JPS562642A - Device for forming resin-sealed semiconductor device - Google Patents
Device for forming resin-sealed semiconductor deviceInfo
- Publication number
- JPS562642A JPS562642A JP7986279A JP7986279A JPS562642A JP S562642 A JPS562642 A JP S562642A JP 7986279 A JP7986279 A JP 7986279A JP 7986279 A JP7986279 A JP 7986279A JP S562642 A JPS562642 A JP S562642A
- Authority
- JP
- Japan
- Prior art keywords
- burr
- lead wire
- guide
- produced
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To form cutouts at burr produced around lead wire and simplify the removal of the burr by producing thick burr thus produced. CONSTITUTION:Cavities 15 are formed t the upper die 5 and the lower die 6 connected to a lead guide 14 in both end direction from the cavity 7. A projection 15 is provided in a cavity 15, and a guide 14' is provided in extension direction of the lead wire 1a. After sealing it with resin, a thin burr 19 due to the gap 10 between the guide 14 and the lead wire 1a is formed at the guide 14 having a width l, the resin filled in the cavity 15 forms a thick burr 18, and a cutout 17 is formed by the projection 16. Further, a thin burr 19 is produced by the gap 10 between the guide 14' and the lead wire 1a. When the thick burr 18 is urged thereto, it is simply removed due to the cutout 17, and the thin burr thus connected is also removed. Thus, no residual thin burr is produced. In this manner, the cutout is formed in parallel with the lead wire direction, the thick burr can be simply removed to damage no surface of the lead wire.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7986279A JPS5943090B2 (en) | 1979-06-22 | 1979-06-22 | Molding equipment for resin-encapsulated semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7986279A JPS5943090B2 (en) | 1979-06-22 | 1979-06-22 | Molding equipment for resin-encapsulated semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS562642A true JPS562642A (en) | 1981-01-12 |
JPS5943090B2 JPS5943090B2 (en) | 1984-10-19 |
Family
ID=13702004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7986279A Expired JPS5943090B2 (en) | 1979-06-22 | 1979-06-22 | Molding equipment for resin-encapsulated semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5943090B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6430237A (en) * | 1987-07-27 | 1989-02-01 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6096794U (en) * | 1983-12-07 | 1985-07-02 | 山本 昌夫 | Far infrared radiation plate |
JPS63493U (en) * | 1986-06-18 | 1988-01-05 | ||
JPH0186874U (en) * | 1987-12-01 | 1989-06-08 |
-
1979
- 1979-06-22 JP JP7986279A patent/JPS5943090B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6430237A (en) * | 1987-07-27 | 1989-02-01 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS5943090B2 (en) | 1984-10-19 |
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