JPS5587462A - Integrated circuit package - Google Patents
Integrated circuit packageInfo
- Publication number
- JPS5587462A JPS5587462A JP16401878A JP16401878A JPS5587462A JP S5587462 A JPS5587462 A JP S5587462A JP 16401878 A JP16401878 A JP 16401878A JP 16401878 A JP16401878 A JP 16401878A JP S5587462 A JPS5587462 A JP S5587462A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- earth
- ceramic
- terminals
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To reduce cross-talk caused by interference between conductive pattern and lead terminal by forming earth lead terminal connected to back earth conductive plate and allowing the said terminal to exist between lead terminals connected to signal line.
CONSTITUTION: Earth conductive plate 11 and ceramic substrate with square hole 12 are adhered on the rear side of integrated circuit package 10. Conductive patterns 13aW13d are established on substrate 12 and lead terminals 14aW14d are brazed to each of them. All parts other than the ceramic are plated with Au. Conductive pattern 13a is also formed on the external surface of the ceramic and the internal surface of square hole, and connected to earth conductive plate 11. Other conductive patterns are formed only on ceramic substrate, connecting terminals 14b, 14c to signal lines. Terminal 14a diminishes mutual interference between terminals 14b and 14c. In addition, if the terminal 14a is connected to earthing line 15, it will exist between microstrip lines 16, 17 of the signal line, so that it will contribute to cross- talk reduction.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16401878A JPS5587462A (en) | 1978-12-25 | 1978-12-25 | Integrated circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16401878A JPS5587462A (en) | 1978-12-25 | 1978-12-25 | Integrated circuit package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5587462A true JPS5587462A (en) | 1980-07-02 |
Family
ID=15785213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16401878A Pending JPS5587462A (en) | 1978-12-25 | 1978-12-25 | Integrated circuit package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5587462A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57154861A (en) * | 1981-03-20 | 1982-09-24 | Hitachi Ltd | Package |
| JPS58170843U (en) * | 1982-05-10 | 1983-11-15 | 株式会社日立製作所 | Packages for integrated circuits |
| US4514749A (en) * | 1983-01-18 | 1985-04-30 | At&T Bell Laboratories | VLSI Chip with ground shielding |
| JPS6063947U (en) * | 1983-10-08 | 1985-05-07 | 沖電気工業株式会社 | Semiconductor integrated circuit container |
| JPS61182247A (en) * | 1985-02-08 | 1986-08-14 | Nippon Telegr & Teleph Corp <Ntt> | Ic package |
| JPS61234055A (en) * | 1985-04-10 | 1986-10-18 | Fujitsu Ltd | Semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5025176A (en) * | 1973-05-19 | 1975-03-17 |
-
1978
- 1978-12-25 JP JP16401878A patent/JPS5587462A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5025176A (en) * | 1973-05-19 | 1975-03-17 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57154861A (en) * | 1981-03-20 | 1982-09-24 | Hitachi Ltd | Package |
| JPS58170843U (en) * | 1982-05-10 | 1983-11-15 | 株式会社日立製作所 | Packages for integrated circuits |
| US4514749A (en) * | 1983-01-18 | 1985-04-30 | At&T Bell Laboratories | VLSI Chip with ground shielding |
| JPS6063947U (en) * | 1983-10-08 | 1985-05-07 | 沖電気工業株式会社 | Semiconductor integrated circuit container |
| JPS61182247A (en) * | 1985-02-08 | 1986-08-14 | Nippon Telegr & Teleph Corp <Ntt> | Ic package |
| JPS61234055A (en) * | 1985-04-10 | 1986-10-18 | Fujitsu Ltd | Semiconductor device |
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