USD266073S - Heat releasing plate for mounting semiconductor components - Google Patents
Heat releasing plate for mounting semiconductor components Download PDFInfo
- Publication number
- USD266073S USD266073S US06/154,974 US15497480F USD266073S US D266073 S USD266073 S US D266073S US 15497480 F US15497480 F US 15497480F US D266073 S USD266073 S US D266073S
- Authority
- US
- United States
- Prior art keywords
- semiconductor components
- heat releasing
- mounting semiconductor
- releasing plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front view of the heat releasing plate for mounting semi-conductor components showing new design;
FIG. 2 is a plan view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof; and
FIG. 6 is a sectional view taken on line 6--6 of FIG. 1.
Claims (1)
- The ornamental design for heat releasing plate for mounting semiconductor components, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW69300604 | 1980-03-31 | ||
| TW6930604 | 1980-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD266073S true USD266073S (en) | 1982-09-07 |
Family
ID=69844193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US06/154,974 Expired - Lifetime USD266073S (en) | 1980-03-31 | 1980-05-30 | Heat releasing plate for mounting semiconductor components |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD266073S (en) |
-
1980
- 1980-05-30 US US06/154,974 patent/USD266073S/en not_active Expired - Lifetime
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