JPS554990A - Composite integrated circuit device - Google Patents
Composite integrated circuit deviceInfo
- Publication number
- JPS554990A JPS554990A JP7840978A JP7840978A JPS554990A JP S554990 A JPS554990 A JP S554990A JP 7840978 A JP7840978 A JP 7840978A JP 7840978 A JP7840978 A JP 7840978A JP S554990 A JPS554990 A JP S554990A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- case
- integrated circuit
- composite integrated
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To protect transistors, etc. from stress and vibration caused by temperature change, by fixing a base plate, on which transistors and diodes, at the bottom of a case, and covering it with soft resin, and further filling the top of this with resin whose coefficient of expansion is close to that of the case.
CONSTITUTION: Circuit base plate 11, on which discrete component 12, pellet component 12, lead terminal 14, etc. are mounted, is fixed to the bottom of case 15. The top of this is covered with resin 16. Further, the top of this is filled with resin 17, whose coefficient of expansion is nearly the same as that of the case, and thereby a composite integrated circuit is formed. By this, resin 17 can absorbe stress and vibration caused by temperature change so that the device is protected from cracking and stripping and from humidity.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7840978A JPS554990A (en) | 1978-06-27 | 1978-06-27 | Composite integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7840978A JPS554990A (en) | 1978-06-27 | 1978-06-27 | Composite integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS554990A true JPS554990A (en) | 1980-01-14 |
Family
ID=13661231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7840978A Pending JPS554990A (en) | 1978-06-27 | 1978-06-27 | Composite integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS554990A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6072122A (en) * | 1995-05-31 | 2000-06-06 | Nec Corporation | Multi-chip packaging structure having chips sealably mounted on opposing surfaces of substrates |
JP6567241B1 (en) * | 2018-06-12 | 2019-08-28 | 三菱電機株式会社 | Power semiconductor module and power conversion device |
WO2019239615A1 (en) * | 2018-06-12 | 2019-12-19 | 三菱電機株式会社 | Power semiconductor module and power conversion device |
-
1978
- 1978-06-27 JP JP7840978A patent/JPS554990A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6072122A (en) * | 1995-05-31 | 2000-06-06 | Nec Corporation | Multi-chip packaging structure having chips sealably mounted on opposing surfaces of substrates |
JP6567241B1 (en) * | 2018-06-12 | 2019-08-28 | 三菱電機株式会社 | Power semiconductor module and power conversion device |
WO2019239615A1 (en) * | 2018-06-12 | 2019-12-19 | 三菱電機株式会社 | Power semiconductor module and power conversion device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5237721A (en) | Semiconductor integrated circuit | |
JPS57188858A (en) | Plastic molded type semiconductor device | |
JPS5429984A (en) | Protector for semiconductor device | |
JPS53105970A (en) | Assembling method for semiconductor device | |
JPS554990A (en) | Composite integrated circuit device | |
JPS5211767A (en) | Semiconductor device | |
JPS554917A (en) | Resin-enclosed semi-conductor device | |
JPS55158653A (en) | Hybrid integrated circuit device | |
JPS5280780A (en) | Semiconductor device | |
JPS5419658A (en) | Semiconductor device | |
JPS55117254A (en) | Fabrication of electronic device | |
JPS5433663A (en) | Lead frame and electronic parts providing it | |
JPS54149582A (en) | Manufacture of resin-sealed semiconductor device | |
JPS5552245A (en) | Semiconductor integrated circuit device | |
JPS5662346A (en) | Lead frame and semicondcutor device having thereof | |
JPS6473650A (en) | Semiconductor device | |
JPS54109381A (en) | Resin mold semiconductor device | |
JPS5419661A (en) | Electronic component device | |
JPS5414641A (en) | Magnetic bubble memory device | |
JPS5571051A (en) | Semiconductor device | |
JPS53112667A (en) | Plastic sealing semiconductor device and its manufacture | |
JPS52102582A (en) | Electronic parts | |
JPS641262A (en) | Electronic device and manufacture thereof | |
JPS5471573A (en) | Resin package method of electronic parts | |
JPS53105989A (en) | Semiconductor device |