JPS5748462A - Grinding attachment for modifying automatically form - Google Patents
Grinding attachment for modifying automatically formInfo
- Publication number
- JPS5748462A JPS5748462A JP55119863A JP11986380A JPS5748462A JP S5748462 A JPS5748462 A JP S5748462A JP 55119863 A JP55119863 A JP 55119863A JP 11986380 A JP11986380 A JP 11986380A JP S5748462 A JPS5748462 A JP S5748462A
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- uniform pattern
- work
- judge
- rotated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
PURPOSE: To provide a base plate having an approximately uniform pattern over the whole surface of the base plate by automatically detecting the pattern embossed on a work surface to judge a form to be worked for grinding the base plate.
CONSTITUTION: Patterns in the proximities of outer periphery and center of a base plate 1 in a measuring station III are measured by the use of a picture taking lens 10, light source 11 and eyepiece 12 with a circular table 4 being rotated. The result is calculated to judge shears of the respective portions of the base plate 1 from the uniform pattern and determine portions to be ground thicker than those in the base plate 1. A base plate holding stage 16 is operated to be specifically slanted, and the circular table 4 is rotated to approach a work stage I for a predetermined work so that the base plate having an approximately uniform pattern over the whole surface thereof is provided.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55119863A JPS5815265B2 (en) | 1980-09-01 | 1980-09-01 | Automatic shape correction polishing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55119863A JPS5815265B2 (en) | 1980-09-01 | 1980-09-01 | Automatic shape correction polishing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5748462A true JPS5748462A (en) | 1982-03-19 |
JPS5815265B2 JPS5815265B2 (en) | 1983-03-24 |
Family
ID=14772129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55119863A Expired JPS5815265B2 (en) | 1980-09-01 | 1980-09-01 | Automatic shape correction polishing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5815265B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3221395A1 (en) * | 1982-06-05 | 1983-12-08 | Werner Gerhard 6113 Babenhausen Lang | Double-spindle grinding machine |
JPS6125760A (en) * | 1984-07-09 | 1986-02-04 | Toshiba Corp | Grinding method and device |
JPS6171955A (en) * | 1984-09-12 | 1986-04-12 | Toshiba Corp | Grinding method and its device |
JPS61226253A (en) * | 1985-03-30 | 1986-10-08 | Mitsubishi Metal Corp | Automatic parallel-surface grinder |
JPS6251461A (en) * | 1985-08-30 | 1987-03-06 | Brother Ind Ltd | Manufacture of printing head |
US6161055A (en) * | 1993-05-17 | 2000-12-12 | Laser Measurement International Inc. | Method of determining tool breakage |
JP2007331106A (en) * | 1995-05-23 | 2007-12-27 | Nova Measuring Instruments Ltd | Polishing method for measuring station, polishing machine, and wafer, and optical measuring method for wafer |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5542738A (en) * | 1978-09-20 | 1980-03-26 | Toshiba Corp | Abrasive grain processing device |
-
1980
- 1980-09-01 JP JP55119863A patent/JPS5815265B2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5542738A (en) * | 1978-09-20 | 1980-03-26 | Toshiba Corp | Abrasive grain processing device |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3221395A1 (en) * | 1982-06-05 | 1983-12-08 | Werner Gerhard 6113 Babenhausen Lang | Double-spindle grinding machine |
JPS6125760A (en) * | 1984-07-09 | 1986-02-04 | Toshiba Corp | Grinding method and device |
JPH0558859B2 (en) * | 1984-07-09 | 1993-08-27 | Tokyo Shibaura Electric Co | |
JPS6171955A (en) * | 1984-09-12 | 1986-04-12 | Toshiba Corp | Grinding method and its device |
JPH0575548B2 (en) * | 1984-09-12 | 1993-10-20 | Tokyo Shibaura Electric Co | |
JPS61226253A (en) * | 1985-03-30 | 1986-10-08 | Mitsubishi Metal Corp | Automatic parallel-surface grinder |
JPS6251461A (en) * | 1985-08-30 | 1987-03-06 | Brother Ind Ltd | Manufacture of printing head |
US6161055A (en) * | 1993-05-17 | 2000-12-12 | Laser Measurement International Inc. | Method of determining tool breakage |
JP2007331106A (en) * | 1995-05-23 | 2007-12-27 | Nova Measuring Instruments Ltd | Polishing method for measuring station, polishing machine, and wafer, and optical measuring method for wafer |
Also Published As
Publication number | Publication date |
---|---|
JPS5815265B2 (en) | 1983-03-24 |
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