JPS55138851A - Apparatus for fabricating semiconductor device - Google Patents

Apparatus for fabricating semiconductor device

Info

Publication number
JPS55138851A
JPS55138851A JP4684979A JP4684979A JPS55138851A JP S55138851 A JPS55138851 A JP S55138851A JP 4684979 A JP4684979 A JP 4684979A JP 4684979 A JP4684979 A JP 4684979A JP S55138851 A JPS55138851 A JP S55138851A
Authority
JP
Japan
Prior art keywords
lead wire
inner lead
dies
semiconductor device
moved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4684979A
Other languages
Japanese (ja)
Inventor
Manabu Bonshihara
Toshio Kasuga
Takashi Miyamoto
Hiroshi Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4684979A priority Critical patent/JPS55138851A/en
Publication of JPS55138851A publication Critical patent/JPS55138851A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To provide stable inner lead wires at a semiconductor device by providing a jig moving toward the direction of an opening within a hole of lead wire cutting dies and connecting the lead wire to connection terminal. CONSTITUTION:When the male and female dies 1 and 2 of an inner lead wire cutting die are so moved as to reduce the gap 6, inner lead wires 12 are separated from a lead frame blank 9 by cutting blades 4. Then, heating and pressurizing jig 5 is moved in the direction of an opening in the dies 2 and 3 to solderlessly pressurize thermally the inner lead wires 12 thus separated to a lower lead wire 8.
JP4684979A 1979-04-17 1979-04-17 Apparatus for fabricating semiconductor device Pending JPS55138851A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4684979A JPS55138851A (en) 1979-04-17 1979-04-17 Apparatus for fabricating semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4684979A JPS55138851A (en) 1979-04-17 1979-04-17 Apparatus for fabricating semiconductor device

Publications (1)

Publication Number Publication Date
JPS55138851A true JPS55138851A (en) 1980-10-30

Family

ID=12758778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4684979A Pending JPS55138851A (en) 1979-04-17 1979-04-17 Apparatus for fabricating semiconductor device

Country Status (1)

Country Link
JP (1) JPS55138851A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935459A (en) * 1982-08-23 1984-02-27 Sharp Corp Semiconductor device
JPH02278757A (en) * 1989-04-19 1990-11-15 Nec Corp Hybrid integrated circuit
JPH04219942A (en) * 1990-12-20 1992-08-11 Matsushita Electric Ind Co Ltd Connecting method for lead of ic component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935459A (en) * 1982-08-23 1984-02-27 Sharp Corp Semiconductor device
JPH02278757A (en) * 1989-04-19 1990-11-15 Nec Corp Hybrid integrated circuit
JPH04219942A (en) * 1990-12-20 1992-08-11 Matsushita Electric Ind Co Ltd Connecting method for lead of ic component

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