USD266071S - Heat releasing plate for mounting semiconductor components - Google Patents
Heat releasing plate for mounting semiconductor components Download PDFInfo
- Publication number
- USD266071S USD266071S US06/154,972 US15497280F USD266071S US D266071 S USD266071 S US D266071S US 15497280 F US15497280 F US 15497280F US D266071 S USD266071 S US D266071S
- Authority
- US
- United States
- Prior art keywords
- semiconductor components
- heat releasing
- mounting semiconductor
- releasing plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front view of the heat releasing plate for mounting semi-conductor components showing the new design;
FIG. 2 is a plan view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a right side view thereof; and
FIG. 5 is a sectional view taken on line 5--5 of FIG. 2.
Claims (1)
- The ornamental design for heat releasing plate for mounting semiconductor components, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW6930618 | 1980-04-01 | ||
| TW69300618 | 1980-04-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD266071S true USD266071S (en) | 1982-09-07 |
Family
ID=69844191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US06/154,972 Expired - Lifetime USD266071S (en) | 1980-04-01 | 1980-05-30 | Heat releasing plate for mounting semiconductor components |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD266071S (en) |
-
1980
- 1980-05-30 US US06/154,972 patent/USD266071S/en not_active Expired - Lifetime
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