region
- multiplicity
- lamination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To provide a multiplicity of holes which accommodate solder discs in lamination on the surface of a base in the position corresponding to ech pellet region of a wafer and positively and accurately feed one sheet of solder at one time to ech required region with a vacuum suction tool.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9605776A JPS5322373A (en) | 1976-08-13 | 1976-08-13 | Solder d isc feeder to wafers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9605776A JPS5322373A (en) | 1976-08-13 | 1976-08-13 | Solder d isc feeder to wafers |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5322373A JPS5322373A (en) | 1978-03-01 |
JPS5329579B2 true JPS5329579B2 (en) | 1978-08-22 |
Family
ID=14154805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9605776A Granted JPS5322373A (en) | 1976-08-13 | 1976-08-13 | Solder d isc feeder to wafers |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5322373A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63129102U (en) * | 1987-02-17 | 1988-08-24 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000020089A1 (en) | 1998-10-02 | 2000-04-13 | Mitsubishi Heavy Industries, Ltd. | Liquid extracting device |
-
1976
- 1976-08-13 JP JP9605776A patent/JPS5322373A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63129102U (en) * | 1987-02-17 | 1988-08-24 |
Also Published As
Publication number | Publication date |
---|---|
JPS5322373A (en) | 1978-03-01 |
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