JPS562642A - Device for forming resin-sealed semiconductor device - Google Patents

Device for forming resin-sealed semiconductor device

Info

Publication number
JPS562642A
JPS562642A JP7986279A JP7986279A JPS562642A JP S562642 A JPS562642 A JP S562642A JP 7986279 A JP7986279 A JP 7986279A JP 7986279 A JP7986279 A JP 7986279A JP S562642 A JPS562642 A JP S562642A
Authority
JP
Japan
Prior art keywords
burr
lead wire
guide
produced
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7986279A
Other languages
Japanese (ja)
Other versions
JPS5943090B2 (en
Inventor
Yutaka Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7986279A priority Critical patent/JPS5943090B2/en
Publication of JPS562642A publication Critical patent/JPS562642A/en
Publication of JPS5943090B2 publication Critical patent/JPS5943090B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To form cutouts at burr produced around lead wire and simplify the removal of the burr by producing thick burr thus produced. CONSTITUTION:Cavities 15 are formed t the upper die 5 and the lower die 6 connected to a lead guide 14 in both end direction from the cavity 7. A projection 15 is provided in a cavity 15, and a guide 14' is provided in extension direction of the lead wire 1a. After sealing it with resin, a thin burr 19 due to the gap 10 between the guide 14 and the lead wire 1a is formed at the guide 14 having a width l, the resin filled in the cavity 15 forms a thick burr 18, and a cutout 17 is formed by the projection 16. Further, a thin burr 19 is produced by the gap 10 between the guide 14' and the lead wire 1a. When the thick burr 18 is urged thereto, it is simply removed due to the cutout 17, and the thin burr thus connected is also removed. Thus, no residual thin burr is produced. In this manner, the cutout is formed in parallel with the lead wire direction, the thick burr can be simply removed to damage no surface of the lead wire.
JP7986279A 1979-06-22 1979-06-22 Molding equipment for resin-encapsulated semiconductor devices Expired JPS5943090B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7986279A JPS5943090B2 (en) 1979-06-22 1979-06-22 Molding equipment for resin-encapsulated semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7986279A JPS5943090B2 (en) 1979-06-22 1979-06-22 Molding equipment for resin-encapsulated semiconductor devices

Publications (2)

Publication Number Publication Date
JPS562642A true JPS562642A (en) 1981-01-12
JPS5943090B2 JPS5943090B2 (en) 1984-10-19

Family

ID=13702004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7986279A Expired JPS5943090B2 (en) 1979-06-22 1979-06-22 Molding equipment for resin-encapsulated semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5943090B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6430237A (en) * 1987-07-27 1989-02-01 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096794U (en) * 1983-12-07 1985-07-02 山本　昌夫 Far infrared radiation plate
JPS63493U (en) * 1986-06-18 1988-01-05
JPH0186874U (en) * 1987-12-01 1989-06-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6430237A (en) * 1987-07-27 1989-02-01 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device

Also Published As

Publication number Publication date
JPS5943090B2 (en) 1984-10-19

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