JPS5516725A - Soldering device - Google Patents

Soldering device

Info

Publication number
JPS5516725A
JPS5516725A JP8841978A JP8841978A JPS5516725A JP S5516725 A JPS5516725 A JP S5516725A JP 8841978 A JP8841978 A JP 8841978A JP 8841978 A JP8841978 A JP 8841978A JP S5516725 A JPS5516725 A JP S5516725A
Authority
JP
Japan
Prior art keywords
solder
article
plate
wave
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8841978A
Other languages
Japanese (ja)
Inventor
Shigeshi Yoshinaga
Masahiro Iwana
Hisato Hishikawa
Sadayasu Kira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8841978A priority Critical patent/JPS5516725A/en
Publication of JPS5516725A publication Critical patent/JPS5516725A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To exactly solder an article to be soldered by providing a solder flow guide plate to thereby obtain flat solder wave inclined in reverse direction to the article. CONSTITUTION:Solder in a solder tank 6 is fed by a drive pump 1 through a solder nozzle 2 to flow on a solder flow guide plate 3 obliguely connected to the nozzle 2. An article 5 to be soldered such as a printed board or the like is fed in reverse direction to the solder flow for soldering the article 5. The plate 3 provides flat solder wave in this case. The solder flown on the plate 3 flows to a shield plate 4 for preventing turbulent flow and back to the solder tank 6. The plate 3 may also have a step 8 on the midway thereof to solder the article on the way of the solder wave and further smoothen the solder wave. A heater 7 is provided underneath the plate 3 for preventing jet solder from lowering at its temperature. This device thus can exactly separate solder for preferably soldered article.
JP8841978A 1978-07-21 1978-07-21 Soldering device Pending JPS5516725A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8841978A JPS5516725A (en) 1978-07-21 1978-07-21 Soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8841978A JPS5516725A (en) 1978-07-21 1978-07-21 Soldering device

Publications (1)

Publication Number Publication Date
JPS5516725A true JPS5516725A (en) 1980-02-05

Family

ID=13942258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8841978A Pending JPS5516725A (en) 1978-07-21 1978-07-21 Soldering device

Country Status (1)

Country Link
JP (1) JPS5516725A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63210615A (en) * 1987-02-26 1988-09-01 Tokyo Keiki Co Ltd Magnetic azimuth system
US4773583A (en) * 1985-08-19 1988-09-27 Tamura Kaken Co., Ltd. Soldering device
JPS63174964U (en) * 1987-04-28 1988-11-14

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4773583A (en) * 1985-08-19 1988-09-27 Tamura Kaken Co., Ltd. Soldering device
JPS63210615A (en) * 1987-02-26 1988-09-01 Tokyo Keiki Co Ltd Magnetic azimuth system
JPH0554884B2 (en) * 1987-02-26 1993-08-13 Tokimec Inc
JPS63174964U (en) * 1987-04-28 1988-11-14

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