JPS56133849A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56133849A
JPS56133849A JP3771580A JP3771580A JPS56133849A JP S56133849 A JPS56133849 A JP S56133849A JP 3771580 A JP3771580 A JP 3771580A JP 3771580 A JP3771580 A JP 3771580A JP S56133849 A JPS56133849 A JP S56133849A
Authority
JP
Japan
Prior art keywords
wiring
difference
insulating material
level
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3771580A
Other languages
Japanese (ja)
Inventor
Toru Maekawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3771580A priority Critical patent/JPS56133849A/en
Publication of JPS56133849A publication Critical patent/JPS56133849A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To prevent disconnection in metal wiring by a method wherein a metal wiring pattern is vertically and horizontally made wide in a portion with difference in level in providing metal wiring on an insulating material having a portion with difference in level on a semiconductor substrate. CONSTITUTION:When providing Al wiring 2 on an insulating material 1 where a thick portion 1a and a thin portion 1b coexist, the patterning of the Al wiring 2 is provided in such a way that a region with width W' which is large than the width W of the wiring 2 and with length V' which is larger than the length of the portion 1c with difference in level is formed in the region covering the portion 1c on the insulating material 1. Even if the portion P is etched during the process of patterning in such a manner that etching progresses toward an (N) direction because the photoresist 5 is thin, the region R W' wide and V' long is sufficiently large. Thus the disconnection of Al wiring will not occur.
JP3771580A 1980-03-24 1980-03-24 Semiconductor device Pending JPS56133849A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3771580A JPS56133849A (en) 1980-03-24 1980-03-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3771580A JPS56133849A (en) 1980-03-24 1980-03-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56133849A true JPS56133849A (en) 1981-10-20

Family

ID=12505206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3771580A Pending JPS56133849A (en) 1980-03-24 1980-03-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56133849A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090847U (en) * 1983-11-25 1985-06-21 関西日本電気株式会社 semiconductor pellets

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090847U (en) * 1983-11-25 1985-06-21 関西日本電気株式会社 semiconductor pellets

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