JPS54109381A - Resin mold semiconductor device - Google Patents
Resin mold semiconductor deviceInfo
- Publication number
- JPS54109381A JPS54109381A JP1540278A JP1540278A JPS54109381A JP S54109381 A JPS54109381 A JP S54109381A JP 1540278 A JP1540278 A JP 1540278A JP 1540278 A JP1540278 A JP 1540278A JP S54109381 A JPS54109381 A JP S54109381A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin mold
- mold semiconductor
- pellet
- metal tab
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To perform resin sealing by elminating the stress exerted from the metal tab side to the semiconductor element.
CONSTITUTION: Almost the full circumference of the metal tab and the semiconductor pellet is covered with silicon rubber having flexibility and the external side is coated with epoxy resin having mechanical strength. With this construction, the pellet can be protected from mechanical damage, and the device, for example, withstanding the temperature cycle of -50 to 150°C, can be established.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1540278A JPS54109381A (en) | 1978-02-15 | 1978-02-15 | Resin mold semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1540278A JPS54109381A (en) | 1978-02-15 | 1978-02-15 | Resin mold semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54109381A true JPS54109381A (en) | 1979-08-27 |
Family
ID=11887726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1540278A Pending JPS54109381A (en) | 1978-02-15 | 1978-02-15 | Resin mold semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54109381A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5558055A (en) * | 1978-10-24 | 1980-04-30 | Suisanchiyou Chiyoukan | Treating of euphausiacea |
JPS57133509U (en) * | 1981-02-14 | 1982-08-20 | ||
JPH04307760A (en) * | 1991-04-04 | 1992-10-29 | Mitsubishi Electric Corp | Resin-sealed semiconductor device |
-
1978
- 1978-02-15 JP JP1540278A patent/JPS54109381A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5558055A (en) * | 1978-10-24 | 1980-04-30 | Suisanchiyou Chiyoukan | Treating of euphausiacea |
JPS6113773B2 (en) * | 1978-10-24 | 1986-04-15 | Suisancho Chokan | |
JPS57133509U (en) * | 1981-02-14 | 1982-08-20 | ||
JPH04307760A (en) * | 1991-04-04 | 1992-10-29 | Mitsubishi Electric Corp | Resin-sealed semiconductor device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS54109381A (en) | Resin mold semiconductor device | |
JPS52156560A (en) | Semiconductor device and its production | |
JPS53299A (en) | Epoxy resin composition | |
JPS53105175A (en) | Lead frame for resin sealing semiconductor device | |
JPS5411160A (en) | Coating resin composition | |
JPS5521124A (en) | Lead frame | |
JPS5516439A (en) | Resin seal semiconductor device | |
JPS5429974A (en) | Semiconductor device of resin sealing type | |
JPS54161271A (en) | Semiconductor device | |
JPS51144180A (en) | Resin sealing method of semiconductor unit | |
JPS54579A (en) | Resin seal semiconductor device | |
JPS5338974A (en) | Manufacture of semiconductor device | |
JPS53118371A (en) | Manufacture of semiconductor device | |
JPS5243940A (en) | Bellows | |
JPS54149582A (en) | Manufacture of resin-sealed semiconductor device | |
JPS557853A (en) | Heat-resistant resin composition | |
JPS5471573A (en) | Resin package method of electronic parts | |
JPS5251109A (en) | Anticorrosive pipe and its manufacturing method | |
JPS53120373A (en) | Molded type element | |
JPS53110370A (en) | Semiconductor device | |
JPS5247100A (en) | Epoxy resin compositions having good wet adhesiveness | |
JPS5443470A (en) | Manufacture of semiconductor device | |
JPS5536974A (en) | Resin sealed type semiconductor device | |
JPS52106679A (en) | Manufacturing method of semioconductor device | |
JPS5274914A (en) | Pipe joint |