JPS56101760A - Formation of package of semiconductors - Google Patents
Formation of package of semiconductorsInfo
- Publication number
- JPS56101760A JPS56101760A JP517680A JP517680A JPS56101760A JP S56101760 A JPS56101760 A JP S56101760A JP 517680 A JP517680 A JP 517680A JP 517680 A JP517680 A JP 517680A JP S56101760 A JPS56101760 A JP S56101760A
- Authority
- JP
- Japan
- Prior art keywords
- molds
- lead frame
- integrating
- recess
- planar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Abstract
PURPOSE:To conduct an excellent sealing of the package of the semiconductors by heating two planar molded members having recess for containing a semiconductor by mating in integrating molds, then interposing a lead frame therebetween, pressing to mate them and thereby preventing the production of flash. CONSTITUTION:The lead frame 4 is interposed between the integrating molds 9 and 9', the planar molded member 3 is disposed in the recess 17 of the integrating molds 9 in the state that the mating surfaces 16 of the member 3 are brought into contact with the lead frame 4, a heater guide hole 19 passed through the recess 17' of the molds 9' is perforated on one side of the mold 9' in the state that the part 18 making contact with the lead frame is retained on the one side surface of the mold 9', the heater 20 is inserted from the hole 19, the planar molded momber 3' is so disposed as not to contact therewith, heated, and the heater 20 is removed, and then the members are confronted integrally and heated by planar molde member pressing machines 12, 12'. Since the peripheries of the planar molded members are completely closed in this manner, it can prevent the production of flash.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP517680A JPS56101760A (en) | 1980-01-18 | 1980-01-18 | Formation of package of semiconductors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP517680A JPS56101760A (en) | 1980-01-18 | 1980-01-18 | Formation of package of semiconductors |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56101760A true JPS56101760A (en) | 1981-08-14 |
JPS6138862B2 JPS6138862B2 (en) | 1986-09-01 |
Family
ID=11603922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP517680A Granted JPS56101760A (en) | 1980-01-18 | 1980-01-18 | Formation of package of semiconductors |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56101760A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4680617A (en) * | 1984-05-23 | 1987-07-14 | Ross Milton I | Encapsulated electronic circuit device, and method and apparatus for making same |
US4872825A (en) * | 1984-05-23 | 1989-10-10 | Ross Milton I | Method and apparatus for making encapsulated electronic circuit devices |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH076687Y2 (en) * | 1989-01-17 | 1995-02-15 | 三木プーリ株式会社 | Brake device for motor |
-
1980
- 1980-01-18 JP JP517680A patent/JPS56101760A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4680617A (en) * | 1984-05-23 | 1987-07-14 | Ross Milton I | Encapsulated electronic circuit device, and method and apparatus for making same |
US4872825A (en) * | 1984-05-23 | 1989-10-10 | Ross Milton I | Method and apparatus for making encapsulated electronic circuit devices |
Also Published As
Publication number | Publication date |
---|---|
JPS6138862B2 (en) | 1986-09-01 |
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