JPS57149740A - Manufacture of resin sealing type semiconductor device - Google Patents

Manufacture of resin sealing type semiconductor device

Info

Publication number
JPS57149740A
JPS57149740A JP3485281A JP3485281A JPS57149740A JP S57149740 A JPS57149740 A JP S57149740A JP 3485281 A JP3485281 A JP 3485281A JP 3485281 A JP3485281 A JP 3485281A JP S57149740 A JPS57149740 A JP S57149740A
Authority
JP
Japan
Prior art keywords
leads
connectors
sealing body
lead frame
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3485281A
Other languages
Japanese (ja)
Inventor
Yoshiaki Tatsumi
Tadao Okabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3485281A priority Critical patent/JPS57149740A/en
Publication of JPS57149740A publication Critical patent/JPS57149740A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To increase the strength of a die, to facilitate manufacture and to miniaturize a lead frame by regulating the shape of a guide formed to the side surface of a resin sealing body by the connector of the lead frame. CONSTITUTION:The connectors 22 are formed at both sides of leads 21 connected to a supporting frame 20 while their width Y1 is equalized with the collar- shaped guide 27 at both sides of the resin sealing body 25 with width X1. The lead frame is disposed into the hollow section 26 of the die 24. The hollow section 26 is wider than the width Y1 of the connectors 22, the projecting surface 27a of the guide 27 formed to the side surface of the sealing body 25 is regulated by hold-down tools 24al, 24bl projected to the inside and the surfaces 22a of the connectors 22, and the shape of the outer surface of the sealing body is regulated by the inner wall surface of the hollow section 26 shaped by the die 24. A semicondctor element mounted at the noses of the leads 21 and one parts of the leads 21 are sealed through the injection of resin, the leads 21 are cut at predetermined positions, and the guide 27 and the connectors 22 are separated. According to this manufacture, upper and lower dies are easily manufactured more than conventional methods, the lead frame can be miniaturized, and the leads can be sealed with high accuracy for a long term.
JP3485281A 1981-03-11 1981-03-11 Manufacture of resin sealing type semiconductor device Pending JPS57149740A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3485281A JPS57149740A (en) 1981-03-11 1981-03-11 Manufacture of resin sealing type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3485281A JPS57149740A (en) 1981-03-11 1981-03-11 Manufacture of resin sealing type semiconductor device

Publications (1)

Publication Number Publication Date
JPS57149740A true JPS57149740A (en) 1982-09-16

Family

ID=12425701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3485281A Pending JPS57149740A (en) 1981-03-11 1981-03-11 Manufacture of resin sealing type semiconductor device

Country Status (1)

Country Link
JP (1) JPS57149740A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280331U (en) * 1985-11-09 1987-05-22
JPS63273343A (en) * 1987-04-30 1988-11-10 Mitsubishi Electric Corp Lead frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280331U (en) * 1985-11-09 1987-05-22
JPS63273343A (en) * 1987-04-30 1988-11-10 Mitsubishi Electric Corp Lead frame

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