JPS57194539A - Pressing structure for lead frame - Google Patents

Pressing structure for lead frame

Info

Publication number
JPS57194539A
JPS57194539A JP7919581A JP7919581A JPS57194539A JP S57194539 A JPS57194539 A JP S57194539A JP 7919581 A JP7919581 A JP 7919581A JP 7919581 A JP7919581 A JP 7919581A JP S57194539 A JPS57194539 A JP S57194539A
Authority
JP
Japan
Prior art keywords
lead frame
pressing
pressing structure
lead
reliability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7919581A
Other languages
Japanese (ja)
Inventor
Shunichiro Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP7919581A priority Critical patent/JPS57194539A/en
Publication of JPS57194539A publication Critical patent/JPS57194539A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To perform a uniform pressing for the lead frame as well as to improve the reliability for wire bonding by a method wherein the pressing part of the frame pressing member of the lead frame pressing structure is divided into a plurality of parts. CONSTITUTION:The pressing part 12 of the lead frame pressing structure main body 10 is divided into a plurality of parts by slits 14 and notches 18, and each lead of the lead frames 16 is individually pressed by the above. Accordingly, the degree of adhesion of the part to be pressed on the lead frame can be uniformalized and improved considerably, thereby enabling to increase the reliability of the wire bonding.
JP7919581A 1981-05-27 1981-05-27 Pressing structure for lead frame Pending JPS57194539A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7919581A JPS57194539A (en) 1981-05-27 1981-05-27 Pressing structure for lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7919581A JPS57194539A (en) 1981-05-27 1981-05-27 Pressing structure for lead frame

Publications (1)

Publication Number Publication Date
JPS57194539A true JPS57194539A (en) 1982-11-30

Family

ID=13683187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7919581A Pending JPS57194539A (en) 1981-05-27 1981-05-27 Pressing structure for lead frame

Country Status (1)

Country Link
JP (1) JPS57194539A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61100136U (en) * 1984-12-07 1986-06-26
JPS63255929A (en) * 1987-04-14 1988-10-24 Nec Corp Wire connection equipment for semiconductor device
JPH03233947A (en) * 1990-02-09 1991-10-17 Fujitsu Ltd Lead-frame inner-lead holding-down jig
JPH0494730U (en) * 1991-01-11 1992-08-17
US5406700A (en) * 1990-11-20 1995-04-18 Seiko Epson Corporation Method for producing pin integrated circuit lead frame

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61100136U (en) * 1984-12-07 1986-06-26
JPH025536Y2 (en) * 1984-12-07 1990-02-09
JPS63255929A (en) * 1987-04-14 1988-10-24 Nec Corp Wire connection equipment for semiconductor device
JPH03233947A (en) * 1990-02-09 1991-10-17 Fujitsu Ltd Lead-frame inner-lead holding-down jig
US5406700A (en) * 1990-11-20 1995-04-18 Seiko Epson Corporation Method for producing pin integrated circuit lead frame
JPH0494730U (en) * 1991-01-11 1992-08-17

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