JPS54109381A - Resin mold semiconductor device - Google Patents

Resin mold semiconductor device

Info

Publication number
JPS54109381A
JPS54109381A JP1540278A JP1540278A JPS54109381A JP S54109381 A JPS54109381 A JP S54109381A JP 1540278 A JP1540278 A JP 1540278A JP 1540278 A JP1540278 A JP 1540278A JP S54109381 A JPS54109381 A JP S54109381A
Authority
JP
Japan
Prior art keywords
semiconductor device
resin mold
mold semiconductor
pellet
metal tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1540278A
Other languages
Japanese (ja)
Inventor
Eiichiro Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1540278A priority Critical patent/JPS54109381A/en
Publication of JPS54109381A publication Critical patent/JPS54109381A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To perform resin sealing by elminating the stress exerted from the metal tab side to the semiconductor element.
CONSTITUTION: Almost the full circumference of the metal tab and the semiconductor pellet is covered with silicon rubber having flexibility and the external side is coated with epoxy resin having mechanical strength. With this construction, the pellet can be protected from mechanical damage, and the device, for example, withstanding the temperature cycle of -50 to 150°C, can be established.
COPYRIGHT: (C)1979,JPO&Japio
JP1540278A 1978-02-15 1978-02-15 Resin mold semiconductor device Pending JPS54109381A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1540278A JPS54109381A (en) 1978-02-15 1978-02-15 Resin mold semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1540278A JPS54109381A (en) 1978-02-15 1978-02-15 Resin mold semiconductor device

Publications (1)

Publication Number Publication Date
JPS54109381A true JPS54109381A (en) 1979-08-27

Family

ID=11887726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1540278A Pending JPS54109381A (en) 1978-02-15 1978-02-15 Resin mold semiconductor device

Country Status (1)

Country Link
JP (1) JPS54109381A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5558055A (en) * 1978-10-24 1980-04-30 Suisanchiyou Chiyoukan Treating of euphausiacea
JPS57133509U (en) * 1981-02-14 1982-08-20
JPH04307760A (en) * 1991-04-04 1992-10-29 Mitsubishi Electric Corp Resin-sealed semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5558055A (en) * 1978-10-24 1980-04-30 Suisanchiyou Chiyoukan Treating of euphausiacea
JPS6113773B2 (en) * 1978-10-24 1986-04-15 Suisancho Chokan
JPS57133509U (en) * 1981-02-14 1982-08-20
JPH04307760A (en) * 1991-04-04 1992-10-29 Mitsubishi Electric Corp Resin-sealed semiconductor device

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