JPS5550650A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5550650A JPS5550650A JP12381778A JP12381778A JPS5550650A JP S5550650 A JPS5550650 A JP S5550650A JP 12381778 A JP12381778 A JP 12381778A JP 12381778 A JP12381778 A JP 12381778A JP S5550650 A JPS5550650 A JP S5550650A
- Authority
- JP
- Japan
- Prior art keywords
- chips
- bonded
- electric insulating
- member material
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To improve thermal equilibrium among a plurality of semiconductor chips, by thermally uniting a plurality of electrode leads, to which the said chips are each bonded, by means of a member material of electric insulating property and of high thermal conductivity.
CONSTITUTION: The electrodes 3W8 of two transistor chips 1, 2 are bonded to the ceramics 14 of a combining member material of high thermal conductivity and electric insulating properties. Thus, thermal equilibrium can excellently be maintained.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12381778A JPS5550650A (en) | 1978-10-06 | 1978-10-06 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12381778A JPS5550650A (en) | 1978-10-06 | 1978-10-06 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5550650A true JPS5550650A (en) | 1980-04-12 |
Family
ID=14870070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12381778A Pending JPS5550650A (en) | 1978-10-06 | 1978-10-06 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5550650A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58500187A (en) * | 1981-02-07 | 1983-02-03 | モトロ−ラ・インコ−ポレ−テツド | High current package with multi-level leads |
-
1978
- 1978-10-06 JP JP12381778A patent/JPS5550650A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58500187A (en) * | 1981-02-07 | 1983-02-03 | モトロ−ラ・インコ−ポレ−テツド | High current package with multi-level leads |
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