JPS564259A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS564259A
JPS564259A JP7919179A JP7919179A JPS564259A JP S564259 A JPS564259 A JP S564259A JP 7919179 A JP7919179 A JP 7919179A JP 7919179 A JP7919179 A JP 7919179A JP S564259 A JPS564259 A JP S564259A
Authority
JP
Japan
Prior art keywords
frame part
plate section
main frame
accessory
dam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7919179A
Other languages
Japanese (ja)
Inventor
Kazuo Shimizu
Akiro Hoshi
Hidetoshi Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7919179A priority Critical patent/JPS564259A/en
Publication of JPS564259A publication Critical patent/JPS564259A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To enable the leaving of an accessory frame part of a single line type semiconductor device with a lead frame until the use of the device and attain enough strength, by providing a thin plate section which can be broken off by manual bending, on the connecting portion of the accessory frame part which extends orthogonally to the main frame part of the lead frame. CONSTITUTION:A lead frame 3 for a single line type semiconductor device is composed of plural leads 2, a tab 4, a dam 8, main frame parts 6 located on both the sides, etc. Each main frame part is provided with an accessory frame part 7 which extends perpendicularly to the main frame part to reinforce it. The section of the accessory frame part 7 coupled to the main frame part 6 consists of a thick plate section 13 whose width is small and whose thickness is equal to that of the main frame part 6 and with a thin plate section 12 which is integrated with the thick plate section 13 and whose width is large. A circuit element 5 is mounted on the tab 4 and connected to the leads 2 through wires 14. Resin is molded inside the dam 8. After that, the dam 8 and the thick plate section 13 of the accessory frame part 7 are cut off. As a result, the accessory frame part 7 is left in the form of the thin plate section 12 until the use of the device to attain enough strength.
JP7919179A 1979-06-25 1979-06-25 Lead frame Pending JPS564259A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7919179A JPS564259A (en) 1979-06-25 1979-06-25 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7919179A JPS564259A (en) 1979-06-25 1979-06-25 Lead frame

Publications (1)

Publication Number Publication Date
JPS564259A true JPS564259A (en) 1981-01-17

Family

ID=13683077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7919179A Pending JPS564259A (en) 1979-06-25 1979-06-25 Lead frame

Country Status (1)

Country Link
JP (1) JPS564259A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6464244A (en) * 1987-09-03 1989-03-10 Kyushu Nippon Electric Lead frame

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037362A (en) * 1973-08-06 1975-04-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037362A (en) * 1973-08-06 1975-04-08

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6464244A (en) * 1987-09-03 1989-03-10 Kyushu Nippon Electric Lead frame
JPH0530305B2 (en) * 1987-09-03 1993-05-07 Kyushu Nippon Electric

Similar Documents

Publication Publication Date Title
JPS57147260A (en) Manufacture of resin-sealed semiconductor device and lead frame used therefor
JPS55163868A (en) Lead frame and semiconductor device using the same
JPS564259A (en) Lead frame
JPS5211767A (en) Semiconductor device
JPS55146951A (en) Lead frame
JPS5379381A (en) Production of resin seal type semiconductor device and lead frame used forthe same
JPS55107252A (en) Manufacture of semiconductor device
JPS56158462A (en) Lead frame for single inline semiconductor device
JPS56122154A (en) Semiconductor device
JPS5455169A (en) Semiconductor device
JPS51129177A (en) Resin hook type semi conductor device
JPS57172757A (en) Manufacture of semiconductor device
JPS55146952A (en) Lead frame
JPS5347749A (en) Microwave integrated circuit device
JPS52101451A (en) Semiconductor breaker
JPS55127032A (en) Plastic molded type semiconductor device
JPS52146183A (en) Structure for semiconductor integrated circuit
JPS5360577A (en) Semiconductor device
JPS5626446A (en) Semiconductor device
JPS5369595A (en) Ceramic resonator
JPS54101265A (en) Semiconductor device
JPS5578558A (en) Manufacture of semiconductor integrated circuit
JPS5376728A (en) Microwave circuit
JPS5710954A (en) Semiconductor device
JPS55103752A (en) Electronic component