JPS57132352A - Complementary type metal oxide semiconductor integrated circuit device - Google Patents

Complementary type metal oxide semiconductor integrated circuit device

Info

Publication number
JPS57132352A
JPS57132352A JP56018604A JP1860481A JPS57132352A JP S57132352 A JPS57132352 A JP S57132352A JP 56018604 A JP56018604 A JP 56018604A JP 1860481 A JP1860481 A JP 1860481A JP S57132352 A JPS57132352 A JP S57132352A
Authority
JP
Japan
Prior art keywords
layers
region
type
integrated circuit
metal oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56018604A
Other languages
Japanese (ja)
Inventor
Keiichi Murayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56018604A priority Critical patent/JPS57132352A/en
Publication of JPS57132352A publication Critical patent/JPS57132352A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H01L27/0927Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors comprising a P-well only in the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain ohmic connection excellent for connection with each region by using a silicide consisting of an alloy of silicon and a metal as the wiring material of the complementary type MOS integrated ciurcit. CONSTITUTION:A P type well 2 is selectively diffused and formed to an N type silicon substrate 1, a field oxide film 3 and a gate insulating film 4 are shaped, and source and drain diffusion layers 5, 6, 7, 8 are molded. The polysilicon layers 9, 10, 11 of the first layers functioning as gate electrodes and wiring are formed, each region is coated with comparatively thin oxide films 12, and contact holes 13, 14, 15 are bored to the oxide films 12. The second layers 16 consisting of the alloy of polysilicon and the metal, such as platinum, molybdenum or the like are shaped onto the holes, and connected to the P<+> type region 6 as a drain, the N<+> type region 8 and the polysilicon layers through the contact holes 13, 14, 15.
JP56018604A 1981-02-10 1981-02-10 Complementary type metal oxide semiconductor integrated circuit device Pending JPS57132352A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56018604A JPS57132352A (en) 1981-02-10 1981-02-10 Complementary type metal oxide semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56018604A JPS57132352A (en) 1981-02-10 1981-02-10 Complementary type metal oxide semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS57132352A true JPS57132352A (en) 1982-08-16

Family

ID=11976239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56018604A Pending JPS57132352A (en) 1981-02-10 1981-02-10 Complementary type metal oxide semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS57132352A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61210662A (en) * 1985-01-22 1986-09-18 フエアチヤイルド セミコンダクタ コ−ポレ−シヨン Semiconductor structural body
JPS62154777A (en) * 1985-12-27 1987-07-09 Toshiba Corp Semiconductor device
JPS63204628A (en) * 1987-02-19 1988-08-24 Nec Corp Semiconductor integrated circuit device
EP0324459A2 (en) * 1988-01-14 1989-07-19 Fujitsu Limited Semiconductor integrated circuit having CMOS inverter

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61210662A (en) * 1985-01-22 1986-09-18 フエアチヤイルド セミコンダクタ コ−ポレ−シヨン Semiconductor structural body
JPS62154777A (en) * 1985-12-27 1987-07-09 Toshiba Corp Semiconductor device
JPS63204628A (en) * 1987-02-19 1988-08-24 Nec Corp Semiconductor integrated circuit device
EP0324459A2 (en) * 1988-01-14 1989-07-19 Fujitsu Limited Semiconductor integrated circuit having CMOS inverter

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