JPS57194539A - Pressing structure for lead frame - Google Patents
Pressing structure for lead frameInfo
- Publication number
- JPS57194539A JPS57194539A JP7919581A JP7919581A JPS57194539A JP S57194539 A JPS57194539 A JP S57194539A JP 7919581 A JP7919581 A JP 7919581A JP 7919581 A JP7919581 A JP 7919581A JP S57194539 A JPS57194539 A JP S57194539A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- pressing
- pressing structure
- lead
- reliability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To perform a uniform pressing for the lead frame as well as to improve the reliability for wire bonding by a method wherein the pressing part of the frame pressing member of the lead frame pressing structure is divided into a plurality of parts. CONSTITUTION:The pressing part 12 of the lead frame pressing structure main body 10 is divided into a plurality of parts by slits 14 and notches 18, and each lead of the lead frames 16 is individually pressed by the above. Accordingly, the degree of adhesion of the part to be pressed on the lead frame can be uniformalized and improved considerably, thereby enabling to increase the reliability of the wire bonding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7919581A JPS57194539A (en) | 1981-05-27 | 1981-05-27 | Pressing structure for lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7919581A JPS57194539A (en) | 1981-05-27 | 1981-05-27 | Pressing structure for lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57194539A true JPS57194539A (en) | 1982-11-30 |
Family
ID=13683187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7919581A Pending JPS57194539A (en) | 1981-05-27 | 1981-05-27 | Pressing structure for lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57194539A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61100136U (en) * | 1984-12-07 | 1986-06-26 | ||
JPS63255929A (en) * | 1987-04-14 | 1988-10-24 | Nec Corp | Wire connection equipment for semiconductor device |
JPH03233947A (en) * | 1990-02-09 | 1991-10-17 | Fujitsu Ltd | Lead-frame inner-lead holding-down jig |
JPH0494730U (en) * | 1991-01-11 | 1992-08-17 | ||
US5406700A (en) * | 1990-11-20 | 1995-04-18 | Seiko Epson Corporation | Method for producing pin integrated circuit lead frame |
-
1981
- 1981-05-27 JP JP7919581A patent/JPS57194539A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61100136U (en) * | 1984-12-07 | 1986-06-26 | ||
JPH025536Y2 (en) * | 1984-12-07 | 1990-02-09 | ||
JPS63255929A (en) * | 1987-04-14 | 1988-10-24 | Nec Corp | Wire connection equipment for semiconductor device |
JPH03233947A (en) * | 1990-02-09 | 1991-10-17 | Fujitsu Ltd | Lead-frame inner-lead holding-down jig |
US5406700A (en) * | 1990-11-20 | 1995-04-18 | Seiko Epson Corporation | Method for producing pin integrated circuit lead frame |
JPH0494730U (en) * | 1991-01-11 | 1992-08-17 |
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