JPS5548930A - Automatic wafer cutting method - Google Patents

Automatic wafer cutting method

Info

Publication number
JPS5548930A
JPS5548930A JP12037178A JP12037178A JPS5548930A JP S5548930 A JPS5548930 A JP S5548930A JP 12037178 A JP12037178 A JP 12037178A JP 12037178 A JP12037178 A JP 12037178A JP S5548930 A JPS5548930 A JP S5548930A
Authority
JP
Japan
Prior art keywords
bar
groove
cutting
roller
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12037178A
Other languages
Japanese (ja)
Other versions
JPS5640500B2 (en
Inventor
Junji Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP12037178A priority Critical patent/JPS5548930A/en
Publication of JPS5548930A publication Critical patent/JPS5548930A/en
Publication of JPS5640500B2 publication Critical patent/JPS5640500B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003—Multipurpose machines; Equipment therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To automate the processes from cutting to storing wafers by fitting a cutting blade into the groove on a crystal bar; cutting them while turning it round with the use of a roller; simultaneously rolling a plurarity of wafers on a slanted table in order to store them in a casette. CONSTITUTION:A crystal bar 13 of which the exterior surface has been finished with etching is placed between a grinding wheel 4 for cutting a groove and a roller for turning the crystal bar round. The crystal bar is pressed to the grinding wheel 4 while giving the bar a spinning motion with the roller, and a groove having the depth required is cut into the whole circumference of the bar 13. The bar 13 with the groove is pushed out over the grinding wheel 4 and led to a slanted table 8. Then the bar is pressed in such a manner that a multiple blade edge 9 reciprocating in a direction perpendicular to the slanting table can fit into the groove of the bar 13, then a spinning motion is given to the bar by a roller 10, so that the bar is amputated at that position. Simultaneously, a plurarity of cut wafers are rolled on the slanted table 8 and received by a cassette 12 for containing them. Therefore, it can automatically be conducted wituout the help of man power from cutting the specified number of wafers out of the crystal bar to storing them up in a cassette.
JP12037178A 1978-10-02 1978-10-02 Automatic wafer cutting method Granted JPS5548930A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12037178A JPS5548930A (en) 1978-10-02 1978-10-02 Automatic wafer cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12037178A JPS5548930A (en) 1978-10-02 1978-10-02 Automatic wafer cutting method

Publications (2)

Publication Number Publication Date
JPS5548930A true JPS5548930A (en) 1980-04-08
JPS5640500B2 JPS5640500B2 (en) 1981-09-21

Family

ID=14784535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12037178A Granted JPS5548930A (en) 1978-10-02 1978-10-02 Automatic wafer cutting method

Country Status (1)

Country Link
JP (1) JPS5548930A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7100864B1 (en) * 2021-12-23 2022-07-14 有限会社サクセス Manufacturing method and equipment for semiconductor crystal wafers
TWI795330B (en) * 2021-12-23 2023-03-01 日商薩克瑟斯有限公司 Manufacturing method and manufacturing apparatus of semiconductor crystal wafer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7100864B1 (en) * 2021-12-23 2022-07-14 有限会社サクセス Manufacturing method and equipment for semiconductor crystal wafers
TWI795330B (en) * 2021-12-23 2023-03-01 日商薩克瑟斯有限公司 Manufacturing method and manufacturing apparatus of semiconductor crystal wafer
WO2023119703A1 (en) * 2021-12-23 2023-06-29 有限会社サクセス Method and apparatus for producing semiconductor crystal wafer

Also Published As

Publication number Publication date
JPS5640500B2 (en) 1981-09-21

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