JPS5752154A - Cooler for semiconductor - Google Patents

Cooler for semiconductor

Info

Publication number
JPS5752154A
JPS5752154A JP12726280A JP12726280A JPS5752154A JP S5752154 A JPS5752154 A JP S5752154A JP 12726280 A JP12726280 A JP 12726280A JP 12726280 A JP12726280 A JP 12726280A JP S5752154 A JPS5752154 A JP S5752154A
Authority
JP
Japan
Prior art keywords
cooling
clamps
insulating material
sides
high thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12726280A
Other languages
Japanese (ja)
Inventor
Teigo Okada
Hisao Sonobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12726280A priority Critical patent/JPS5752154A/en
Publication of JPS5752154A publication Critical patent/JPS5752154A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To enhance the cooling performance of a semiconductor element by contacting a cooling piece made of high thermal conductive insulating material with each of both sides of the element and clamping it with clamps. CONSTITUTION:After cooling pieces 3 made of high thermal conductive insulating material, e.g., ceramic or beryllia porcelain or the like containing mainly SiC are contacted at both sides of a semiconductor substrate 1 connected to a power terminal 2, are clamped with clamps 4 and are secured. In this manner, the cooling pieces are electrically insulated, and are reduced in size and stable cooling performance can be always obtained.
JP12726280A 1980-09-16 1980-09-16 Cooler for semiconductor Pending JPS5752154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12726280A JPS5752154A (en) 1980-09-16 1980-09-16 Cooler for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12726280A JPS5752154A (en) 1980-09-16 1980-09-16 Cooler for semiconductor

Publications (1)

Publication Number Publication Date
JPS5752154A true JPS5752154A (en) 1982-03-27

Family

ID=14955678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12726280A Pending JPS5752154A (en) 1980-09-16 1980-09-16 Cooler for semiconductor

Country Status (1)

Country Link
JP (1) JPS5752154A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62108560A (en) * 1985-11-06 1987-05-19 Internatl Rectifier Corp Japan Ltd Water-cooling fin for semiconductor device
JPS62108559A (en) * 1985-11-06 1987-05-19 Internatl Rectifier Corp Japan Ltd Water-cooling fin for semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62108560A (en) * 1985-11-06 1987-05-19 Internatl Rectifier Corp Japan Ltd Water-cooling fin for semiconductor device
JPS62108559A (en) * 1985-11-06 1987-05-19 Internatl Rectifier Corp Japan Ltd Water-cooling fin for semiconductor device

Similar Documents

Publication Publication Date Title
GB2060435B (en) Highly thermal conductive and electrical insulating substrate
EP0153737A3 (en) Circuit substrate having high thermal conductivity
EP0279601A3 (en) Electrical conductor arrangement
JPS5752154A (en) Cooler for semiconductor
JPS54124678A (en) Lead frame
JPS5544743A (en) Manufacture of semiconductor device
GB971703A (en) A semiconductor device
JPS5735363A (en) Semiconductor device
JPS5550650A (en) Semiconductor device
JPS5293271A (en) Semiconductor device and its manufacture for that device
JPS53124072A (en) Semiconductor device
JPS5787588A (en) Heat pipe
JPS6441188A (en) Manufacture of heating element
JPS57128934A (en) Electric component
JPS57164540A (en) Electric device
JPS57164504A (en) Superconductive coil device
JPS54162483A (en) Semiconductor device
JPS57184239A (en) Substrate for semiconductor device
JPS5372465A (en) Mounting method of semiconductor to radiator
JPS53109489A (en) Semiconductor pressure convertor
Philippe Modern Dry Transformers for High and Low Voltage
JPS57184250A (en) Field-effect type semiconductor circuit element
JPS5610941A (en) Semiconductor device
JPS54115070A (en) Manufacture for semiconductor element
ES475731A1 (en) Temperature sensor