JPS57146340A - Data transfer system - Google Patents
Data transfer systemInfo
- Publication number
- JPS57146340A JPS57146340A JP56031315A JP3131581A JPS57146340A JP S57146340 A JPS57146340 A JP S57146340A JP 56031315 A JP56031315 A JP 56031315A JP 3131581 A JP3131581 A JP 3131581A JP S57146340 A JPS57146340 A JP S57146340A
- Authority
- JP
- Japan
- Prior art keywords
- data
- prc
- output
- printer
- latch circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56031315A JPS57146340A (en) | 1981-03-06 | 1981-03-06 | Data transfer system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56031315A JPS57146340A (en) | 1981-03-06 | 1981-03-06 | Data transfer system |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57146340A true JPS57146340A (en) | 1982-09-09 |
Family
ID=12327842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56031315A Pending JPS57146340A (en) | 1981-03-06 | 1981-03-06 | Data transfer system |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57146340A (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59173819A (ja) * | 1983-03-23 | 1984-10-02 | Hitachi Ltd | 入力装置 |
JPS614226U (ja) * | 1984-06-12 | 1986-01-11 | ブラザー工業株式会社 | 印字装置 |
JPH01173221A (ja) * | 1987-12-28 | 1989-07-07 | Nec Corp | プリンタ装置 |
US5965943A (en) * | 1997-10-01 | 1999-10-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device with bonding pad electrode |
US6087840A (en) * | 1997-10-21 | 2000-07-11 | Mitsubishi Denki Kabushiki Kaisha | Probe card with vertical needle for enabling improved wafer testing and method of manufacturing the same |
US6100708A (en) * | 1997-09-26 | 2000-08-08 | Mitsubishi Denki Kabushiki Kaisha | Probe card and wafer testing method using the same |
US6144212A (en) * | 1997-10-21 | 2000-11-07 | Mitsubishi Denki Kabushiki Kaisha | Vertical needle type probe card, method of manufacturing thereof, method of replacing defective probe needle and test method of wafer using the probe card |
-
1981
- 1981-03-06 JP JP56031315A patent/JPS57146340A/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59173819A (ja) * | 1983-03-23 | 1984-10-02 | Hitachi Ltd | 入力装置 |
JPS6336540B2 (ja) * | 1983-03-23 | 1988-07-20 | Hitachi Ltd | |
JPS614226U (ja) * | 1984-06-12 | 1986-01-11 | ブラザー工業株式会社 | 印字装置 |
JPH01173221A (ja) * | 1987-12-28 | 1989-07-07 | Nec Corp | プリンタ装置 |
US6100708A (en) * | 1997-09-26 | 2000-08-08 | Mitsubishi Denki Kabushiki Kaisha | Probe card and wafer testing method using the same |
US5965943A (en) * | 1997-10-01 | 1999-10-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device with bonding pad electrode |
US6087840A (en) * | 1997-10-21 | 2000-07-11 | Mitsubishi Denki Kabushiki Kaisha | Probe card with vertical needle for enabling improved wafer testing and method of manufacturing the same |
US6144212A (en) * | 1997-10-21 | 2000-11-07 | Mitsubishi Denki Kabushiki Kaisha | Vertical needle type probe card, method of manufacturing thereof, method of replacing defective probe needle and test method of wafer using the probe card |
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