USD266071S - Heat releasing plate for mounting semiconductor components - Google Patents
Heat releasing plate for mounting semiconductor components Download PDFInfo
- Publication number
- USD266071S USD266071S US06/154,972 US15497280F USD266071S US D266071 S USD266071 S US D266071S US 15497280 F US15497280 F US 15497280F US D266071 S USD266071 S US D266071S
- Authority
- US
- United States
- Prior art keywords
- semiconductor components
- heat releasing
- mounting semiconductor
- releasing plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front view of the heat releasing plate for mounting semi-conductor components showing the new design;
FIG. 2 is a plan view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a right side view thereof; and
FIG. 5 is a sectional view taken on line 5--5 of FIG. 2.
Claims (1)
- The ornamental design for heat releasing plate for mounting semiconductor components, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW6930618 | 1980-04-01 | ||
TW69300618 | 1980-04-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD266071S true USD266071S (en) | 1982-09-07 |
Family
ID=69844191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/154,972 Expired - Lifetime USD266071S (en) | 1980-04-01 | 1980-05-30 | Heat releasing plate for mounting semiconductor components |
Country Status (1)
Country | Link |
---|---|
US (1) | USD266071S (en) |
-
1980
- 1980-05-30 US US06/154,972 patent/USD266071S/en not_active Expired - Lifetime
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USD319629S (en) | Semiconductor substrate with conducting pattern | |
USD289594S (en) | Plate | |
USD318461S (en) | Semi-conductor mounting substrate | |
USD287276S (en) | Fan plate | |
USD275177S (en) | Mounting clip | |
USD271197S (en) | Combined integrated circuit package carrier and socket assembly | |
USD266082S (en) | Heat releasing plate for mounting semiconductor components | |
USD266081S (en) | Heat releasing plate for mounting semiconductor components | |
USD266080S (en) | Heat releasing plate for mounting semiconductor components | |
USD278198S (en) | Combined plate and glass holder | |
USD266075S (en) | Heat releasing plate for mounting semiconductor components | |
USD266071S (en) | Heat releasing plate for mounting semiconductor components | |
USD266074S (en) | Heat releasing plate for mounting semiconductor components | |
USD266070S (en) | Heat releasing plate for mounting semiconductor components | |
USD277748S (en) | Pinned-extrusion heat sink for electronic devices | |
USD266069S (en) | Heat releasing plate for mounting semiconductor components | |
USD266077S (en) | Heat releasing plate for mounting semiconductor components | |
USD266073S (en) | Heat releasing plate for mounting semiconductor components | |
USD266065S (en) | Heat releasing plate for mounting semiconductor components | |
USD278197S (en) | Combined plate and glass holder | |
USD266072S (en) | Heat releasing plate for mounting semiconductor components | |
USD266068S (en) | Heat releasing plate for mounting semiconductor components | |
USD266067S (en) | Heat releasing plate for mounting semiconductor components | |
USD266076S (en) | Heat releasing plate for mounting semiconductor components | |
USD266078S (en) | Heat releasing plate for mounting semiconductor components |