ES2006071A6 - Cladding of substrates with thick metal circuit patterns - Google Patents

Cladding of substrates with thick metal circuit patterns

Info

Publication number
ES2006071A6
ES2006071A6 ES8800312A ES8800312A ES2006071A6 ES 2006071 A6 ES2006071 A6 ES 2006071A6 ES 8800312 A ES8800312 A ES 8800312A ES 8800312 A ES8800312 A ES 8800312A ES 2006071 A6 ES2006071 A6 ES 2006071A6
Authority
ES
Spain
Prior art keywords
cladding
substrates
circuit patterns
thick metal
metal circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8800312A
Other languages
Spanish (es)
Inventor
Robert Lawrence
Richard N Leyden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of ES2006071A6 publication Critical patent/ES2006071A6/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

A method for forming a circuit on a surface of an insulating substrate (10) comprises the steps of adhering Angstroms thick metallization (16) to the surface of the insulating substrate, placing conductive material (24) on the metallization through a photoresist pattern (20) of the circuit, stripping the resist pattern from the substrate, and removing the metallization not covered by the circuit of the conductive material by use of the conductive material as a resist.
ES8800312A 1987-02-05 1988-02-04 Cladding of substrates with thick metal circuit patterns Expired ES2006071A6 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1094587A 1987-02-05 1987-02-05

Publications (1)

Publication Number Publication Date
ES2006071A6 true ES2006071A6 (en) 1989-04-01

Family

ID=21748157

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8800312A Expired ES2006071A6 (en) 1987-02-05 1988-02-04 Cladding of substrates with thick metal circuit patterns

Country Status (4)

Country Link
JP (1) JPH01502228A (en)
ES (1) ES2006071A6 (en)
IL (1) IL85197A0 (en)
WO (1) WO1988005990A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GR880100623A (en) * 1988-09-19 1990-10-31 Hughes Aircraft Co Cladding of substrates with thick metal circuit patterns
US4964945A (en) * 1988-12-09 1990-10-23 Minnesota Mining And Manufacturing Company Lift off patterning process on a flexible substrate

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7105133A (en) * 1970-04-21 1971-10-25
DE2655997A1 (en) * 1976-01-21 1977-07-28 Ibm Printed circuit prodn. system - uses thick conducting foil applied to substrate, covered with conductor network and overlaps etched away
FR2425790A1 (en) * 1978-05-08 1979-12-07 Limours Const Meca Elect El Printed circuit mfr. involving copper deposition - on electrically conducting support varnish only where necessary to form circuit
US4444848A (en) * 1982-01-04 1984-04-24 Western Electric Co., Inc. Adherent metal coatings on rubber-modified epoxy resin surfaces
JPS59215790A (en) * 1983-05-23 1984-12-05 マルイ工業株式会社 Method of producing printed circuit board
US4606788A (en) * 1984-04-12 1986-08-19 Moran Peter L Methods of and apparatus for forming conductive patterns on a substrate
JPS61185994A (en) * 1985-02-13 1986-08-19 信越化学工業株式会社 Substrate for heatproof flexible printed interconnection andmanufacture thereof

Also Published As

Publication number Publication date
JPH01502228A (en) 1989-08-03
IL85197A0 (en) 1988-07-31
WO1988005990A1 (en) 1988-08-11

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19990301