JPS5548930A - Automatic wafer cutting method - Google Patents
Automatic wafer cutting methodInfo
- Publication number
- JPS5548930A JPS5548930A JP12037178A JP12037178A JPS5548930A JP S5548930 A JPS5548930 A JP S5548930A JP 12037178 A JP12037178 A JP 12037178A JP 12037178 A JP12037178 A JP 12037178A JP S5548930 A JPS5548930 A JP S5548930A
- Authority
- JP
- Japan
- Prior art keywords
- bar
- groove
- cutting
- roller
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/003—Multipurpose machines; Equipment therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE:To automate the processes from cutting to storing wafers by fitting a cutting blade into the groove on a crystal bar; cutting them while turning it round with the use of a roller; simultaneously rolling a plurarity of wafers on a slanted table in order to store them in a casette. CONSTITUTION:A crystal bar 13 of which the exterior surface has been finished with etching is placed between a grinding wheel 4 for cutting a groove and a roller for turning the crystal bar round. The crystal bar is pressed to the grinding wheel 4 while giving the bar a spinning motion with the roller, and a groove having the depth required is cut into the whole circumference of the bar 13. The bar 13 with the groove is pushed out over the grinding wheel 4 and led to a slanted table 8. Then the bar is pressed in such a manner that a multiple blade edge 9 reciprocating in a direction perpendicular to the slanting table can fit into the groove of the bar 13, then a spinning motion is given to the bar by a roller 10, so that the bar is amputated at that position. Simultaneously, a plurarity of cut wafers are rolled on the slanted table 8 and received by a cassette 12 for containing them. Therefore, it can automatically be conducted wituout the help of man power from cutting the specified number of wafers out of the crystal bar to storing them up in a cassette.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12037178A JPS5548930A (en) | 1978-10-02 | 1978-10-02 | Automatic wafer cutting method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12037178A JPS5548930A (en) | 1978-10-02 | 1978-10-02 | Automatic wafer cutting method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5548930A true JPS5548930A (en) | 1980-04-08 |
JPS5640500B2 JPS5640500B2 (en) | 1981-09-21 |
Family
ID=14784535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12037178A Granted JPS5548930A (en) | 1978-10-02 | 1978-10-02 | Automatic wafer cutting method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5548930A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7100864B1 (en) * | 2021-12-23 | 2022-07-14 | 有限会社サクセス | Manufacturing method and equipment for semiconductor crystal wafers |
TWI795330B (en) * | 2021-12-23 | 2023-03-01 | 日商薩克瑟斯有限公司 | Manufacturing method and manufacturing apparatus of semiconductor crystal wafer |
-
1978
- 1978-10-02 JP JP12037178A patent/JPS5548930A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7100864B1 (en) * | 2021-12-23 | 2022-07-14 | 有限会社サクセス | Manufacturing method and equipment for semiconductor crystal wafers |
TWI795330B (en) * | 2021-12-23 | 2023-03-01 | 日商薩克瑟斯有限公司 | Manufacturing method and manufacturing apparatus of semiconductor crystal wafer |
WO2023119703A1 (en) * | 2021-12-23 | 2023-06-29 | 有限会社サクセス | Method and apparatus for producing semiconductor crystal wafer |
Also Published As
Publication number | Publication date |
---|---|
JPS5640500B2 (en) | 1981-09-21 |
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