JPS57138135A - Method and apparatus for inspecting pattern - Google Patents

Method and apparatus for inspecting pattern

Info

Publication number
JPS57138135A
JPS57138135A JP2302681A JP2302681A JPS57138135A JP S57138135 A JPS57138135 A JP S57138135A JP 2302681 A JP2302681 A JP 2302681A JP 2302681 A JP2302681 A JP 2302681A JP S57138135 A JPS57138135 A JP S57138135A
Authority
JP
Japan
Prior art keywords
mask
pattern
line
photo
reference point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2302681A
Other languages
Japanese (ja)
Inventor
Kiyoshi Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2302681A priority Critical patent/JPS57138135A/en
Publication of JPS57138135A publication Critical patent/JPS57138135A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

PURPOSE:To automate positioning and improve its accuracy by detecting a scribing line or the positioning mark of the whole and successively moving and controlling the inspecting position of a photo-mask on the basis of the size, etc. of each unit pattern while using the position of said line or mark as the reference. CONSTITUTION:Each unit pattern P on the photo-mask 1 is read photoelectrically, and compared with pattern forming data memorized, and acceptables or defectives are inspected and displayed. The pattern with the scribing lines 2A, 2B is positioned in such a manner that a table is driven from an arbitrary initial location 0, the line edges S1-S4 of the pattern P1 are detected, and the central position C is calculated from each moving distance l1-l4, and used as the reference point of positioning. The photo-mask is moved in the X or Y direction only by a predetermined distance including line width after the P1 is inspected, and the P such as the P2 is positioned. The mask with no scribing line is positioned in such a manner that one of marks M put at both left and right ends is detected as a reference point, and the mask is successively shifted and controlled in the X or Y direction at every the size d of a unit pattern region from the reference point. Accordingly, the inspection of the mask with no physical mark can also be automated and can be executed with high accuracy.
JP2302681A 1981-02-20 1981-02-20 Method and apparatus for inspecting pattern Pending JPS57138135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2302681A JPS57138135A (en) 1981-02-20 1981-02-20 Method and apparatus for inspecting pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2302681A JPS57138135A (en) 1981-02-20 1981-02-20 Method and apparatus for inspecting pattern

Publications (1)

Publication Number Publication Date
JPS57138135A true JPS57138135A (en) 1982-08-26

Family

ID=12098960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2302681A Pending JPS57138135A (en) 1981-02-20 1981-02-20 Method and apparatus for inspecting pattern

Country Status (1)

Country Link
JP (1) JPS57138135A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03108735A (en) * 1989-09-22 1991-05-08 Hitachi Ltd Method and apparatus for comparison inspection
JP2017068122A (en) * 2015-09-30 2017-04-06 日東電工株式会社 Method of inspecting elongate polarizers

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105329A (en) * 1978-12-28 1980-08-12 Fujitsu Ltd Inspecting method for pattern
JPS55157232A (en) * 1979-05-28 1980-12-06 Fujitsu Ltd Method of inspecting pattern
JPS5654038A (en) * 1979-10-08 1981-05-13 Toshiba Corp Checking device for shape of photomask

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105329A (en) * 1978-12-28 1980-08-12 Fujitsu Ltd Inspecting method for pattern
JPS55157232A (en) * 1979-05-28 1980-12-06 Fujitsu Ltd Method of inspecting pattern
JPS5654038A (en) * 1979-10-08 1981-05-13 Toshiba Corp Checking device for shape of photomask

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03108735A (en) * 1989-09-22 1991-05-08 Hitachi Ltd Method and apparatus for comparison inspection
JP2017068122A (en) * 2015-09-30 2017-04-06 日東電工株式会社 Method of inspecting elongate polarizers

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