JPS5530360A - Jet type solder bath - Google Patents

Jet type solder bath

Info

Publication number
JPS5530360A
JPS5530360A JP10355078A JP10355078A JPS5530360A JP S5530360 A JPS5530360 A JP S5530360A JP 10355078 A JP10355078 A JP 10355078A JP 10355078 A JP10355078 A JP 10355078A JP S5530360 A JPS5530360 A JP S5530360A
Authority
JP
Japan
Prior art keywords
vessel
solder
soldering
pool
molten solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10355078A
Other languages
Japanese (ja)
Inventor
Shuji Takeshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP10355078A priority Critical patent/JPS5530360A/en
Publication of JPS5530360A publication Critical patent/JPS5530360A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)

Abstract

PURPOSE:To let soldering of good quality to be performed without formation of oxide films and decrease in solder liquid level by an independently providing a soldering vessel within a pool vessel of molten solder and providing a jet device which supplies molten solder in the pool vessel to the opening part at the top end thereof. CONSTITUTION:A soldering vessel 4 which has a top end opening 4a above the liquid level 2a of the molten solder in a pool vessel 1 and a jet device 7 which supplies the molten solder 2 in the pool vessel to the soldering vessel 4 through the top opening 4a are provided in the pool vessel 1 of molten solder. Thereby, the solder 2 supplied to the soldering vessel 4 from the jet device 7 overflows and returns into the pool vessel 1 and is circulated like the arrow a. As a result, the level 2b of the solder 2 in the vessel 4 is always overfloating and since the contact with air is short, no oxide films are formed and the solder remains always fresh.
JP10355078A 1978-08-24 1978-08-24 Jet type solder bath Pending JPS5530360A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10355078A JPS5530360A (en) 1978-08-24 1978-08-24 Jet type solder bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10355078A JPS5530360A (en) 1978-08-24 1978-08-24 Jet type solder bath

Publications (1)

Publication Number Publication Date
JPS5530360A true JPS5530360A (en) 1980-03-04

Family

ID=14356923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10355078A Pending JPS5530360A (en) 1978-08-24 1978-08-24 Jet type solder bath

Country Status (1)

Country Link
JP (1) JPS5530360A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63157494A (en) * 1986-12-22 1988-06-30 ムネカタ株式会社 Soldering apparatus
JPH01113169A (en) * 1987-10-23 1989-05-01 Tokin Corp Method for soldering pin terminal of electronic part

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63157494A (en) * 1986-12-22 1988-06-30 ムネカタ株式会社 Soldering apparatus
JPH01113169A (en) * 1987-10-23 1989-05-01 Tokin Corp Method for soldering pin terminal of electronic part

Similar Documents

Publication Publication Date Title
ES485838A1 (en) Apparatus for cleaning surfaces having an upright orientation
JPS5530360A (en) Jet type solder bath
JPS53144265A (en) Etching device
JPS54100955A (en) Solder equipment
JPS57191637A (en) Treatment of silver halide photographic material
JPS5519959A (en) Cooling wing
JPS5623371A (en) Soldering device
JPS54119194A (en) Electric discharge processing device
JPS536204A (en) Scum removing apparatus
JPS54129770A (en) Lamp
JPS5231106A (en) Preparation of strands
JPS5562154A (en) Hot dipping unit
JPS5233143A (en) Compressive molten bath method by industive heat way
JPS5640267A (en) Pretinning method for flat lead
JPS5739193A (en) Continuous plating apparatus
JPS522075A (en) Apparatus for washing the bottom of automobile
JPS53106603A (en) Treating apparatus for rh degassing
FR2436188A1 (en) Oxygen lance for steel converter - has detachable nozzle plate inserted in lance so that bottom edge of lance is lower than bottom edge of plate
JPS5250600A (en) Making method for small dielectric loss electromagnetic material
JPS5237219A (en) Steel sylinder type liquid tank with frp bottom
JPS56281A (en) Sulfide coloring of copper or copper plated plate
JPS52141988A (en) Oceanic replenishment means
JPS572654A (en) Honeyed "umeboshi" (japanese pickled plum)
JPS6440169A (en) Automatic soldering device
JPS5690912A (en) Method of sucking and expelling desiliconization slag